• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• Journal of the Speleological Society of Korea
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• no.78
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• pp.23-27
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• 2007

In this paper, we have investigated the characteristics of the magnetic abrasive using sludge on polishing of internal finishing of seamless stainless steel tube applying magnetic abrasive polishing. Either white alumina grain was used to resin sludge at a low temperature, and the sludge of magnetic abrasive powder was synthesized and crushed into 200 meshes. Surface roughness was measured before and after polishing, and more than 40% of improvement of surface roughness was achieved when grain was used under a specific condition. Even though some degree of surface roughness due to deeper scratches still exist, but the result showed a prospective magnetic abrasive polishing using sludge with white alumina grains.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.36-42
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• 2015

The aspherical lens was designed to be able to array a focal point. For this reason, it has very curved surface. The aspherical lens is fabricated by injection molding or diamond turning machine. With the aspherical lens, tool marks and surface roughness affect the optical characteristics, such as transmissivity. However, it is difficult to polish free form surface shapes uniformly with conventional methods. Therefore, in this paper, the ultra-precision polishing method with MR fluid was used to polish an aspherical lens with 4-axis position control systems. A Tool path and polishing mechanism were developed to polish the aspherical lens shape. An MR polishing experiment was performed using a generated tool path with a PMMA aspherical lens after the turning process. As a result, surface roughness was improved from $R_a=40.99nm$, $R_{max}=357.1nm$ to $R_a=4.54nm$, $R_{max}=35.72nm$. Finally, the MR polishing system can be applied to the finishing process of fabrication of the aspherical lens.

• Journal of the Korea Safety Management & Science
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• v.11 no.4
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• pp.311-317
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• 2009

In this paper deals with behavior of the magnetic abrasive using Ba-Ferrite on polishing characteristics in a new internal finishing of STS304 pipe applying magnetic abrasive polishing. The magnetic abrasive using Ba-Ferrite grain WA used to resin bond fabricated low temperature. And Ba-Ferrite of magnetic abrasive powder fabricated that Ba-Ferrite was crused into 200 mesh. The previous research have made an experiment in the static state the movement of magnetic abrasive grain is nevertheless in the dynamic state. In this paper, We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.54-57
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• 2001

We studied the characteristics of polishing pad, which can apply STI-CMP process for global planarization of multilevel interconnection structure. Also, we investigated the effects of different sets of polishing pad, such as soft and hard pad. As an experimental result, hard pad showed center-fast type, and soft pad showed edge-fast type. Totally, the defect level has shown little difference, however, the counts of scratch was defected less than 2 on JRlll pad. Through the above results, we can select optimum polishing pad, so we can expect the improvements of throughput and devise yield.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.565-568
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• 2003

In this paper we deal with behavior of the magnetic abrasive using Ba-Ferrite on polishing characteristics in a new internal finishing of STS304 pipe applying magnetic abrasive polishing. The magnetic abrasive using Ba-Ferrite grain WA was used to resin bond fabricated at low temperature. And Ba-Ferrite of magnetic abrasive powder was crused into 200 mesh. The previous research made an experiment in the static and the dynamic state on the movement of magnetic abrasive grain. In this paper. We investigated into the changes of the movement of magnetic abrasive grain. In reference to this result. we have made the experiment which is set under the condition of the magnetic flux density. polishing velocity according to the form of magnetic brush.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.239-240
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• 2013

• Journal of IKEEE
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• v.23 no.4
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• pp.1175-1181
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• 2019

In this paper, we have studied the chemical mechanical polishing(CMP) characteristics of mixed abrasive silica slurry(MAS) retreated by adding of manganese oxide(MnO₂) abrasives within 1:10 diluted silica slurry. A slurry designed for optimal performance should produce high removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The polishing performances of MnO₂ abrasive-added MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared to original silica slurry in the view-point of high removal rate and low non-uniformity. Therefore, our proposed MnO₂-MAS can be useful to save on the high cost of slurry consumption since we used a 1:10 diluted silica slurry.