• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.5
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• pp.285-297
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• 2023

The effects of aging treatment sequence, specifically pre-aging and post-aging, on the microstructure and mechanical properties of Al-Zn-Mg-Cu aluminum alloys has been studied in comparison to symmetrically rolled specimens. In symmetrically rolled specimens, a straight-band precipitation distribution was observed, whereas asymmetrically rolled specimens exhibited a curved-band microstructure of fine precipitates. Notably, the asymmetrically rolled specimens displayed higher strengths. In the case of post-aging, the aging process occurred after rolling, and the dislocations generated during rolling acted as nucleation sites for precipitates during aging. This resulted in the formation of fine precipitates, contributing to improved mechanical properties compared to symmetric rolling. To enhance strength of the Al-Zn-Mg-Cu aluminum alloys, asymmetric rolling proves to be more effective than symmetric rolling, with post-aging showing greater efficacy than pre-aging.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2431-2437
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• 2014

In this study, Ni, Ni-Cu and Ni/Cu catalysts were deposited onto C-fiber textiles via the electrophoretic deposition method, and the growth characteristics of carbon nanofibers on the deposited catalyst/C-fiber textiles were investigated. The catalyst deposition onto C-fiber textiles was accomplished by immersing the C-fiber textiles into Ni or Ni-Cu mixed solutions, producing the substrate by post-deposition of Ni onto C-fiber textiles with pre-deposited Cu, and passing it through a gas mixture of $N_2$, $H_2$ and $C_2H_4$ at $700^{\circ}C$ to synthesize carbon nanofibers. For analysis of the characteristics of the synthesized carbon nanofibers and the deposition pattern of catalysts, SEM, EDS, BET, XRD, Raman and XPS analysis were conducted. It was found that the amount of catalyst deposited and the ratio of Ni deposition in the Ni-Cu mixed solution increased with an increasing voltage for electrophoretic deposition. In the case of post-deposition of Ni catalyst onto substrates with pre-deposited Cu, both bimetallic catalyst and carbon nanofibers with a high level of crystallizability were produced. Carbon nanofibers yielded with the catalyst prepared in Ni and Ni-Cu mixed solutions showed a Y-shaped morphology.

• Journal of the Korean Society of Mechanical Technology
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• v.20 no.6
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• pp.818-823
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• 2018

In this study, the effect of pre-aging treatment for inhibition of natural aging of Al-4.8Zn-1.3Mg alloy by extrusion process was investigated. Firstly, the as-cast microstructure of Al-4.8Zn-1.3Mg alloy billet and its evolution during homogenization($460^{\circ}C$, $4h+510^{\circ}C$, 5h) were investigated by means of optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), hardness analysis. The as-cast microstructures of Al-4.8Zn-1.3Mg alloy reveal $Mg_2Zn$, $Al_5Cu$, $Al_{13}Cu$ formed between dendrities. After homogenization, MgZn, $Al_4Cu$, $Al_{13}Cu$ phases precipitated into the matrix. In addition, standard deviation of homogenized billet was improved than as-cast billet from 2.62 to 0.99. According to pre-aging($100^{\circ}C$, 1h) Al-4.8Zn-1.3Mg alloy by extrusion process, yield strength and tensile strength deviation improved more than condition by natural aging.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2519-2522
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• 2014

Recently, the observation of the electrocatalytic behavior of individual nanoparticles (NPs) by electrochemical amplification method has been reported. For example, the Iridium oxide ($IrO_x$) NP collision on the Pt UME was observed via electrocatalytic water oxidation. However, the bare Pt UME had poor reproducibility for the observation of NP collision signal and required an inconvenient surface pre-treatment for the usage. In this manuscript, we has been investigated other metal electrode such as Cu UME for the reproducible data analysis and convenient use. The $IrO_x$ NP collision was successively observed on the bare Cu UME and the reproducibility in collision frequency was improved comparing with previous case using the $NaBH_4$ pre-treated Pt UME. Also, the adhesion coefficient between NP and the Cu UME was studied for better understanding of the single NP collision system.

• Progress in Superconductivity and Cryogenics
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• v.21 no.3
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• pp.27-31
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• 2019

Large grain YBCO bulk superconductors are fabricated by the top-seeded melt growth (TSMG) or top-seeded infiltration growth (TSIG) method. Both growth methods use at least one of $YBa_2Cu_3O_{7-{\delta}}$, $Y_2BaCuO_5$, $BaCuO_3$ pre-reacted precursor powders. However, the synthesis of the pre-reacted powders includes multiple calcination runs which are cost-bearing and time-consuming. In this work, we report the successful growth of single-domain YBCO bulk superconductors directly by using the powder compact that has been pressed from the mixture of $Y_2O_3$, $BaCuO_3$ and CuO powders without any intermediate grinding step. Single-domain YBCO bulk superconductor has been also prepared by using $Y_2O_3$, $BaO_2$ and CuO powders without intermediate grinding step. Investigations on the trapped magnetic field and microstructure of the melt-processed specimen show that the elimination of the repeated processes of calcinations and pulverization has hardly affected on the crystal growth and the magnetic properties of the grown YBCO bulk superconductors. However, it is thought that the presence of residual carbon affects on the size of Y211 particles in melt-processed YBCO bulk superconductor.

• Current Photovoltaic Research
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• v.7 no.1
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• pp.1-8
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• 2019

The $Cu(In,Ga)Se_2$ (CIGS) thin film obtained by two-step process (metal deposition and Se annealing) has a rough surface morphology and many voids at the CIGS/Mo interface. To solve the problem a precursor that contains Se was employer by depositing a (In,Se)/(Cu,Ga) stacked layer. We devised a two-step annealing (vacuum pre-annealing and Se annealing) for the precursor because direct annealing of the precursor in Se environment resulted in the small grains with unwanted demarcation between stacked layers. After vacuum pre-annealing up to $500^{\circ}C$ the CIGS film consisted of CIGS phase and secondary phases including $In_4Se_3$, InSe, and $Cu_9(In,Ga)_4$. The secondary phases were completely converted to CIGS phase by a subsequent Se annealing. A void-free CIGS/Mo interface was obtained by the two-step annealing process. Especially, the CIGS film prepared by vacuum annealing $450^{\circ}C$ and subsequent Se annealing $550^{\circ}C$ showed a densely-packed grains with smooth surface, well-aligned bamboo grains on the top of the film, little voids in the film, and also little voids at the CIGS/Mo interface. The smooth surface enhanced the cell performance due to the increase of shunt resistance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.364-365
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• 2005

This paper report nanotribological behavior between Si tip and Cu wafer surfaces which was treated various concentration of $H_2O_2$. This experimental approach has proven atomic level insight into Cu CMP. It has been used to study interfacial friction and adhesion force between Si tip and Cu wafer surfaces in air by atomic force microscopy (AFM). Adhesion force of Cu surfaces which was pre-cleaned in diluted HF solution was lager than Cu oxide surfaces. Adhesion force of Cu oxide surface was saturated around 7 nN. Slope of normal force vs lateral signal was increased as increasing concentration of $H_2O_2$ and it was saturated around 24. Friction force of Cu oxide was lager than Cu.