• Journal of Information Display
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• 제3권2호
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• pp.26-30
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• 2002

Large area plasma source has been built for LCD etcher by an array of $2{\times}2$ ICP sources. Since only one RF power supply and one impedance matching network is used in this configuration, any difference in impedances of unit RF antennas causes unbalanced power delivery to the unit ICP. In order to solve this unavoidable unbalance, unit antenna is designed to have a movable tap, with which the inductance of each unit can be adjusted individually. The plasma density becomes symmetric and etch rate becomes more uniform with the impedance adjustment. The concept of adding axial time-varying magnetic field to the single ICP source is applied to the array ICP source, and is found to be effective in terms of etch rate and uniformity.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.157.1-157
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• 2001

A new methodology is presented to diagnose faults in equipment plasma. This is accomplished by using neural networks as a pattern recognizer of radio frequency(rf) impedance match data. Using a realtime match monitor system, the match data were collected. The monitor system consisted mainly of a multifunction board and a signal flow diagram coded by Visual Designer. Plasma anomaly was effectively represented by electrical match positions. Twenty sets of fault-symptom patterns were experimentally simulated with experimental variations in process factors, which include rf source power, pressure, Ar and O$_2$ flow rates. As the inputs to neural networks, two means and standard deviations of positions were used ...

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(2)
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• pp.282-285
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• 2000

Four helical resonators are distributed in a 2 ${\times}$ 2 array by modifying upper part of the conventional reactive ion etching(RIE) type LCD etcher in order to prepare a large area plasma source. Since the resonance condition of the RF signal to the helical antenna, one RF power supply is used for delivering the power efficiently to all four helical resonators without an impedance matching network Previous work of 2 ${\times}$ 2array inductively coupled plasma(ICP)requires one matching circuit to each ICP antenna for more efficient power deliverly Distributions of ion density and electron temperature are measured in terms of chamber pressure, gas flow rate and RF power . By adjusting the power distribution among the four helical resonator units, argon plasma density of higher than 10$\^$17/㎥ with the uniformity of better than 7％ can be obtained in the 620 ${\times}$ 620$\textrm{mm}^2$ chamber.

• KIEE International Transaction on Systems and Control
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• 제2D권2호
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• pp.120-124
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• 2002

A new methodology is presented to diagnose faults in equipment plasma. This is accomplished by using neural networks as a pattern recognizer of radio frequency (rf) impedance match data. Using a match monitor system, the match data were collected. The monitor system consisted mainly of a multifunction board and a signal flow diagram coded by Visual Designer. Plasma anomaly was effectively represented by electrical match positions. Twenty sets of fault-symptom patterns were experimentally simulated with variations in process factors, which include rf source power, pressure, Ar, and $O_$2 flow rates. As an input to neural networks, two means and standard deviations of positions were used as well as a reflected power. Diagnostic accuracy was measured as a function of training factors, which include the number of hidden neurons, the magnitude of initial weights, and two gradients of neuron activation functions. The accuracy was the most sensitive to the number of hidden neurons. Interaction effects on the accuracy were also examined by performing a 2$^$4 full factorial experiment. The experiments were performed on multipole inductively coupled plasma equipment.

• 전력전자학회논문지
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• 제15권4호
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• pp.274-281
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• 2010

본 논문에서는 반도체 플라즈마 식각 시스템의 균일도 향상을 위한 CCP와 ICP 결합 임피던스정합 장치를 제안한다. 이중주파수 전원공급 장치는 CCP와 ICP로 구성되어 있고 첫 번째 구성은 고집적화를 위해 페라이트 코어를 사용한 유도 결합 플라즈마(ICP : Inductively Coupled Plasma)방식이며, 두 번째 구성은 셀 전체의 균일도 향상을 위한 용량 결합 플라즈마(CCP : Capacitively Coupled Plasma)방식이다. 제안된 시스템은 반도체 장비 산업에서 요구되는 높은 생산성을 실현할 수 있다. 본 논문에서는 제안된 시스템의 타당성을 검증하기 위해 CCP와 ICP 결합 임피던스정합 장치를 제작하였고, 이론적 분석과 27.12MHz 와 400kHz의 조건에서 시뮬레이션 및 실험을 진행하였다

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1408-1409
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• 2006

In this paper, poly methyl methacrylate thin films were deposited on a ITO glass substrate using a plasma polymerization technique. In order to investigate the influence of the plasma coupling method and plasma conditions on the plasma polymerized poly methyl methacrylate (ppMMA) thin film properties, inductively coupled (ICP) and capacitively coupled plasma (CCP) were used to generate the plasma and the plasma parameters were varied. Molecular structures of the ppMMAs were investigated using a Fourier Transform Infrared (FT-IR) spectroscopy. Dielectric constants of the ppMMA thin films were investigated using a impedance analyzer (HP4192A, LF Impedance Analyzer). Current-Voltage (I-V) characteristics of the ppMMA thin films were investigated using a source measurement unit (SMU: Keithley 2400). Relationship between the plasma coupling technique/process parameter and ppMMA thin films properties were investigated.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1347-1348
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• 2007

In this paper, ITO gate electrode surface was modified using $O_2$ plasma and organic gate insulating layers were deposited on the ITO surface using plasma polymerization technique. In order to investigate the influence of the plasma coupling method and plasma conditions on the plasma polymerized methyl methacrylate (ppMMA) thin film properties, inductively coupled (ICP) and capacitively coupled plasma (CCP) were used to generate the plasma and the plasma parameters were varied. The ppMMAs were investigated using atomic force microscopy (AFM) and a Fourier Transform Infrared (FT-IR) spectroscopy. Dielectric constants of the ppMMA thin films were investigated using a impedance analyzer (HP4192A, LF Impedance Analyzer). Current-Voltage (I-V) characteristics of the organic thin film transistors (OTFTs) were investigated using a source measurement unit (SMU: Keithley 2612). Proposed method can be applied to dry-process to fabricate OTFTs during overall fabricating steps.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2013년도 전력전자학술대회 논문집
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• pp.508-509
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• 2013

본 논문에서는 400kHz 10kW RF Source와 최대전력전달을 하기 위해 가변임피던스 정합기를 이용하여 파워 소스를 준비하였고, 송수신코일은 EE71형태의 페라이트코어에 테프론 와이어를 결선하여 구성하였다. 본 연구에서는 MF대역의 주파수를 이용하므로 자기유도방식을 채택하였다. 무선전력전송에서는 최대로 전력이 전달하기 위하여 송수신 코일과 부하간에 임피던스 매칭이 필수적으로 필요하다. 매칭이 원할하지 않을 경우 RF Source에 반사전력이 반사되어 심각한 손상을 발생할 수 있으며, 수신부 코일의 부하단에 최대로 전력이 전달되지 않을 뿐만 아니라 전체 시스템 효율이 나빠지게 된다 본 연구에서는 임피던스 정합기를 이용하여 자기유도방식에서 최적의 송수신 전송 조건을 도출하였다.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2006년도 전력전자학술대회 논문집
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• pp.470-474
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• 2006

This dissertation discuses about a ferrite core plasma source using low operating frequency without sputtering problem by the stored electric field. Compared with the conventional RF power system with 13.56MHz switching frequency, the proposed plasma power system is only separated at 400kHz, so that it makes possible to use of low cost switching elements, PWM control and soft switching. Moreover, it could improve the coupling efficiency for plasma and antenna by using the ferrite core in order to transfer the energy of the load This dissertation tried to analyze new plasma generation method for the plasma generation system by modeling the plasma load and grafting the concept of impedance matching in order to interpret it with the formula This dissertation verified the ferrite core inductive coupling plasma source authorized for 400kHz of low frequency power by applying to the semi-conductor ash process thru the measurement of ash capacity and uniformed plasma distribution on the actual wafer.

• 반도체디스플레이기술학회지
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• 제22권2호
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• pp.64-71
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• 2023

If an impedance mismatch occurs between the source and load in a Radio Frequency transmission system, reflected power is generated. This results in incomplete power transmission and the generation of Reflected Power, which returns to the Radio Frequency generator. To minimize this Reflected Power, Impedance matching is performed. Fast and efficient Impedance matching, along with converging reflected power towards zero, is advantageous for achieving desired plasma characteristics in semiconductor processes. This paper explores Impedance matching by adjusting the Vacuum Variable Capacitor of an L-type Matching Module based on the trends observed in the voltage of the Phase Sensor and Electromotive Force voltage. After assessing the impedance matching characteristics, the findings are described.