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http://dx.doi.org/10.4313/JKEM.2010.23.12.919

Method of Solving Oxidation Problem in Copper Pillar Bump Packaging Technology of High Density IC  

Jung, One-Chul (Department of Electronic Engineering, Myong-Ji University)
Hong, Sang-Jeen (Department of Electronic Engineering, Myong-Ji University)
Soh, Dae-Wha (KISTI RESEAT HoiGiro)
Hwang, Jae-Ryong (KISTI RESEAT HoiGiro)
Cho, Il-Hwan (Department of Electronic Engineering, Myong-Ji University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.23, no.12, 2010 , pp. 919-923 More about this Journal
Abstract
Copper pillar tin bump (CPTB) was developed for high density chip interconnect technology. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM -1250 dry film photoresist (DFR), copper electroplating method and Sn electro-less plating method. Mechanical shear strength measurements were introduced to characterize the bonding process as a function of thermo-compression. Shear strength has maximum value with $330^{\circ}C$ and 500 N thenno-compression process. Through the simulation work, it was proved that when the copper pillar tin bump decreased in its size, it was largely affected by the copper oxidation.
Keywords
Tin layer; Oxidation barrier; Copper pillar bump; Interconnection;
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  • Reference
1 Robert Doering, and Yoshio Nishi, Semiconductor Manufacturing Technology, 2nd ed. (CRC Press, New York, 2008) p. 32-2.
2 T. Wang, F. Tung, L. Foo, and V. Dutta, Proceedings of the 51th IEEE Electronic Components and Technology (IEEE, Orlando, USA, 2001) p. 945.
3 A. Yeoh, M. Chang, C. Pelto, Tzuen-Luh Huang, S. Balakrishnan, G. Leatherman, S. Agraharam, Guotao Wang, Zhiyong Wang, D. Chiang, P. Stover, and P. Brandenburger, Proceedings of the 56th IEEE Electronic Components and Technology (IEEE, San Diego, USA, 2006) p. 1611.
4 E. T. Ogawa, Ki-Don Lee, V. A. Blaschke, and P. S. Ho, IEEE TRANSACTIONS ON RELIABILITY 51, 403 (2002).   DOI
5 Ph. Gasser, P. Jacob, D. Leroy, L. Overli, C. Scheuerlein, and M. Taborelli, J. Appl. Phys. 97, 033909 (2005).   DOI
6 Richard D. Holmes, Annie B, KerstingG, and Richard J. Arculus. Geochimica et Cosmochimica Acta. 50, 2439 (1986).   DOI
7 Sungil Cho, Jin Yu Sung, K. Kang, and Da-Yuan Shih, IMAPS, (Brugge, Belgium, 2005) p. 35 (2005).
8 Ahalapitiya H. Jayatissa, K. Guo, and Amblangodage C. Jayasuriya, Appl. Surf. Sci. 255, 9474 (2009).   DOI
9 Yi-Shao Lai, Kuo-Ming Chen, Chiu-Wen Lee, Chin-Li Kao, and Yu-Hsiu Shao, 2005 7th Electronic Packaging Technology Conference (IEEE, Grand Copthome Waterfront, Singapore, 2005) p. 786.
10 S. Lee, Y. X. Guo, and C. K. Ong, 2005 7th Electronic Packaging Technology Conference (IEEE, Grand Copthome Waterfront, Singapore, 2005) p. 135.