• 한국표면공학회지
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• 제26권2호
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• pp.71-81
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• 1993

Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and $90^{\circ}$peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion.

• 반도체디스플레이기술학회지
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• 제16권4호
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• pp.63-67
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• 2017

In this study, We developed a simple and low cost capacitive pressure mapping sensor and microcontroller-base lock-in amplifier array. We developed capacitive type pressure mapping sensor by forming the electrode and adhesives on plastic films using only the printing process, and the finishing the process by bonding the two films. Lock-in amplifier array was based on a general purpose microcontroller and had only a charge amplifier as analog circuits. In this study, a $10{\times}10$ capacitive type pressure mapping sensor and lock-in amplifier array was fabricated and its characteristics were analyzed.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.223.2-223.2
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• 2015

Polyurethane acrylate (PUA) has been introduced to utilize as a mold material for sub-100 nm lithography as it provides advantages of stiffness for nanostructure formation, short curing time, flexibility for large area replication and transparency for relevant biomedical applications. Due to the ability to fabricate nanostructures on PUA, there have been many efforts to mimic extracellular matrix (ECM) using PUA especially in a field of tissue engineering. It has been demonstrated that PUA is useful for investigating the nanoscale-topographical effects on cell behavior in vitro such as cell attachment, spreading on a substrate, proliferation, and stem cell fate with various types of nanostructures. In this study, we have conducted surface modification of PUA films with micro/nanostructures on their surfaces using plasma treatment. In general, it is widely known that the plasma treated surface increases cell attachment as well as adsorption of ECM materials such as fibronectin, collagen and gelatin. Effect of plasma treatment on PUA especially with surface of micro/nanostructures needs to be understood further for its biomedical applications. We have evaluated the modified PUA film as a culture platform using adipose derived stem cells. Then, the behavior of stem cells and the level of adsorbed protein have been analyzed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.13-13
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• 2009

We have investigated the fabrication and properties of bendable PZT film formed on plastic substrates for the application in flexible memory. These devices used the PZT active layer formed on $SiO_2/Si$ wafer by sol-gel method with optimized device layouts and Pt electrodes. After etching Pt/PZT/Pt layers, patterned by photolithography process. these layers were transferred on PET plastic substrate using elastomeric stamp. The level of performance that can be achieved approaches that of traditional PZT. devices on rigid bulk wafers.

• 한국진공학회지
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• 제13권1호
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• pp.29-33
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• 2004

본 논문에서는 RF 마그네트론 스퍼터링법으로 비정질 실리콘을 증착하여 진공분위기에서 엑시머 레이저 어닐링을 이용하여 플라스틱 기판위에 극저온 다결정 실리콘 박막(＜$150^{\circ}C$)을 형성하였다. 비정질 실리콘 박막은 $120^{\circ}C$에서 Ar/He 혼합가스로 증착하였으며, Rutherford Backscattering Spectrometry로 측정한 박막내 아르곤 함량은 2% 이하였다. 에너지 밀도 320mJ/$\textrm{cm}^2$일 때 다결정 실리콘의 결정화도는 62%, Root-Mean-Square roughness는 267$\AA$를 나타내었다. 엑시머 레이저 결정화 후 결정립의 크기는 50nm에서 100nm 정도를 나타내었다.

• 한국기계가공학회지
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• 제9권6호
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• pp.1-6
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• 2010

Patterned optical components are widely used for optical products such as LCD and lighting. Since CCFL was used as a light source in the products, prism films having linear continuous optical patterns were widely used. However, LED which is a dot light source is popular recently, therefore, the optical products need new optical components having non-continuous optical patterns. Indentation machining method is a powerful method for machining of non-continuous pattern. When a copper mold and a brass mold were machined by this method, severe plastic deformation called pile-up was observed around the patterns. Since pile-up has negative relationship to ductility, this deformation can be eliminated by annealing treatment which makes the materials ductile. No plastic deformation occurred when machined after annealing at $600{^{\circ}C}$ and $575{^{\circ}C}$ for copper and brass, respectively. Finally, non-continuous optical patterns with high quality were machined on a copper mold and a brass mold successively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.149-152
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• 2005

We present the characterization of poly-Si TFT fabricated below on Plastic Substrate below $170^{\circ}C$ on plastic substrate using excimer laser crystallization of Xe sputtered Si films. Gate insulator with a breakdown field exceeding 8 MV/cm was deposited by using inductively coupled plasma CVD. Finally, we successfully fabricate TFT with a electron field-effect mobility value greater than $290\;cm^2/Vsec$.

• Journal of Mechanical Science and Technology
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• 제16권9호
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• pp.1065-1071
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• 2002

The friction and wear behaviors of magnetron sputtered MoS$_2$ films were investigated through the use of a pin and disk type tester. The experiments were performed for two kinds of specimens (ground (Ra 0.5 $\mu\textrm{m}$) and polished (Ra 0.01 $\mu\textrm{m}$) substrates) under the following operating condifions : linear sliding velocities in the range of 22～66 mm/s (3 types), normal loads varying from 9.8～29.4 N(3 types) and atmospheric conditions of air, medium and high vacuum (3types). Silicon nitride pin was used as the lower specimen and magnetron sputtered MoS$_2$ on bearing steel disk was used as the upper specimen. The results showed that low friction property of the MoS$_2$ films could be identified in high vacuum and the specific wear rate in air was much higher than that in medium and high vacuum due to severe oxidation. It was found that the main wear mechanism in air was oxidation whereas in high vacuum accumulation of plastic flow and adhesion, were the main causes of wear.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1116-1118
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• 2005

We studied laser crystallization of amorphous silicon films prepared at ultra low temperatures ($<150^{\circ}C$). Amorphous silicon films having a low content of hydrogen were deposited by using catalytic chemical vapor deposition method. Influence of process parameters on the hydrogen content was investigated. Laser crystallization was performed dispensing with the preliminary dehydrogenation process. Crystallization took place at a laser energy density value as low as $70\;mJ/cm^2$, and the grain size increased with increasing the laser energy. The ELA crystallization of Catalytic CVD a-Si film is a promising candidate for Poly-Si TFT in active-matrix flexible display on plastic substrates.

• 한국전기전자재료학회논문지
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• 제30권4호
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• pp.235-240
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• 2017

The effect of particle sizes on the aerosol deposition (AD) of Cu films is investigated in order to understand the deposition behaviors of metal powder during the AD process. The Cu coatings fabricated by using $2{\mu}m$ Cu powders had a dense microstructure, a high deposition rate ($1.6{\pm}0.2{\mu}m/min$), and low resistance ($9.42{\pm}0.4{\mu}{\Omega}{\cdot}cm$) compared to that from using Cu powder with a particle size greater than $5{\mu}m$. Also, from estimating the internal micro-strain of Cu films, the Cu coatings fabricated by using $2{\mu}m$ Cu particles exhibited a high micro-strain value of $3.307{\times}10^{-3}$. On the other hand, the strain of Cu coatings fabricated with $5{\mu}m$ particles was decreased to $2.76{\times}10^{-3}$. These results seem to show that the impacted Cu particles are compressed and flattened by shock waves, and that their bonding is associated with the high internal micro-strain caused by plastic deformation.