• Macromolecular Research
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• v.12 no.3
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• pp.263-268
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• 2004

We have synthesized a water-soluble polyimide precursor, poly(amic acid) amine salt (PAD), from pyromellitic dianhydride (PMDA), 4,4'-oxydianiline, and N,N -dimethylethanolamine (DMEA) and have investigated in detail its properties with respect to the degree of salt formation (D$\_$sf/). The maximum value of D$\_$sf/ we obtained upon precipitation of the precursor solution into acetone was 79%. We synthesized a PAD having a D$\_$sf/ of 100% (PAD100) by the solid state drying of an organic solution. The precursors showed different solubility depending on the D$\_$sf/ to make up to 4 wt% solutions in water containing a small amount of DMEA. PAD100 is completely soluble in pure water. We investigated the imidization behavior of PAD in aqueous solution using various spectroscopic methods, which revealed that PAD 100 has faster imidization kinetics relative to that of the poly(amic acid)-type precursors. The resulting polyimide films prepared from an aqueous precursor solution possess almost similar physical and thermal properties as those prepared from N-methyl-2-pyrrolidone(NMP) solution. Therefore, we have demonstrated that PAD can be used as a water-based precursor of polyimide; this procedure avoids the use of toxic organic solvents, such as NMP.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.972-973
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• 2007

Relationships between field effect mobility and grain size on pentacene thin-film transistors with $polyimide/SiO_2$ gate dielectrics have been studied. 6 kinds of polyimide were used as surface treatment gate dielectric layer. Grain size of the pentacene thin film were between 5 and $30\;{\mu}m$ and depended on the polyimide. The field effect mobility were also depended on the polyimide and the those values were from 0.027 to $0.69\;cm^2/(Vs)$. The field effect mobility tends to increase with increasing the grain size. Precursor type polyimide containing polyamic acid show better mobility of $0.69\;cm^2/(Vs)$ than soluble type polyimide. Bias stress characteristics in air are discussed in the basis of the grain size.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.885-888
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• 2004

We have prepared and investigated the properties of photoinitiator-free photosensitive polyimide gate insulatos for organic thin-film transistors (OTFTs). The precursor was prepared from a dianhydride, 3,3',4,4'-Benzophenone tetracarboxylic dianhydride (BTDA) and novel aromatic diamine, 7-(3,5-diaminobenzoyloxy) coumarine (DA-CM). Photo-patternability of the polyimide precursor film and surface morphology of the films before and after photo-patterning process were investigated and negative pattern with a resolution of 50 ${\mu}m$ was obtained nicely. In addition, we have fabricated OTFTs with pentacene and photosensitive polyimide as a semiconductor and a gate insulator; respectively. According to the device geometry, the ${\mu}$, current modulation ratio and subthreshold swing of the devices were around 0.2${\sim}$0.4 $cm^2$/Vs, more than $10^5$ and around 3${\sim}$5 V/dec, respectively.

• Polymer(Korea)
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• v.25 no.2
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• pp.160-167
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• 2001

The various compositions of polyimide (PI)/polyamideimide (PAI) composites were prepared by heat treatment of the solvent cast PI precursors/PAI blends. The optical micrographs showed that a good compatibility was observed between poly(amic acid) (PAA) and PAI, but in the case of PAME/PAI mixtures, a phase separation apparently occurred due to the absence of ionic and/or H-bonding forces. Regardless of PI precursors, the similar tensile properties were observed. The tensile modulus of the composites were higher than that of the neat polyimide. The X-ray diffraction patterns of the composites showed that the chain rearrangement of PI was increased due to the plasticizing effect of PAI, which has lower glass transition temperature than that of PI, during thermal imidization process.

• Macromolecular Research
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• v.14 no.1
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• pp.1-33
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• 2006

Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.475-478
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• 2000

Maxwell displacement current(MDC) was generated when the area per molecule was about 140${\AA}$$^2$and 100${\AA}$$^2$. MDC were investigated in connection with monolayer compression cycles. It was found that the maximum of MDC appeared at the molecular area just before the initial rise of surface pressure in compression cycles. The absorption spectra of polyamic acid containing p-methoxyazobenzene in a mixture of N,N-dimethylacetamide(DMAc) and benzene(1:1 by volume) solution was induced photoisomerization by UV and visible light irradiation. The precursor LB film was heated in a vacuum dry oven at 120$^{\circ}C$ in order to convert it into the LB film of polyimide. The absorption spectra of LB films were also induced photoisomerization by UV and visible light irradiation.

• Macromolecular Research
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• v.15 no.6
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• pp.565-574
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• 2007

In this study, five representative, commercially available polymers, Ultem 1000 polyetherimide, Kapton polyimide, phenolic resin, polyacrylonitrile and cellulose acetate, were used to prepare pyrolyzed polymer membranes coated on a porous {\alpha}-alumina$ tube via inert pyrolysis for gas separation. Pyrolysis conditions (i.e., final temperature and thermal dwell time) of each polymer were determined using a thermogravimetric method coupled with real-time mass spectroscopy. The surface area and pore size distribution of the pyrolyzed materials derived from the polymers were estimated from the nitrogen adsorption/desorption isotherms. Pyrolyzed membranes from polymer precursors exhibited type I sorption behavior except cellulose acetate (type IV). The gas permeation of the carbon/{\alpha}-alumina$ tubular membranes was characterized using four gases: helium, carbon dioxide, oxygen and nitrogen. The polyetherimide, polyimide, and phenolic resin pyrolyzed polymer membranes showed typical molecular sieving gas permeation behavior, while membranes from polyacrylonitrile and cellulose acetate exhibited intermediate behavior between Knudsen diffusion and molecular sieving. Pyrolyzed membranes with molecular sieving behavior (e.g., polyetherimide, polyimide, and phenolic resin) had a $CO_2/N_2$ selectivity of greater than 15; however, the membranes from polyacrylonitrile and cellulose acetate with intermediate gas transport behavior had a selectivity slightly greater than unity due to their large pore size.

• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1063-1068
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• 2002

Polyimide/silica(PI/silica) hybrid materials having physical or chemical bonds between the PI and silica network were prepared using sol-gel process through hydrolysis and polycondensation of tetraethoxysilane with the polyamic Acid(PAA) or end-capped PAA solution. PAA solution was synthesized by ring opening reaction of pyromellitic dianhydride and oxydianiline monomers in dimethyl acetamide solution. End-capped PAA solution was synthesized by the addition of 3-aminopropyltriethoxysilane in PAA solution. PI/silica hybrid samples were characterized by infrared spectroscopy, differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, and tensile tester. It has been demonstrated that the properties of hybrid samples were affected by the silica content and the bond type between PI and silica.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.37-42
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• 2000

Copper thin films have been prepared by a metal organic chemical vapor deposition (MOCVD) technology on polyimide and TiN substrates. The Cu-MOCVD technology has advantages of the high deposition rate and the good step coverage compared with the conventional physical vapor deposition (PVD) technology in several industrial applications. The Cu films have been deposited with varying the experimental conditions of substrate temperatures and copper source vapor pressures. The films were annealed in a vacuum condition after the deposition, and the annealing effect on the electrical properties of the films was measured. The crystallinity and the microstructures of the films were observed by scanning electron microscopy (SEM), and the electrical resistivity was measured by 4-point probe. In the case of the Cu deposition on TiN substrate, the best electrical property of the films was measured for the samples prepared at 18$0^{\circ}C$. Very high deposition rate of the Cu film up to 250 nm/min was obtained on the polyimide substrate when the mixture of liquid and vapour precursor was used.

• Journal of the Korean Applied Science and Technology
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• v.17 no.4
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• pp.226-232
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• 2000

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, we have synthesized a polyamic acid(PAA), which is a precursor of the polyimide. To obtain the optimum conditions of polyamic acid alkylamine salt(PAAS) Langmuir-Blodgett(LB) film deposition, the ${\pi}-A$ isotherms were examined by varying subphase temperature, barrier moving speed and spreading amount of solution. Film formation was verified by measuring transfer ratio, absorption of UV/vis spectra and scanning electron microscope(SEM) images.