• 한국산림과학회지
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• 제51권1호
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• pp.41-50
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• 1981

본연구(本硏究)의 목적(目的)은 현재(現在) 증량제(增量剤)로 사용(使用)하고 있는 도인소맥분(導人小麥粉)을 국내(国內)에서 값싸게 생산(生産)할 수 있는 다른 증량제(增量剤)로 대체(代替)키 위한 가능성(可能性)을 규명하는데 있다. 증량재료(増量材料)는 옥촉서간(玉蜀黍幹), 송수피(松樹皮), 소맥(小麥), 리기다송엽(松葉), 잣나무엽(葉) 및 목분말(木粉末)을 택(択)해서 $103{\pm}2^{\circ}C$에서 24시간(時間)동안 전건(全乾)시킨 다음 60~100mesh로 분쇄(粉碎)하였다. 증량방법(増量方法)에 있어서 요소수지(尿素樹脂)는 10, 20, 30, 50%로 증량(増量)하였으며 수용성석탄산수지(水溶性石炭酸樹脂)는 5, 10, 15, 20%로 증량(増量)하였다. 본연구(本硏究)에서 얻은 결론(結論)은 다음과 같이 요약(要約)할 수 있다. 1. 요소수지(尿素樹脂)에 있어서 상태접착력(常態接着力)은 소맥분(小麥粉)이 가장 양호(良好)하였다. 2. 요소수지(尿素樹脂)에 있어서 내수접착력(耐水接着力)은 10%와 20%증량(増量)의 경우 소맥분(小麥粉)보다 목분(木粉)이 더 양호(良好)하였으나 이들 사이의 유의적(有意的)인 차이(差異)는 없었다. 3. 석탄산수지(石炭酸樹脂)의 상태접착력(常態接着力)에 있어서 5%증량((増量)의 경우 잣나무엽분(葉粉)이 가장 양호(良好)하였으나 10, 15, 20% 증량((増量)의 경우는 소맥분(小麥粉)이 가장 양호(良好)하였다. 4. 석탄산수지(石炭酸樹脂)의 내수접착력(耐水接着力)에 있어서는 소맥분(小麥粉)이 가장 양호(良好)하였다. 5. 석탄산수지(石炭酸樹脂)의 상태(常態) 및 내수접착력(耐水接着力)에 있어서 15와 20%증량((増量)의 경우 옥촉서간(玉蜀黍幹)이 소맥분(小麥粉) 다음으로 양호(良好)한 결과(結果)를 나타내었다.

• Carbon letters
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• 제14권2호
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• pp.110-116
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• 2013

This study investigated a developed process for producing a composite bipolar plate having excellent conductivity by using coal tar pitch and phenol resin as binders. We used a pressing method to prepare a compact of graphite powder mixed with binders. Resistivity of the impregnated compact was observed as heat treatment temperature was increased. It was observed that pore sizes of the GCTP samples increased as the heat treatment temperature increased. There was not a great difference between the flexural strengths of GCTP-IM and CPR-IM as the heat treatment temperature was increased. The resistivity of GPR700-IM, heat treated at $700^{\circ}C$ using phenolic resin as a binder, was $4829{\mu}{\Omega}{\cdot}cm$ which was best value in this study. In addition, it is expected that with the appropriate selection of carbon powder and further optimization of process we can produce a composite bipolar plate which has excellent properties.

• Natural Product Sciences
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• 제6권3호
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• pp.151-153
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• 2000

Kampilla is an important herbal drug of indigenous system of medicine. Fruit dust of Mallotus philippensis Muell-Arg constitutes the genuine drug Kampilla. However, due to limited distribution of this plant and its high medicinal value, the drug is heavily adulterated with the cheaper substances. Hence the present study was undertaken to evaluate both the authentic and market samples. The drug consists of resin glands and trichomes. Resin glands are lined by a delicate yellowish thin membrane and bear a pore at the tip. Quantitative standards of the drug powder showed 82.50% yield in total ash while alcohol soluble extract of market and authentic sample exhibit 0.97% and 3.458% respectively. The main adulterant noticed in the market sample is brick powder. Simple methods are suggested to identify the genuine drug.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.374-375
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• 2006

Three-dimensional artificial crystals with periodicity corresponding to terahertz wave lengths were fabricated by self-assembling monosized metal spherical particles. The metal crystals were weakly sintered to utilize them as templates. The metal templates were inverted to air spheres crystal embedded in dielectric resin though infiltration and etching. The resulting resin inverted crystals clearly presented the photonic stop gaps within terahertz wave region and the frequencies of the gaps were confirmed to agree well with calculation by plane wave expansion method.

• Carbon letters
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• 제7권4호
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• pp.241-244
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• 2006

Carbon/Carbon composite was been manufactured by the technology of warmer-molding process of clutter chopped carbon fiber, using phenolic resin as an adhesive. The degree of graphitization, the microstructure and the friction properties were studied. The results show that the clutter chopped carbon fiber fully scatter in the Carbon/Carbon composite and the degree of graphitization of phenolic resin can reach up to 86.2%, this matrix carbon can form the continuous and stable graphitic thin film on the friction surface during braking process so that the composite has fine friction properties and low wear rate.

• ETRI Journal
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• 제32권2호
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• pp.342-344
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• 2010

A novel, maskless, low-volume bumping material, called solder bump maker, which is composed of a resin and low-melting-point solder powder, has been developed. The resin features no distinct chemical reactions preventing the rheological coalescence of the solder, a deoxidation of the oxide layer on the solder powder for wetting on the pad at the solder melting point, and no major weight loss caused by out-gassing. With these characteristics, the solder was successfully wetted onto a metal pad and formed a uniform solder bump array with pitches of 120 ${\mu}m$ and 150 ${\mu}m$.

• 한국기계연구소 소보
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• 통권18호
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• pp.163-168
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• 1988

Impregnation of molten thermoplastic resin into continuous unidirectional fiber bundles was investigated. The degree of impregnation is defined as the ratio between the number of impregnated fibers and the total number of fibers of a bundle. The degree of impregnation was modeled as a function of time, impregnation pressure, temperature and tow size assuming the radial inward flow through the fiber bundle is governed by the Darcy's law. The permeability was assumed to be constant. Experiments were performed to evaluate the validity of the medel. Today's T300 graphite fiber bundles and Polyetheretherketone(PEEK) resin was used. A fiber bundle and resin powder were put into a mold and pressure and temperature were applied. After a predetermined time, the sample was taken out and microphotographs of the cross-section were taken. From the microphotographs, the number of impregnated fibers was counted and then the degree of impregnation was determined. Experiments were also performed for different tow sizes. Good agreements were found between the model and the experiments rendering a confidence in the model.

• Journal of the Korean Wood Science and Technology
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• 제31권3호
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• pp.17-23
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• 2003

As a fundamental study of developing sawdust board from thinning softwood logs from three species (Pinus densiflora S. et Z., Larix leptolepis G. and Pinus koraiensis S. et Z.), this study examined the effect of board density and resin content on physical and mechanical properties of sawdust board. As the board density increase, thickness swelling, bending strength, and Brinell hardness increased while water absorption decreased. With increasing the resin content, the bending strength and hardness increased while water absorption and thickness swelling decreased. The board made of L. leptolepis was slightly low in its water absorption, and the one made of P. koraiensis was a little high in its bending strength, while there was no definite difference between each kind of trees in their hardness values.

• 한국세라믹학회지
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• 제34권8호
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• pp.797-802
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• 1997

The use of carbon materials in mechanical components such as bearings, seals, and bushings that do not require lubricants is increasing rapidly. This paper reports on establishing the optimal condition for resin-bonded carbon materials. We fixed the content ratio of materials, which include graphite powder and diatomite as a lubricant modifier and a friction modifier, respectably, with resin used as a bonding material. We then produced bushings using hot-pressing within the temperature range of resin curing. The properties of bushing, the friction coefficient, wear rate and the mechanical strengths are discussed in relation to the content of respective materials, with correlation of friction coefficient and sliding distance. Finally, we examined the friction coefficient changes according to the applied load on bushing and the friction coefficient changes according to contact speed of bushing.

• ETRI Journal
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• 제33권4호
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• pp.637-640
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• 2011

A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 ${\mu}m$ in one direction.