• ETRI Journal
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• 제30권2호
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• pp.308-314
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• 2008

In this paper, we describe the fabrication of 3.5-inch QCIF active matrix organic light emitting display (AMOLED) panels driven by thin film transistors, which are produced by an ultra-low-temperature polycrystalline silicon process on plastic substrates. The over all processing scheme and technical details are discussed from the viewpoint of mechanical stability and display performance. New ideas, such as a new triple-layered metal gate structure to lower leakage current and organic layers for electrical passivation and stress reduction are highlighted. The operation of a 3.5-inch QCIF AMOLED is also demonstrated.

• The Korean Journal of Ceramics
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• 제4권3호
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• pp.199-203
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• 1998

$Pb(Zr, Ti)O_3$ (Pb:Zr:Ti=1:0.52:0.48) thin films were prepared on single crystal MgO(100) substrates by dipping-pyrolysis process using a solution of constituent metal naphthenates as starting materials. The solution was spin-coated onto substrate and the precursor films were pyrolyzed at $200^{\circ}C$ in air or at $200^{\circ}C$ in argon for 1, 2, 5 and 24h, followed by final heat treatment at $750^{\circ}C$. For all the films, highly (h00)/(00l)-oriented Pb$Pb(Zr, Ti)O_3$ thin films with smooth surfaces and crack-free were obtained, whereas thin film pyrolyzed in air for 24 h exhibited polycrystalline character. According to the pole-figure analysis, epitaxy of the product films was found to depend on pyrolysis atmosphere.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.73-73
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• 1999

A large area negative metal ion beam source is developed. Kinetic ion beam of the incident metal ions yields a whole nucleation and growth phenomena compared to the conventional thin film deposition processes. At the initial deposition step one can engineer the surface and interface by tuning the energy of the incident metal ion beams. Smoothness and shallow implantation can be tailored according to the desired application process. Surface chemistry and nucleation process is also controlled by the energy of the direct metal ion beams. Each individual metal ion beams with specific energy undergoes super-thermodynamic reactions and nucleation. degree of formation of tetrahedral Sp3 carbon films and beta-carbon nitride directly depends on the energy of the ion beams. Grain size and formation of polycrystalline Si, at temperatures lower than 500deg. C is obtained and controlled by the energy of the incident Si-ion beams. The large area metal ion source combines the advantages of those magnetron sputter and SKIONs prior cesium activated metal ion source. The ion beam source produces uniform amorphous diamond films over 6 diameter. The films are now investigated for applications such as field emission display emitter materials, protective coatings for computer hard disk and head, and other protective optical coatings. The performance of the ion beam source and recent applications will be presented.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.378-379
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• 2009

High intensity metal halide discharge lamp performance, specifically the generated luminous flux and light color content, depends critically on the arc tube design. Factors influencing the design and consequent lamp efficacy include : lamp size, geometry, arc tube composition, fill chemistry, electrode design and excitation modes. Shaping of Polycrystalline Alumina(PCA) can be realized by conventional ceramic processes. Several processes are applied nowadays. Well-known in the ceramic high pressure field for decades are the pressing and the extrusion method. Newly developed slurry and precious forming technologies give the one-body seamless tubes, which improve thickness uniformity and lighting performance. Now, we reported some optical properties with different arc tube structures of ceramic metal halide lamps.

• 대한전기학회논문지
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• 제36권7호
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• pp.462-469
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• 1987

A metal gate MOSFET with source/drain regions self-aligned to gate region is proposed. The proposed MOS transistor is fabricated by utilizing the higher oxidation rate of source/drain regions with high doping concentration when compared with channel region with moderate doping. The thick oxide on the source/drain regions reduces the gate and drain(source) overlap capacitance down to that of a self-aligned polysilicon gate device while allowing the use of a metal gate with much lower resistivity than the more commonly used polycrystalline silicon. A ring oscillator composed of 15 inverter stages has been computer simulated using SPICE. The results of the simulation show good agreement with experimental measurement confirming the fast switching speed of propesed MOSFET.

• Journal of Information Display
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• 제2권2호
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• pp.7-12
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• 2001

A viscous Ni solution was coated over amorphous Si thin film for evenly spread of Ni metal source. The Ni s. prepared by dissolving $NiCl_2$ into IN HCI and mixing with propylene glycol. $NiCl_2$ and Ni were deposited on the amorphous film after oven dry and they enabled to obtain a uniform crystallization. The crystallization using the viscous Ni solution was a Ni-silicide mediated process, the same process used with Ni metal layer. The crystallization temperature was lowered to $480^{\circ}C$ by the synergy effect of silicide-mediated crystallization and microwave-induced crystallization. Lateral crystallization was also enhanced such that the velocity of lateral crystallization by microwave annealing became faster than by furnace annealing.

• 한국진공학회지
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• 제19권6호
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• pp.475-482
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• 2010

NiO 산화물 타겟을 이용한 RF 마그네트론 스퍼터 방법으로 유리 기판 위에 NiO 박막을 Ar 가스만을 사용하여 증착하였으며, 증착 온도에 따라 NiO 박막 특성에 미치는 영향을 조사하였다. XRD 측정으로부터 증착된 박막의 결정구조는 $200^{\circ}C$ 이하에서 (111) 면의 우선 배향성으로 보이다가 $350^{\circ}C$ 이상에서 (220) 면의 우선 배향성을 가지는 다결정 입방구조임을 확인하였다. NiO 박막의 전기적 특성의 변화는 기판의 온도가 $200^{\circ}C$까지는 $10^5\;{\Omega}cm$의 부도체에 가까운 높은 비저항을 보였고 기판의 온도가 $300^{\circ}C$ 이상에서는 $10^{-1}{\sim}10^{-2}{\Omega}cm$의 도체의 특성을 보이는 낮은 비저항으로 감소하는 Mott-Insulator Transition(MIT) 현상을 관측하였다. NiO 박막 내의 증착 온도 변화에 따른 ${\sim}10^7$ 정도의 큰 비저항 변화를 결정성, 결정립의 변화 및 밴드 갭의 변화 등으로 설명하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1996년도 춘계학술대회논문
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• pp.62-72
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• 1996

A process model is formulated considering the effect of crystallographic testure developed in forming process. The deformation induced plastic anisotropy can be predicted by capturing the evolution of texture during large deformatin in the poly crystaline aggregate. The anisotropic stiffness matrix for the aggregate is derived and implemented in Dulerian finite element code. As an application , the evolution of texture in rolling, drawing and extrusion processes are simulated . The numerical results show good agreement with reported experimental textures.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.27-33
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• 2005

The effect of microstructure on alternating current-induced damage in 200 and 300 nm thick polycrystalline sputtered Cu lines on Si substrates has been investigated. Alternating currents were used to generate temperature cycles (with ranges from 100 to $300^{\circ}C$) and thermal strains (with ranges from 0.14 to $0.42\%$) in the Cu lines at a frequency of 10 kHz. Fatigue loading caused the development of severe surface roughness that was localized within individual grains which depends severely on grain orientations.

• 한국세라믹학회지
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• 제17권1호
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• pp.5-7
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• 1980

The electrical conductivity of polycrystalline $Gd_2O_3$ has been measured over the temperature range of 650 to 100$0^{\circ}C$ under the oxygen pressure range of $10^{-6}$ to 102 torr. The oxygen pressure dependence of electrical conductivity, $\sigma$ PO211/n is characterized by n value of about 5.3. The defect structure and the type of the oxide are controlled by triply ionized metal vacancies and holes.