• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.7
• /
• pp.724-728
• /
• 2004

This paper describes on RIE(Reactive Ion Etching) characteristics of 3C-SiC(Silicon Carbide) grown on Si(100) wafers. In this work, CHF$_3$ gas was used to form the polymer as a function of a side-wall for excellent anisotropy etching during the RIE process. The ranges of the etch rate were obtained from 60 $\AA$/min to 980 $\AA$/min according to the conditions such as working gas pressure, RF power, distance between electrodes and the $O_2$ addition ratio in working gas pressure. Under the condition such as 100 mTorr of working gas pressure, 200 W of RF power and 30 mm of the distance between electrodes, mesa structures with about 40 of the etch angle were formed, and the vertical structures could be improved with 50 % of $O_2$ addition ratio in reactive gas during the RIE process. As a result of the investigation, we know that it is possible to apply the RIE process of 3C-SiC using CHF$_3$ for the development of electronic parts and MEMS applications in harsh environments.

• Proceedings of the Korean Society of Dyers and Finishers Conference
• /
• 2009.03a
• /
• pp.14-20
• /
• 2009

Atmospheric pressure air plasma was applied for treatment of different kinds of natural bamboo fiber to improve their mechanical properties and surface characteristics, which are suitable for adhesion and dyeing. The tensile strength and Young modulus of bamboo fiber were significantly improved; SEM and AFM study show that the surface of fiber became cleaner and rougher after plasma treatment. Plasma treatment caused the cracking, removing of the protective skin of alkali-untreated fiber and etching to form a cleaner and rougher surface. The dyeability of both groups of bamboo fiber which are used for composite and textile purposes is significantly enhanced after treatment.

• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.16 no.6
• /
• pp.168-174
• /
• 2007

A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2009.08a
• /
• pp.110-110
• /
• 2009

• 한국전자현미경학회:학술대회논문집
• /
• 2003.11a
• /
• pp.47-48
• /
• 2003

• Polymer(Korea)
• /
• v.26 no.6
• /
• pp.718-727
• /
• 2002

In this work, an Ar+ beam was irradiated on carbon fiber surfaces to improve the interfacial shear strength (IFSS) of the resulting composites using an ion assisted reaction (IAR) method h single fiber pull-out test was executed to investigate the basic characteristics of the single Carbon fiber/matrix interface. Based on Greszczuk's geometrical model, the debonding force for pull-out of the fiber from the resins was discussed with the applied ion beam energy as a result, it was known that an ion beam treatment produced the functional groups on fiber surface and etching lines along the fiber axis direction, resulting in increasing the adhesion forces between fibers and matrix, which caused the improvement of the IFSS in a composite system. And, it was also found that the maximum IFSS was shown at 0.8 keV ion beam energy in this system.

• Proceedings of the KIEE Conference
• /
• 2011.07a
• /
• pp.1702-1703
• /
• 2011

MEMS 소자의 Wafer level Package 관련하여 Deep cavity를 가진 Cap Wafer와 Polymer bonding 중 cavity 단차로 인한 Polymer Patterning 및 접합 불량의 어려움을 극복할 수 있는 새로운 공정 flow를 제안하였다. Cavity를 형성할 때 사용하는 Si deep etching Mask인 기존의 Photoresist를 접합용 감광성 Polymer로 대체하고, cavity 형성 후, 별도의 추가 공정 없이 이 Polymer를 이용해 Wafer bonding을 진행하였다. 이를 통해 cavity 단차에 따른 문제를 해결함과 동시에 공정이 단순하고 제작 비용이 저렴하며, 신뢰성 있는 Wafer level Package를 구현하였다.

• Journal of the Korean Vacuum Society
• /
• v.6 no.4
• /
• pp.321-325
• /
• 1997

Recently, photosensitive color filters have received much attention for their use in the liquid crystal display (LCD) industry. It is well known that chemical and physical properties of polymer surfaces can be modified by special surface treatments. In this work, we have studied the polymer surfaces of LCD blue color filters which were exposed to the UV light during photolithography. A better understanding of the irradiated polymer surfaces is required for the subsequent processes such as plasma etching, ITO electrode deposition, etc. The surface analysis has been undertaken using secondary ion mass spectrometry (SIMS), x-ray photoelectron spectroscopy (XPS), and atomic force microscopy (AFM). A significant enrichment of the pigment component and roughening of surface with bubble-like feature have been observed at the modified polymer surface.

• Transactions on Electrical and Electronic Materials
• /
• v.16 no.2
• /
• pp.90-94
• /
• 2015

In this study, the characterizations of oxide contact hole etching are investigated with C₄F₈/O₂/Ar and CH₂F₂/C₄F₈/O₂/ Ar plasma. As the percent composition of C₄F₈ in a C₄F₈/O₂/Ar mixture increases, the amount of polymer deposited on the etched surface also increases because the C_xF_y polymer layer retards the reaction of oxygen atoms with PR. Adding CH₂F₂ into the C₄F₈/O₂/Ar plasma increases the etch rate of the oxide and the selectivity of oxide to PR. The profile of contact holes was close to 90°, and no visible residue was seen in the SEM image at a C₄F₈/(C₄F₈+O₂) ratio of 58%. The changes of chemical composition in the chamber were analyzed using optical emission spectroscopy, and the chemical reaction on the etched surface was investigated using X-ray photoelectron spectroscopy.

• Polymer(Korea)
• /
• v.25 no.2
• /
• pp.302-310
• /
• 2001

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.