• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.1
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• pp.21-26
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• 2013

This study presents new analysis method to predict bending behavior of packaging substrate structure by comparing finite element method simulation and measured curvature using 3D scanner. Packaging substrate is easily bent and deflected while undergoing various processes such as curing of prepreg and copper pattern plating. We prepare specimens with various conditions and measure contours of each specimen and compute the residual stresses on deposited films using analytical solution to find the principle of bending. Core and prepreg in packaging substrate are made up of resin and bundles of fiber which exist orthogonally each other. Anisotropic material properties cause peculiar bending behavior of packaging substrate. We simulate the bending deflection with finite element method and verify the simulated deflection with measured data. The plating stress of electrodeposited copper is about 58 MPa. The curing stresses of solder resist and prepreg are about 13 MPa and 6.4 MPa respectively in room temperature.

• Journal of the Korea Institute of Military Science and Technology
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• v.18 no.5
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• pp.485-491
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• 2015

In this study, the experimental and analytical investigation on structural integrity evaluation of spline shaft of self propelled artillery' generator were carried out. For this work, macro and microstructure fractography of spline shaft were observed. According to the results of the structure analysis and simulation, the shaft was redesigned and optimized. To improve the stiffness and shear stress, the material was changed from the SNCM220 to SNCM439 and surface roughness and protective coating treatment are changed to increase the stress relaxation, respectively. From the result of the torsion test of shaft and accelerated life test of generator, the shaft of a SNCM439 with heat-treatment(Q/T) and electroless nickel plating was superior quality reliability and durability than the others. Therefore, modeling and simulation corresponded well with the experimental result and structural safety was confirmed by generator performing.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.5
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• pp.674-680
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• 2017

Touch Screen Panel (TSP) is a widely used personal handheld device and as a large display apparatus. This study examines micro bump fabrication technology for TSP test process. In the testing process, as TSP is changed, should make a new micro bump for probing and modify the testing program. In this paper we use a maskless lithography system to confirm the potential to fabricatemicro bump to reducecost and manufacturing time. The requiredmaskless lithography system does not use a mask so it can reduce the cost of fabrication and it flexible to cope with changes of micro bump probing. We conducted electro field simulation by pitches of micro bump and designed the lithography pattern image for the maskless lithography process. Then we conducted Photo Resist (PR) patterning process and electro-plating process that are involved in MEMS technology to fabricate micro bump.

• Proceedings of the KIPE Conference
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• 2009.11a
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• pp.231-233
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• 2009

The plating equipment, water treatment system, electrolysis facility, etc need the high current and high power rectifier for their original purposes. So the paper investigates the applicable types of rectifiers and carries out their comparisons, and also suggest the practical design guidelines for a suitable candidate rectifier for low voltage high current high power applications.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.4
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• pp.357-364
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• 2017

Metal casting is a process in which molten metal or liquid metal is poured into a mold made of sand, metal, or ceramic. The mold contains a cavity of the desired shape to form geometrically complex parts. The casting process is used to create complex shapes that are difficult to make using conventional manufacturing practices. For the optimal casting process design of sleeve parts, various analyses were performed in this study using commercial finite element analysis software. The simulation was focused on the behaviors of molten metal during the mold filling and solidification stages for the precision and sand casting products. This study developed high-life sleeve parts for the sink roll of continuous hot-dip galvanizing equipment by applying a wear-resistant alloy casting process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.76-77
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• 2012

전기 도금 시스템에서 전산모사 해석을 이용하여 도금층 두께를 정확히 예측하기 위해서 음극 표면의 확산층이 고려된 도금 Simulator를 개발하였다. 특정 형상의 경우 도금액 교반이 원활하지 않아 불균일한 도금이 이루어지는 경우가 있기 때문에 이를 예측하기 위해서는 교반 영향을 나타내는 확산층을 고려해야 한다. 유동해석을 통해 도금액 교반 조건 및 형상에 따른 음극 표면의 유속을 결정하고 유속별 도금액 DB를 구성하여 음극의 위치별 분극곡선을 차별화하여 유동 조건에 따른 확산층 변화를 고려하는 형태로 구현하였다. 유속별 도금액 DB는 실험 데이터 및 해석 데이터를 종합하여 구축하였다. 교반의 영향을 많이 받는 시스템을 대상으로 개발된 Simulator 결과의 타당성을 검증하였고 확산층 적용에 따른 도금 결과의 차이를 확인하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.53-53
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• 2011

도금 시뮬레이션 기법은 도금 용액 개발에서부터 도금설비 제작, 공정 최적화 및 trouble shooting에 이르기까지 도금 산업 전반에서 응용이 될 수 있다. 현재 우리나라에서는 도금 시뮬레이션을 연구하는 연구자나 적용하여 사용하는 도금 업체는 매우 드물다. 본 발표에서는 도금 시뮬레이션 기법에 대한 이론과 절차 등을 설명하고 시뮬레이션 기법을 적용하여 공정 최적화나 도금 두께 균일화를 이룬 몇 가지 사례에 대하여 소개하고자 하였다.

• Journal of the Korean institute of surface engineering
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• v.43 no.6
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• pp.289-296
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• 2010

The effect of organic additives, thiourea (TU), on the copper electroplated layer of large rectangular size was investigated through physical and various electrochemical techniques. It was found that TU had strong adsorption characteristics on the Ni substrate and affected the initial electroplating process by inducing surface reaction instead of mass transfer in the bulk solution. TU additives had its critical micelle concentration at 200 ppm in copper sulphate solution and showed abrupt change in morphological and electrochemical impedance spectroscopic results around this concentration, which could be related with the destruction of adsorption structure of TU-Cu(I) complex formed at the Ni substrate surface. By conducting a commercial electroplating simulation, when TU additives was included at cmc in the plating solution, it acted as a depolarizer for copper electrodeposition and was effective to reduce the unevenness of copper deposits between centre and edge region at high current densities of 10 ASD.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.12
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• pp.919-923
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• 2010

Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.