• Applied Chemistry for Engineering
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• v.19 no.2
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• pp.228-235
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• 2008

Nickel plating thickness increased with the electric current density, and the augmentation was more thick in $6{\sim}10A/dm^2$ than low current. Hull-cell analysis was tested to evaluate the current density. Optimum thickness was obtained at a temperature of $60^{\circ}C$, and the pH fluctuation of 3.5~4.0. Over the Nickel ion concentration of 300 g/L, plating thickness increased with the current density. The rate of decrease in nickel ion concentration was increased with the current density. The quantity of plating electro-deposition was increased at the anode surface, which was correlated with the increase of plating thickness. The plating thickness was increased because of the quick plating speed. However, the condition of the plating surface becomes irregular and the minuteness of nickel plating layer was reduced with the plating rate. After the corrosion test of 25 h, it was resulted in that maintaining low electric current density is desirable for the excellent corrosion resistance in lustered nickel plating. According to the program simulation, the thickness of diffusion layer was increased and the concentration of anode surface was lowered for the higher current densities. The concentration profile showed the regular distribution at low electric current density. The field plating process was controlled by the electric current density and the plating thickness instead of plating time for the productivity. The surface physical property of plating structure or corrosion resistance was excellent in the case of low electric current density.

• Journal of the Korean institute of surface engineering
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• v.19 no.3
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• pp.121-127
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• 1986

There are many plating methods already commercially employed in te surface technology. One of the plating methods is electroless (chemical) plating, which is deposited by auto-catalytic reduction of metallic ion with the reducing agent in the plating bath. And it has many advantages comparing with electrolytic plating in respect of properties of deposit, such as corrosion resistance, wear resistance, uniformity, hardness, adhesion and so on. So, electroless plating is the fatest growing process in metallization of plastic and electronic industry. The properties and numerous applications of electroless deposits are attracting more and more attention from finish specifies. Many metal finishers are considering set-up of new electroless line in their shops. This review will be beneficial to domestic metal finishers to understand the real status of present electroless plating technology. It will also provide some knowledge on the economic aspect of electroless plating for the commercial application of specific parts.

• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.913-921
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• 2009

In this study, supercritical nano plating was performed to observe its effect on materials. Using supercritical carbon dioxide as a solvent, we observed how different pressures and temperatures of the supercritical fluid affected the process and its outcome. The plating current increases as pressure increases from 8 MPa to 16 MPa, but it decreases after that. Similarly, the plating current increases as temperature is increased from $35^{\circ}C$ to $45^{\circ}C$, but the current decreases after that. Also, the thickness of the wet electrolyte plating is about $35\sim50{\mu}m$, while the thickness of the plating done using supercritical fluid is about $20\sim25{\mu}m$. At the results, It to it is considered that supercritical nano plating enable to form more thin and stable plating than wet electroplating methods. Also both of the electroplating methods could be affected plating quality by surface condition, and the supercritical nano plating has been confirmed to product more uniform plating surface than wet electroplating.

• Tribology and Lubricants
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• v.33 no.6
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• pp.256-262
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• 2017

Molten zinc plating is a process in which zinc is thinly coated over a metallic or non-metallic surface. It is used in various industrial fields for corrosion resistance and decoration. During the process, a steel sheet is passed through a roll that rotates inside the molten zinc liquid in the temperature range of $460^{\circ}C$ to $680^{\circ}C$, and the plating liquid flows into the roll causing abrasion and erosion of the roll surface. This problem is known to accelerate the replacement cycle of the roll and cause considerable economic loss owing to production line stoppage. Here, we propose a mechanism that operates at high temperature and pressure with a labyrinth type seal design to resolve this problem. We theoretically investigate the flow of the plating solution inside the seal and compute the minimum rotation speed required to prevent the plating solution from entering the seal chamber. In addition, we calculate the thermal deformation of the seal during operation and display thermally deformed dimensions at high temperatures. To verify the theoretical results, we perform experiments using pilot test equipment working in the actual plating environment. The experimental results are in good agreement with theoretical results. We expect our results to contribute towards the extension of the roll's life span and thereby reduce the economic losses.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.722-727
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• 2004

This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.56mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.5-12
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• 2004

This paper includes the comparative study between Cr plating and nitriding process with an aim at improving corrosion, wear and maintainability for KNR(Korean Next Generation Rifle) 5.5mm barrel. The endurance test was conducted to compare the performance of standard barrel, Cr plating barrel and nitriding barrel. Main activities are described as follows; optimal Cr plating and nitriding process set-up for KNR 5.56mm barrel; durability test of each barrel(20,000 rounds); salt water immersion test; dispersion, initial velocity, inner diameter data acquisition. According to the results of this firing test, Cr plating barrel is superior to standard barrel and nitriding barrel in view of corrosion, wear and maintainability.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.57-62
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• 2017

In the process for preparing Ag-coated Cu flakes by electroless silver plating using hydroquinone reducing agent, Ag coating qualities were compared by changing various process parameters such as type of pretreatment solution, plating temperature, pH of plating solution, type and injection rate of plating solution, and pulp density. Effective pretreatment solution for removing the oxide layer on a Cu flake was preferentially suggested. The conditions of low plating temperature, pH value of 4.34, slow injection rate of Ag plating solution, elimination of deionized water in the Ag plating solution, and high pulp density significantly suppressed the formation of separated tiny Ag particles, and thus the surface coverage of Ag coating on Cu flakes was enhanced.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.26 no.1
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• pp.1-6
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• 2003

In this paper, we proposed the optimal process conditions on the electro-gilding process. The responses are plating thickness and Sn proportion. The factors are temperature, current density, and addition. We minimized the total number of experiments based on the principle of dividing into small part. We grouped the factors using the plating process information which we already knew. We did Hull Cell test to find relationship between plating solution and electric effects, and applied ANOVA and RSM to estimate the optimal process conditions.