• Title/Summary/Keyword: plasma ion

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Measurement of Ion Energy Distribution using QMS & Ionization Enhancement by usign Magnetic Field in Triod BARE (자장을 이용한 이온화율 증대형 삼극형 BARE에서 이온화율의 증대경향과 QMS를 이용한 이온의 에너지 분포 측정)

  • 김익현;주정훈;한봉희
    • Journal of the Korean institute of surface engineering
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    • v.24 no.3
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    • pp.119-124
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    • 1991
  • Recently, the trend of research in hard coating is concentrate on developing the process of ionization rate under low operating pressure, to get the thin film with high adhesion and dense microstructures. In this study ionization rate enhancement type PVD process using permanent magnet is developed, which enhances the ionization rate by confining the plasma suppressing the wall loss of electron. By the result to investigate the characteristic of glow discharge, the ionization rate of this process is enhanced about twice as high as that of triod BARE process (about 26%), and more dense TiN microstructures are obtained in this process. Cylindrical ion energy analyzer is made and attached in front of a quadrupole mass filter for the analysis of the energy distribution of reactive gas and activated gas ions from the plasma zone. To analyze the operation mechanism of ion energy analyzer, computer simulation is performed by calculation the electric field environment using finite element method. By these analyses of ion energy distribution of outcoming ions from the plasma zone, it is found that magnetic field enhances ion kinetic energy as well as ionization rate. The other results of this study is that the foundation of feed-back system is constructed, which automatically control the partial pressure of reactive gas. In can be possible by recording the data of mass spectrum and ion energy analysis using A-D converter.

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Effect of the Mg Ion Containing Oxide Films on the Biocompatibility of Plasma Electrolytic Oxidized Ti-6Al-4V

  • Lee, Kang;Choe, Han-Cheol
    • Journal of the Korean institute of surface engineering
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    • v.49 no.2
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    • pp.135-140
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    • 2016
  • In this study, we prepared magnesium ion containing oxide films formed on the Ti-6Al-4V using plasma electrolytic oxidation (PEO) treatment. Ti-6Al-4V surface was treated using PEO in Mg containing electrolytes at 270V for 5 min. The phase, composition and morphology of the Mg ion containing oxide films were evaluated with X-ray diffraction (XRD), Attenuated total reflectance Fourier transform infrared (ATR-FTIR) and filed-emission scanning electron microscopy (FE-SEM) with energy dispersive X-ray spectrometer (EDS). The biocompatibility of Mg ion containing oxide films was evaluated by immersing in simulated body fluid (SBF). According to surface properties of PEO films, the optimum condition was formed when the applied was 270 V. The PEO films formed in the condition contained the properties of porosity, anatase phase, and near 1.7 Ca(Mg)/P ratio in the oxide film. Our experimental results demonstrate that Mg ion containing oxide promotes bone like apatite nucleation and growth from SBF. The phase and morphologies of bone like apatite were influenced by the Mg ion concentration.

Effect on 4H-SiC Schottky Rectifiers of Ar Discharges Generated in A Planar Inductively Coupled Plasma Source

  • Jung, P.G.;Lim, W.T.;Cho, G.S.;Jeon, M.H.;Lee, J.W.;Nigam, S.;Ren, F.;Chung, G.Y.;Macmillan, M.F.;Pearton, S.J.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.3 no.1
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    • pp.21-26
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    • 2003
  • 4H-SiC Schottky rectifiers were exposed to pure Ar discharges in a planar coil Inductively Coupled Plasma system, as a function of source power, of chuck power and process pressure. The reverse breakdown voltage ($V_B$) decreased as a result of plasma exposure due to the creation of surface defects associated with the ion bombardment. The magnitude of the decrease was a function of both ion flux and ion energy. The forward turn-on voltage ($V_F$), on-state resistance ($R_{ON}$) and diode ideality factor (n) all increased after plasma exposure. The changes in all of the rectifier parameters were minimized at low power, high pressure plasma conditions.

Fabrication and Its Characteristics of Ion Energy Spectrometer for Diagnostics of Plasma (플라즈마 진단을 위한 이온에너지 분석장치의 제작 및 특성 조사)

  • Kim, Kye-Ryung;Kim, Wan;Lee, Yong-Hyun;Kang, Hee-Dong
    • Journal of Sensor Science and Technology
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    • v.7 no.3
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    • pp.163-170
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    • 1998
  • An ion energy spectrometer which has the $45^{\circ}$ parallel electrostatic deflection plate was designed and constructed for measuring ion temperature in high temperature plasma. The energy calibration and the energy resolution were studied in detail for a hydrogen ion at the $0.24{\sim}1.92\;keV$ energy using electrostatic accelerator with a duoplasmatron ion source. The voltage of the deflection plate was linearly increased for the decreased ion detector position at the constant ion energy and decreased for the increased ion energy at the fixed ion detector position. The inclination of the deflection plate voltage to the ion energy was between 0.92 and 1.61, and linearly decreased for the increased the ion detector position. The measured energy resolution, which is $4.2%\;{\sim}\;11.6%$ in this experiment region, was improved for the increased ion dector position and ion energy. The relative efficiency was increased for the decreased the ion detector position. The ion energy spectrum of the DC plasma in the multi-purpose plasma generator was measured using this equipment. The ion temperature was 203-205 eV at the discharge voltage 320 V, discharge current 1.7 A.

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Effects of CF4 Plasma Treatment on Characteristics of Enhancement Mode AlGaN/GaN High Electron Mobility Transistors

  • Horng, Ray-Hua;Yeh, Chih-Tung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.62-62
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    • 2015
  • In this study, we study the effects of CF4 plasma treatment on the characteristics of enhancement mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs). The CF4 plasma is generated by inductively coupled plasma reactive ion etching (ICP-RIE) system. The CF4 gas is decomposed into fluorine ions by ICP-RIE and then fluorine ions will effect the AlGaN/GaN interface to inhibit the electron transport of two dimension electron gas (2DEG) and increase channel resistance. The CF4 plasma method neither like the recessed type which have to utilize Cl2/BCl3 to etch semiconductor layer nor ion implantation needed high power to implant ions into semiconductor. Both of techniques will cause semiconductor damage. In the experiment, the CF4 treatment time are 0, 50, 100, 150, 200 and 250 seconds. It was found that the devices treated 100 seconds showed best electric performance. In order to prove fluorine ions existing and CF4 plasma treatment not etch epitaxial layer, the secondary ion mass spectrometer confirmed fluorine ions truly existing in the sample which treatment time 100 seconds. Moreover, transmission electron microscopy showed that the sample treated time 100 seconds did not have etch phenomena. Atomic layer deposition is used to grow Al2O3 with thickness 10, 20, 30 and 40 nm. In electrical measurement, the device that deposited 20-nm-thickness Al2O3 showed excellent current ability, the forward saturation current of 210 mA/mm, transconductance (gm) of 44.1 mS/mm and threshold voltage of 2.28 V, ION/IOFF reach to 108. As IV concerning the breakdown voltage measurement, all kinds of samples can reach to 1450 V.

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Some Peculiarities of Photo-structural Transformations in Amorphous Chalcogenide Glassy Semiconductor Films

  • Prikhodko, O.;Almasov, N.;Korobova, Natalya
    • Journal of information and communication convergence engineering
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    • v.9 no.5
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    • pp.587-590
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    • 2011
  • The absence of deep traps for electrons in the spectrum of $As_{40}Se_{30}S_30$ localized states films obtained by ion sputtering was determined. Bipolar drift of charge carriers was found in amorphous $As_{40}Se_{30}S_30$ films of chalcogenide glassy semiconductors, obtained by ion-plasma sputtering of high-frequency, unlike the films of these materials obtained by thermal evaporation.

RECENT DEVELOppMENTS IN STUDIES ON DIAMOND FILMS BY ppLASMA CVD FOR FUTURE ELECTRONIC DEVICES

  • Hiraki, Akio
    • Proceedings of the Korean Vacuum Society Conference
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    • 1993.02a
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    • pp.6-6
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    • 1993
  • With brief instroduction of fabrication methods of dia.ond fillls by plasma CVD, recent progress in diamond research mainly done in the author's laboratory at Osaka University is reviewed.especially on the following topics: "low temperature diallond fabrication", "ion implantation", "hydrogen plasma treatment of ion-implanted diaaond to remove ion-induced damage", "Oxygen diffusion into the bulk assisted by the hydrogen treatllent", and "hole-burning effect".ffect".

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Inhibitions of $H^+$-ATPases and Ion Channels by Lanthanum

  • Kim, Young-Kee;Cho, Kwang-Hyun;Park, Soo-Jin
    • Proceedings of the Korean Biophysical Society Conference
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    • 2001.06a
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    • pp.39-39
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    • 2001
  • Many physiological processes of plant cells, such as nutrient uptake, salt tolerance, and cell enlargement, are mediated by ion transports across the plasma membrane. H$^{+}$-ATPases on both plasma and vacuolar membranes play major roles on active transports and ion channels mediate passive transports of various ions. It has been known that these proteins involved in cellular osmotic regulation and salt tolerance in the salt-accumulated soils.(omitted)

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Two-dimensional continuum modelling of an inductively coupled plasma reactor

  • Kim, Dong-Ho;Shung, Won-Young;Kim, Do-Hyun
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.2
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    • pp.128-133
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    • 2000
  • Numerical analysis of the transport phenomena in an inductively coupled plasma reactor was conducted with two-dimensional axisymmetric model including the electromagnetic field model, electron and species density models. The spatial distribution of the charged species in the ion flux to the wafer have been calculated to examine the influence of the process conditions including antenna and reactor geometry. The antenna radius had a significant influence on the plasma state and axial ion flux distribution.

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