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A Study on the Characteristics of a Wafer-Polishing Process at Various Machining and Oscillation Speed  

Lee, Eun-Sang (인하대학교 대학원 기계공학과)
Lee, Sang-Gyun (인하대학교 대학원 기계공학과)
Kim, Sung-Hyun (인하대학교 대학원 기계공학과)
Won, Jong-Koo (인하대학교 기계공학과)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.11, no.1, 2012 , pp. 1-6 More about this Journal
Abstract
The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.
Keywords
Wafer Final Polishing; Abrasion; Optimum Condition; Process Condition; Ultra Precision Processing;
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