• 제목/요약/키워드: point of use (POU)

검색결과 12건 처리시간 0.019초

Chemical mechanical planarization 슬러리에 사용되는 point-of-use 필터의 평가 방법 개발 (Development of point-of-use filter evaluation method using chemical mechanical planarization slurry)

  • 장선재;아툴 쿨르카르니;김형우;김태성
    • 한국입자에어로졸학회지
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    • 제12권4호
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    • pp.145-150
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    • 2016
  • During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

POU 슬러리 필터와 탈이온수의 고분사법에 의한 패드수명의 개선 (Improvement of Pad Lifetime using POU (Point of Use) Slurry Filter and High Spray Method of De-Ionized Water)

  • 박성우;김상용;서용진
    • 한국전기전자재료학회논문지
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    • 제14권9호
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    • pp.707-713
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    • 2001
  • As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

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슬러리 공급 시스템을 이용한 화학적 기계적 연마 공정에서의 POU 필터의 성능 평가 (Evaluation of Point-Of-Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System)

  • 장선재;김호중;진홍이;남미연;아툴 쿨르카르니;김태성
    • 한국입자에어로졸학회지
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    • 제9권4호
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    • pp.261-269
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    • 2013
  • The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process for planarization of various materials and structures. Point-of-use (POU) filters are used in most of the CMP processes in order to reduce the unwanted micro-scratches which may result in defects. The performance of the POU filter is depends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluate POU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter test system to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filter with retention size of 0.2 ${\mu}m$. Two POU filters of different make are evaluated for FE. We observed that both POU filters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidal silica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way.

Relationships between levels of heterotrophic plate count bacteria and endotoxin in point-of-use water treatment systems

  • Moon, Kyong-Whan;Kim, Young-Whan;Shon, Jong-Ryeul
    • 한국환경보건학회:학술대회논문집
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    • 한국환경보건학회 2003년도 Challenges and Achievements in Environmental Health
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    • pp.132-135
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    • 2003
  • Endotoxin concentrations were measured from 69 point-of-use(POU) water treatment system(WTS) by using Limulus amebocyte lysate(LAL) assay, and the results were compared to heterotrophic bacterial data. Endotoxin concentrations in all POU WTS water samples and tap waters varied within the range 0.8-79.1EU mL$\^$-1/ and 0.1-3.4EU mL$\^$-1/, respectively, The correlations between endotoxin concentration and HPC bacteria from the water samples showed not significant(r=0.18).

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과불화합물(PFCs) 가스 처리를 위한 고효율 열플라즈마 스크러버 기술 개발 동향 (Highly Efficient Thermal Plasma Scrubber Technology for the Treatment of Perfluorocompounds (PFCs))

  • 박현우;차우병;엄성현
    • 공업화학
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    • 제29권1호
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    • pp.10-17
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    • 2018
  • 반도체 및 디스플레이 제조공정 중에 화학기상증착(CVD), 식각(etching), 세정(cleaning) 공정에서 배출되는 과불화합물(PFCs)를 포함한 폐 가스 처리를 위해서 POU (point of use) 가스 스크러버 시스템을 도입하여 사용하고 있다. 과불화합물은 지구온난화 지수(GWP, global warming potential)와 대기 중 자연분해되는 기간(lifetime)이 $CO_2$에 비해 수천 배 높은 온실가스로 분류되어 있으며, 과불화합물의 열분해를 위해서는 3,000 K 이상의 고온이 요구되는 것이 일반적이다. 이러한 특징 때문에 과불화합물을 효과적으로 제어하기 위한 방법으로 열플라즈마 기술을 도입하고자 하는 노력들이 진행되어 왔으며, POU 가스 스크러버 기술을 개발하여 산업적으로 이용하고자 하였다. 열플라즈마 기술은 플라즈마 토치 기술, 전원공급장치 기술 및 플라즈마 토치-전원공급장치 매칭 기술 최적화를 통해 안정적으로 플라즈마 발생원을 유지시키는 것이 중요하다. 또한, 과불화합물 고효율 처리를 위한 고온의 플라즈마와 폐 가스의 효과적인 혼합이 주요 기술요인으로 확인되었다. 본 논문에서는 반도체 및 디스플레이 공정 폐 가스 처리를 위한 후처리 공정에 대한 기술적 정보를 제공함과 동시에 POU 플라즈마 가스 스크러버에 대한 기술개발 동향을 파악함으로써 향후 연구개발이 요구되는 핵심사항에 대해 논의하고자 한다.

CMP 공정에서 슬러리 필터의 효율 개선에 관한 연구 (A Study on Improvement of Slurry Filter Efficiency in the CMP Process)

  • 박성우;서용진;김상용;이우선;김창일;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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    • pp.34-37
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    • 2001
  • As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the inter-metal dielectrics (IMD) layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}m$ POU (point of use) filter, which is depth-type filter and has 80% filtering efficiency for the $1.0{\mu}m$ size particle. In this paper, we studied the relationship between defect generation and pad count to understand the exact efficiency of the slurry filtration, and to find out the appropriate pad usage. Our preliminary results showed that it is impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the flow rate of slurry to overcome depth type filters weak-point, and to install the high spray of de-ionized Water (DIW) with high pressure.

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CMP 공정의 설비요소가 공정 결함에 미치는 영향 (Effects of Various Facility Factors on CMP Process Defects)

  • 박성우;정소영;박창준;이경진;김기욱;서용진
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권5호
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    • pp.191-195
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    • 2002
  • Chemical mechanical Polishing (CMP) process is widely used for the global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP process, deionized water (DIW) pressure, purified $N_2$ ($PN_2$) gas, point of use (POU) slurry filler and high spray bar (HSB) were installed. Our experimental results show that DW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

Evaluation of the biocidal effects of activated carbon filter supporting silver

  • Moon, Kyong-Whan;Kim, Young-Whan;Choi, Dal-Woong
    • 한국환경보건학회:학술대회논문집
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    • 한국환경보건학회 2004년도 International Conference Global Environmental Problems and their Health Consequences
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    • pp.202-206
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    • 2004
  • The objectives of this study are to investigate the relationship between the silver ion concentrations released from the point-of-use(POU) water purification devices installed silver impregnated activated carbon filters and the antibacterial activities against HPC bacteria. Total of 68 POU devices were tested. The concentrations of the eluted silver ion from the silver impregnated activated carbon filter showed the range from $4\;{\mu}g/L$ to $386\;{\mu}g/L$, and the HPC bacteria were found to diversely grow within the range 0-5,200 cfu/mL. The average silver concentrations released from UF units system and RO units system were $30\;{\mu}g/L$ and $73\;{\mu}g/L$, respectively. And the number of colonies were reduced significantly as the elution levels of silver exceeded $100\;{\mu}g/L$, however silver ions below the concentration of $100\;{\mu}g/L$ were not particularly effective for eradicating HPC bacteria from water.

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물안보 및 지속가능성 제고를 위한 분산형 용수공급시스템의 도입 타당성에 관한 연구 (Feasibility Study on Introduction of Decentralized Water Supply System for Improving Water Security and Sustainability)

  • 김관엽;김성수;박노석
    • 상하수도학회지
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    • 제28권1호
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    • pp.111-124
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    • 2014
  • Decentralized water supply systems, treating the water in users'vicinity, cutting down the distribution system, utilizing the alternative water resources(rainwater harvesting, water reclamation and reuse and so on.) and saving energy and other resources, could be categorized into POU(Point-Of-Use), POE(Point-Of-Entry) and community small scale system. From the literature review, we could thought that decentralized water supply system and hybrid system(integrating centralized and decentralized water supply system within urban water management) might have strengthening comparative advantages to centralized system with respect to: (1) water security, (2) sustainability, (3) economical affordability. Even though it is difficult to derive and quantify direct benefit advantages from decentralized and hybrid system in comparison with centralized system, (1) operational cost reduction, (2) assurance for safe and stability water supply and (3) greenhouse gas reduction can be expected from successful establishment of the former.