• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.90-95
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• 2007

Single side final polishing is a very important role to stabilize a wafer finally before the device process on the wafer is executed. In this study, the machining variables, such as pressure, machining time, and the velocity of pad table were adopted. These parameters have the major influence on the characteristics of wafer polishing. We investigated the surface roughness changing these variables to find the optimal polishing condition. Pad, slurry, slurry quantity, and oscillation distance were set to the fixed variables. In order to reduce defects and find a stable machining condition, a hall sensor was used on the polishing process. AE sensor was attached to the polishing machine to verify optimal condition. Applying data analysis of the sensor signal, experiments were performed. We can get better surface roughness from loading the quasi static force and improving wafer-holding method.

• Tribology and Lubricants
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• v.34 no.3
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• pp.115-122
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• 2018

Chemical mechanical polishing (CMP) is a hybrid processing method in which the surface of a wafer is planarized by chemical and mechanical material removal. Since mechanical material removal in CMP is caused by the rolling or sliding of abrasive particles, interfacial friction during processing greatly influences the CMP results. In this paper, the trend of tribology research on CMP process is discussed. First, various friction force monitoring methods are introduced, and three elements in the CMP tribo-system are defined based on the material removal mechanism of the CMP process. Tribological studies on the CMP process include studies of interfacial friction due to changes in consumables such as slurry and polishing pad, modeling of material removal rate using contact mechanics, and stick-slip friction and scratches. The real area of contact (RCA) between the polishing pad and wafer also has a significant influence on the polishing result in the CMP process, and many researchers have studied RCA control and prediction. Despite the fact that the CMP process is a hybrid process using chemical reactions and mechanical material removal, tribological studies to date have yet to clarify the effects of chemical reactions on interfacial friction. In addition, it is necessary to clarify the relationship between the interface friction phenomenon and physical surface defects in CMP, and the cause of their occurrence.

• Design & Manufacturing
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• v.11 no.2
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• pp.42-45
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• 2017

Currently, the mobile device is required to be miniaturized and lightweight according to the needs of the consumer. For this purpose, each part is produced and assembled in units of modules. Accordingly, the display part is also composed of a cover glass, a touch screen, And it costs a large amount to replace the whole when it is damaged. Therefore, we propose a method to improve the durability of display part using ANOVA (Analysis of Variance) and MR fluid polishing. Before MR fluid polishing process, surface treatment was performed to obtain a polishable surface. A series of experiments were carried out to very fine surface roughness and to secure durability of cover glass. Polishing depth, feed rate, and abrasive size were selected to examine the MR fluid polishing results.

• Corrosion Science and Technology
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• v.21 no.4
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• pp.314-324
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• 2022

The objective of this investigation was to indentify major factors affecting surface roughness among various parameters of electropolishing process using the design of an experiment method (full factorial design) for UNS S31603. Factors selected included electrolyte composition ratio, applied current density, and electrolytic polishing time. They were compared through analysis of variance (ANOVA). Results of ANOVA revealed that all parameters could affect surface roughness, with the influence of electrolyte composition ratio being the highest. As a result of surface analysis after electropolishing, the specimen with the deepest surface damage was about 35 times greater than the condition with the smallest surface damage. The largest value of surface roughness after electropolishing was higher than that of mechanical polishing due to excessive processing. On the other hand, the smallest value of surface roughness after electropolishing was 0.159 ㎛, which was improved by more than 80% compared to the previous mechanical polishing. Taken all results together, it is the most appropriate to perform electrolytic polishing with a sulfuric acid and phosphoric acid ratio of 3:7, an applied current density of 300 mA/cm², and anelectrolytic polishing time of 5 minutes.

• Journal of the Speleological Society of Korea
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• no.70
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• pp.45-50
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• 2006

The magnetic polishing is the useful method to finish using magnetic power of magnet. This method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe for transportation. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using worthless mineral. In this development, abrasive grain WA and GC used to resin bond fabricated low temperature. And magnetic material was fabricated from the worthless mineral which were closed into 200 mesh grit type. The XRD analysis result show that only WA and GC abrasive and worthless mineral crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it is found that WA and GC abrasive and worthless mineral were strong bonding with each other by bond.

• The Journal of Korean Academy of Prosthodontics
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• v.36 no.3
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• pp.506-513
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• 1998

This study was designed to compare the smoothness by glazing method with that by polishing method after 48 specimens of Ceramco II block, one of porcelain materials used for PFM, were baked according to the manufacturer's directions. The specimens were roughened with new green stone at 15,000rpm for 30 seconds and sandblasted with $25{\mu}$aluminum oxide for 15 seconds. They were divided into 4 groups at random, and 4 groups were prepared as follows : Group I : specimens were autoglazed and overpolished with polishing system. Group II : specimens were polished with only polishing system. Group III : specimens were glazed after adding glazing liquid, vitachrom 'L'-fluid (vita zahnfabrik co. Germany) to the rough surface Group V : specimens were just autoglazed Using the surface roughness tester, Ra, Rmax. and Rz were estimated 5 times per specimen, and recording process of mean value was repeated 3 times. The results were as follows : 1. The Ra of group I and group II was lower than group III and group IV (p<001). 2. There was lower value of Rz in group I and group II than group III and group IV (p<001). 3. The Rmax of group I (overpolished with polishing system after autoglazing) and group II (polished with only polishing system) was lower than group III (glazed after adding glazing liquid) and group IV (autoglazed) (p<001). 4. There was not a statistically significant difference between group I and II and between group III and IV (p>001). 5. The roughness was increase in order of group I, II, III, IV in SEM

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.1013-1018
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• 2014

Magnetic Abrasive Polishing (MAP) process is a nontraditional method for polishing the surface of workpiece by using the flexibility of tool. At present, a mixture of polishing abrasives and ferrous particles is used as the tool in the MAP process. Previously, an experiment was conducted with different sizes of polishing abrasives with an aim to improve the polishing accuracy. However, the sizes of ferrous particles are also expected to have a dominant effect on the process, warranting a study on the effect of the size of ferrous iron particles. In this study, an experiment was conducted using three different sizes of ferrous particles. Iron powder of average diameters 8, 78 and $250{\mu}m$ was used as ferrous particles. The effect of each ferrous particle size was evaluated by comparing the improvements in surface roughness. The particle size of a ferrous iron was found to play a significant role in MAP and particles of $78{\mu}m$ facilitated the best improvement in surface roughness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.36-42
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• 2015

The aspherical lens was designed to be able to array a focal point. For this reason, it has very curved surface. The aspherical lens is fabricated by injection molding or diamond turning machine. With the aspherical lens, tool marks and surface roughness affect the optical characteristics, such as transmissivity. However, it is difficult to polish free form surface shapes uniformly with conventional methods. Therefore, in this paper, the ultra-precision polishing method with MR fluid was used to polish an aspherical lens with 4-axis position control systems. A Tool path and polishing mechanism were developed to polish the aspherical lens shape. An MR polishing experiment was performed using a generated tool path with a PMMA aspherical lens after the turning process. As a result, surface roughness was improved from $R_a=40.99nm$, $R_{max}=357.1nm$ to $R_a=4.54nm$, $R_{max}=35.72nm$. Finally, the MR polishing system can be applied to the finishing process of fabrication of the aspherical lens.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.