• Title/Summary/Keyword: post-silicon

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Acoustic Performance Enhancement in PVDF Speakers by Using Buckled Nanospring Carbon Nanotubes

  • Ham, Sora;Lee, Yun Jae;Kim, Jung-Hyuk;Kim, Sung-Ryong;Choi, Won Kook
    • Journal of Sensor Science and Technology
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    • v.28 no.6
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    • pp.360-365
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    • 2019
  • A polyvinylidene fluoride (PVDF)-based film speaker is successfully fabricated with enhanced bass sound by incorporating buckled nanospring carbon nanotubes (NS-CNTs) as fillers. Various concentrations up to 1-7 wt% of uniformly dispersed buckled NS-CNTs are loaded to increase the beta (β)-phase fraction, crystallinity, and dielectric constant of the speaker, and this results in the bass part enhancement of about 19 dB full scale (dBFS) at 7 wt% filler loading of the piezoelectric film speaker.

A study on wafer surface passivation properties using hydrogenated amorphous silicon thin film (수소화된 비정질 실리콘 박막을 이용한 웨이퍼 패시베이션 특성 연구)

  • Lee, Seungjik;Kim, Kihyung;Oh, Donghae;Ahn, Hwanggi
    • 한국신재생에너지학회:학술대회논문집
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    • 2010.11a
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    • pp.46.1-46.1
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    • 2010
  • Surface passivation of crystalline silicon(c-Si) surface with a-Si:H thin films has been investigated by using quasi-steady-state photo conductance(QSSPC) measurements. Analyzing the influence of a-Si:H film thickness, process gas ratio, deposition temperature and post annealing temperature on the passivation properties of c-Si, we optimized the passivation conditions at the substrate temperature of $200-250^{\circ}C$. Best surface passivation has been obtained by post-deposition annealing of a-Si:H film layer. Post annealing around the deposition temperature was sufficient to improve the surface passivation for silicon substrates. We obtained effective carrier lifetimes above 5.5 ms on average.

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The variation of C-V characteristics of thermal oxide grown on SiC wafer with the electrode formation condition (SiC 열산화막의 Electrode형성조건에 따른 C-V특성 변화)

  • Kang, M.J.;Bahng, W.;Song, G.H.;Kim, N.K.;Kim, S.C.;Seo, K.S.;Kim, H.W.;Kim, E.D.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.354-357
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    • 2002
  • Thermally grown gate oxide on 4H-SiC wafer was investigated. The oxide layers were grown at l150$^{\circ}C$ varying the carrier gas and post activation annealing conditions. Capacitance-Voltage(C-V) characteristic curves were obtained and compared using various gate electrode such as Al, Ni and poly-Si. The interface trap density can be reduced by using post oxidation annealing process in Ar atmosphere. All of the samples which were not performed a post oxidation annealing process show negative oxide effective charge. The negative oxide effective charges may come from oxygen radical. After the post oxidation annealing, the oxygen radicals fixed and the effective oxide charge become positive. The effective oxide charge is negative even in the annealed sample when we use poly silicon gate. Poly silicon layer was dope by POCl$_3$ process. The oxide layer may be affected by P ions in poly silicon layer due to the high temperature of the POCl$_3$ doping process.

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Reaction Bonded Si3N4 from Si-Polysilazane Mixture (규소 고분자 복합체를 이용한 반응소결 질화규소)

  • Hong, Sung-Jin;Ahn, Hyo-Chang;Kim, Deug-Joong
    • Journal of the Korean Ceramic Society
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    • v.47 no.6
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    • pp.572-577
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    • 2010
  • Reaction-bonded $Si_3N_4$ has cost-reduction merit because inexpensive silicon powder was used as a start material. But its density was not so high enough to be used for structural materials. So the sintered reaction-bonded $Si_3N_4$techniques were developed to solve the low density problem. In this study the sintered reaction-bonded $Si_3N_4$ manufacturing method by using polymer precursor which recently attained significant interest owing to the good shaping and processing ability was proposed. The formations, properties of reaction-bonded $Si_3N_4$ from silicon and polysilazane mixture were investigated. High density reaction-bonded $Si_3N_4$ was manufactured from silicon and silicon-containing preceramic polymers and post-sintering technique. The mixtures of silicon powder and polysilazane were prepared and reaction sintered in $N_2$ atmosphere at $1350^{\circ}C$ and post-sintered at 1600~$1950^{\circ}C$. Density and phase were analyzed and correlated to the resulting material properties.

Study of Post Excimer Laser Annealing effect on Silicide Mediated Polycrystalline Silicon. (실리사이드 매개 결정화된 다결정 실리콘 박막의 후속 엑시머 레이저 어닐링 효과에 대한 연구)

  • Choo, Byoung-Kwon;Park, Seoung-Jin;Kim, Kyung-Ho;Son, Yong-Duck;Oh, Jae-Hwan;Choi, Jong-Hyun;Jang, Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.05a
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    • pp.173-176
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    • 2004
  • In this study we investigated post ELA(Excimer Laser Annealing) effect on SMC (Silicide Mediated Crystalization) poly-Si (Polycrystalline Silicon) to improve the characteristics of poly-Si. Combining SMC and XeCl ELA were used to crystallize the a-Si (amorphous Silicon) at various ELA energy density for LTPS (Low Temperature Polycrystalline Silicon). We fabricated the conventional SMC poly-Si with no SPC (Solid Phase Crystallization) phase using UV heating method[1] and irradiated excimer laser on SMC poly-Si, so called SMC-ELA poly-Si. After using post ELA we can get better surface morphology than conventional ELA poly-Si and enhance characteristics of SMC poly-Si. We also observed the threshold energy density regime in SMC-ELA poly-Si like conventional ELA poly-Si.

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Nanotexturing and Post-Etching for Diamond Wire Sawn Multicrystalline Silicon Solar Cell (다이아몬드 와이어에 의해 절단된 다결정 실리콘 태양전지의 나노텍스쳐링 및 후속 식각 연구)

  • Kim, Myeong-Hyun;Song, Jae-Won;Nam, Yoon-Ho;Kim, Dong-Hyung;Yu, Si-Young;Moon, Hwan-Gyun;Yoo, Bong-Young;Lee, Jung-Ho
    • Journal of the Korean institute of surface engineering
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    • v.49 no.3
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    • pp.301-306
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    • 2016
  • The effects of nanotexturing and post-etching on the reflection and quantum efficiency properties of diamond wire sawn (DWS) multicrystalline silicon (mc-Si) solar cell have been investigated. The chemical solutions, which are acidic etching solution (HF-$HNO_3$), metal assisted chemical etching (MAC etch) solutions ($AgNO_3$-HF-DI, HF-$H_2O_2$-DI) and post-etching solution (diluted KOH at $80^{\circ}C$), were used for micro- and nano-texturing at the surface of diamond wire sawn (DWS) mc-Si wafer. Experiments were performed with various post-etching time conditions in order to determine the optimized etching condition for solar cell. The reflectance of mc-Si wafer texturing with acidic etching solution showed a very high reflectance value of about 30% (w/o anti-reflection coating), which indicates the insufficient light absorption for solar cell. The formation of nano-texture on the surface of mc-Si contributed to the enhancement of light absorption. Also, post-etching time condition of 240 s was found adequate to the nano-texturing of mc-Si due to its high external quantum efficiency of about 30% at short wavelengths and high short circuit current density ($J_{sc}$) of $35.4mA/cm^2$.

The Effect of Si3N4 Addition on Nitriding and Post-Sintering Behavior of Silicon Powder Mixtures

  • Park, Young-Jo;Ko, Jae-Woong;Lee, Jae-Wook;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
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    • v.49 no.4
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    • pp.363-368
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    • 2012
  • Nitriding and post-sintering behavior of powder mixture compacts were investigated. As mixture compacts are different from simple Si compacts, the fabrication of a sintered body with a mixture composition has engineering implications. In this research, in specimens without a pore former, the extent of nitridation increased with $Si_3N_4$ content, while the highest extent of nitridation was measured in $Si_3N_4$-free composition when a pore former was added. Large pores made from the thermal decomposition of the pore former collapsed, and they were filled with a reaction product, reaction-bonded silicon nitride (RBSN) in the $Si_3N_4$-free specimen. On the other hand, pores from the decomposed pore former were retained in the $Si_3N_4$-added specimen. Introduction of small $Si_3N_4$ particles ($d_{50}=0.3{\mu}m$) into a powder compact consisting of large silicon particles ($d_{50}=7{\mu}m$) promoted close packing in the green body compact, and resulted in a stable strut structure after decomposition of the pore former. The local packing density of the strut structure depends on silicon to $Si_3N_4$ size ratio and affected both nitriding reaction kinetics and microstructure in the post-sintered body.

Fabrication of β-SiAlONs by a Reaction-Bonding Process Followed by Post-Sintering

  • Park, Young-Jo;Noh, Eun-Ah;Ko, Jae-Woong;Kim, Hai-Doo
    • Journal of the Korean Ceramic Society
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    • v.46 no.5
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    • pp.452-455
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    • 2009
  • A cost-effective route to synthesize $\beta$-SiAlONs from Si mixtures by reaction bonding followed by post-sintering was investigated. Three different z values, 0.45, 0.92 and 1.87, in $Si_{6-z}Al_zO_zN_{8-z}$ without excess liquid phase were selected to elucidate the mechanism of SiAlON formation and densification. For RBSN (reaction-bonded silicon nitride) specimens prior to post-sintering, nitridation rates of more than 90% were achieved by multistep heating to $1400^{\circ}C$ in flowing 5%$H_2$/95%$N_2$; residual Si was not detected by XRD analysis. An increase in density was acquired with increasing z values in post-sintered specimens, and this tendency was explained by the presence of higher amounts of transient liquid phase at larger z values. Measured z values from the synthesized $\beta$-SiAlONs were similar to the values calculated for the starting compositions. Slight deviations in z values between measurements and calculations were rationalized by a reasonable application of the characteristics of the nitriding and post-sintering processes.

A Study on Mechanism about Contaminant Accumulation of Insulator Surface (애자표면의 오손물 누적에 관한 메커니즘 연구)

  • Park, Jae-Jun
    • The Journal of Information Technology
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    • v.8 no.2
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    • pp.85-91
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    • 2005
  • We studied a pollution mechanism for simulation of contamination environment in industrial concentrated area of around a metropolitan that made to circulated flow in the chamber. In case of the virgin both side of EPDM or Silicon insulator, we confirmed that the pollution to much more than service insulator in the field. Also contamination of initial state of the virgin didn't falling in spite of physical outside factor easily. This study confirmed to that the silicon was too much accumulated pollution contrast to EPDM insulator from scatter(spray) point to regular interval position use the Kaolin contaminant in the chamber. There are effected to the hydrophobicity of polymer insulator due to the pollution. In ceramic insulator, we get to know that pollution is much more at the Post insulator with vertical than with horizontal setup insulator.

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Characterization of Silicon-Zinc-Oxide films by thermal annealing methods (열처리 방식에 따른 실리콘 산화아연 박막의 물성 분석)

  • Lee, Sang-Hyuk;Jun, Hyun-Sik;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.1151-1152
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    • 2015
  • Silicon zinc oxide (SZO) thin films were deposited via co-sputtering. Two kinds of post-treatment, furnace annealing and hot pressing, were carried out on the deposited SZO films. The effects of the post-treatment on the chemical bond and surface roughness of the deposited SZO films were analyzed as functions of the post-treatment conditions that were used. It was observed from the X-ray photoelectron spectroscopy (XPS) results that the amount of Si-O bonds in the SZO film drastically increased after the low-temperature furnace annealing. The experiment results showed that the hot pressing method would be favorable as it could improve the electrical characteristics of the SZO-TFTs.

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