A study of fabrication micro bump for TSP testing using maskless lithography system. |
Kim, Ki-Beom
(Department of Mechanical Engineering, Inha University)
Han, Bong-Seok (Department of Mechanical Engineering, Inha University) Yang, Ji-Kyung (Department of Mechanical Engineering, Inha University) Han, Yu-Jin (Department of Mechanical Engineering, Inha University) Kang, Dong-Seong (Department of Mechanical Engineering, Inha University) Lee, In-Cheol (Department of Mechanical Engineering, Inha University) |
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