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Shin, Y. J., Lee, E. S. and Kang, J. H., 2000, 'Identification of the Mechanical Aspects of Material Removal Mechanisms in CMP,' Transactions of the Korean Society of Machine Tool Engineers, Vol. 9, No. 5, pp. 7-12
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2 |
Park, K. T., Lee, B. R., Park, K. Y. and Hong, D. P., 2000, 'A Study on the Fracture Behavior in Silicon Wafer Using the Ultra-Precision Micro Positioning System,' Transactions of the Korean Society of Machine Tool Engineers, Vol. 9, No. 1, pp. 38-44
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Kwon, D. H., Kim, H. J.,and Jeong, H. D., 2002, 'A Study on the Decay of Friction Force during CMP,' Journal of the Korean Society of Precision Engineering, pp. 972-975
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4 |
Song, J. B., Lee, E. S. and Kim, N. H., 2000, 'A Study on the Evaluation of Machinging States in the Plunge Grinding Using the Current Signals of a Spindle Motor,' Journal of the Korean Society of Precision Engineering, Vol. 17, No. 6, pp. 76-82
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5 |
Kim, J. D., Kim, S. R., Kim, H. Y. and Ahn, J. H., 2001, 'Development of Acoustic Emission Sensor Using Piezoelectric Elements and Monitoring System for Polishing Process,' Journal of the Korean Society of Precision Engineering, pp. 560-565
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