• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2011년도 추계학술논문집 1부
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• pp.364-366
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• 2011

Polyimide (PI) grafted magnesium hydroxide was synthesised and characterised by XRD, TGA, SEM analysis. XRD patterns of $PI/Mg(OH)_2$ carried the peaks due to $Mg(OH)_2$ with decreased intensity. The $CO_2$ adsorption capacity of $PI/Mg(OH)_2$ at $50^{\circ}C$ was found to be 14 wt% revealing chemisorption of $CO_2$ on $Mg(OH)_2$ which could be regenerated at higher temperatures.

• Macromolecular Research
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• 제12권1호
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• pp.38-45
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• 2004

A highly flexible polyimide (PI) was synthesized successfully from ethylene glycol bis(anhydrotrimellitate) (TMEG) and 1,3-bis(4-aminophenoxy)benzene (TPER) for its application in electronics. To enhance the thermal stability and mechanical properties of this novel PI, we prepared PI nanocomposite films using nanoparticles of clays that had been treated with organic intercalating agents (organoclays). We used two types of organoclays: montmo-rillonite (MMT) treated with hexadecylamine (C$\_$16/) and MMT treated with dimethyl dihydrogenated tallow quaternary ammonium (l5A). PI/organoclay hybrid films were obtained by first preparing poly(amic acid) (PAA)/organoclay films and then converting the PAA to polyimide by thermal conversion. PAA was characterized by FT-IR and $^1$H-NMR spectroscopy and the conversion of PAA to PI was confirmed by FT-IR spectroscopy. We analyzed the dispersion of the organoclays in the PI film by X-ray diffraction. The thermal stability and mechanical properties of the hybrid films were also investigated.

• 대한전기학회논문지
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• 제45권3호
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• pp.380-385
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• 1996

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.350-353
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• 2001

Aligning capabilities for nematic liquid crystal (NLC) using a in-situ photodimerization method on various Photo-crosslinkable polyimide (PI) based Polymer and blending photopolymer surfaces were studied. High pretilt angle of the NLC can be measured by obliquely polarized UV exposure on a photo-crosslinkable polyimide based polymer surface containing biphenyl (BP), decal (de), and cholesterol (chol) group, respectively. However, the low pretilt angle of the NLC was measured by obliquely polarized UV exposure on the blending photopolymer (PI and cinnamate materials) surfaces. Consequently, the pretilt angle of the NLC generated on the photo-crosslinkable polyimide based polymer surfaces using the in-situ photodimerization method was higher than that of the blending photopolymers.

• 한국표면공학회지
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• 제38권2호
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• pp.49-54
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• 2005

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.

• 한국전기전자재료학회논문지
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• 제15권5호
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• pp.393-397
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• 2002

Polyimide (PI) films have been studied widely as the interlayer dielectric materials due to a low dielectric constant, low water absorption, high gap-fill and planarization capability. The polyimide film was etched using inductively coupled plasma system. The etcying characteristics such as etch rate and selectivity were evaluated at different $CF_4/(CF_4+O_2)$chemistry. The maximum etch rate was 8300 ${\AA}/min$ and the selectivity of polyimide to SiO$_2$was 5.9 at $CF_4/(CF_4+O_2)$ of 0.2. Etch profile of polyimide film with an aluminum pattern was measured by a scanning electron microscopy. The vertical profile was approximately $90^{\circ}$ at $CF_4/(CF_4+O_2)$ of 0.2. As 20% $CF_4$ were added into $O_2$ plasma from the results of the optical emission spectroscopy, the radical densities of fluorine and oxygen increased with increasing $CF_4$ concentration in $CF_4/O_2$ from 0 to 20%, resulting in the increased etch rate. The surface reaction of etched PI films was investigated using x-ray photoelectron spectroscopy.

• Transactions on Electrical and Electronic Materials
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• 제9권6호
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• pp.243-246
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• 2008

We have studied the liquid crystal (LC) alignment, the pretilt angle generation, and the annealing behavior for a nematic liquid crystal (NLC) on the homogeneous polyimide (PI) surfaces by using the rubbing method and the ion beam (IB) method. An excellent LC alignment of the NLC on the PI surface with rubbing and IB irradiation were observed. The pretilt angle of NLC on the homogeneous PI surface for the rubbing method is decreased from $4.5^{\circ}$ to $3.5^{\circ}$ as rubbing time is increased, that of the for the IB irradiation method is decreased from $0.5^{\circ}$ to $0.1^{\circ}$ as the time of IB irradiation is increased. After the annealing, the pretilt angles of the rubbed PI surfaces increased up to $4^{\circ}$, these of the IB irradiated PI surfaces little increased. It is considered the side chain of the rubbed PI show the its abilities of the original capacities, while the side chain of the IB irradiated PI cannot show the its abilities of the original capacities due to the IB has already destroyed the side chain of the PI.

• 한국전기전자재료학회논문지
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• 제26권9호
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• pp.677-681
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• 2013

Apart from the deposition of alignment layer, alignment process needs to be involved for alignment of liquid crystal (LC) molecules. To simplify manufacturing process, several method were used such as rubbing, ion-beam irradiation, UV irradiation, and lithography. But, eventually it needs another treatment for LC alignment. Here, we suggested Si induced polyimide (PI) alignment layer at low temperature. Using this method, we are able to eliminate the alignment process and found that the alignment and electro-optic performance are much better than that of the rubbed PI LC cells. Compared to the rubbed PI cells, the response time was decreased by 70% and C-V characteristics have hysteresis-free.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 디스플레이 광소자분야
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• pp.133-135
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• 2003

The washing effects on pretilt angle generation in a nematic liquid crystal (NLC), 4-n-pentyl-4’-cyanobiphenyl (5CB) on a rubbed polyimide (PI) surface with trifluoromethyl moiety have been successfully studied. The pretilt angle of 5CB is increased by the washing process on the rubbed PI surface. The surface tension on the rubbed PI surface increases with the rubbing strength RS and then saturated above RS=150 mm. The pretilt angle of 5CB for all washing processes on the rubbed PI surface decreases with the surface tension. We have found that the pretilt angle of 5CB on the rubbed PI surface may be attributed van der walls (VDW) dispersion interaction between the LC molecules and the polymer surfaces having trifluoromethyl moieties.

• 한국전기전자재료학회논문지
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• 제15권9호
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• pp.808-811
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• 2002

We investigated response characteristics of twisted nematic (TN) cell with different nematic liquid crystals (NLCs) and cell gap d on a rubbed polyimide (PI) surface. High transmittance and fast response time of the TN cell on the rubbed PI surface were achieved by using high birefringence (Δn) and low cell gap d. The response time of TN cell on the rubbed PI surface was measured 5.1 ms. The transmittance and response time of the TN cell on the rubbed PI surface decreased with decreasing Δnd.