• Title/Summary/Keyword: pixel array

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Calibration of monodisperse polystylene spheres of size from 1 to 10 ${\mu}m$ by using optical array sizing method (광학적 입자열 측정법에 의한 폴리스티렌구의 평균지름 측정)

  • 강주식
    • Korean Journal of Optics and Photonics
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    • v.10 no.1
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    • pp.21-26
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    • 1999
  • The technique for calibrating standard particles larger than 1 $\mu$m by using an optical array sizing method has been established. The system consists of an optical microscope with transmission light source, a CCD camera, and a computer equipped with a frame grabber. The center distance between two spheres located at both ends of a row which consists of N spheres is measured in terms of pixel numbers, and divided by (N-1) to obtain the average pixel numbers per particle. This value is multiplied by length conversion constant, which has been determined in advance, to obtain the mean diameter of polystylene spheres. The length conversion constant is found from the microscopic image of calibrated standard stage micrometer plate. In order to reduce error in finding center positions of the scale and particles in the image, a software filter which dilates bright (or dark) object has been used. Spheres having nominal size of 1, 2, 3, 5, and 10$\mu$m were measured, and the maximum deviation of the measured mean diameter valus from their certified values was 0.7%. Standard particles which is larger than 1 $\mu$m can be calibrated by this method with measuredment uncertainy (k=2) lees than 1.53%.

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Design of Imaging Optical System with 24mm Focal length for MWIR (MWIR용 24mm 초점거리를 가지는 결상광학계의 설계)

  • Lee, Sang-Kil;Lee, Dong-Hee
    • Journal of the Korea Convergence Society
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    • v.9 no.6
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    • pp.203-207
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    • 2018
  • This paper deals with the design and development of a lens system capable of imaging an infrared image of $3{\sim}5{\mu}m$ wavelength bands with a focal length of 24mm and good atmospheric transmission characteristics. The design used CodeV, a commercial design program, and the optimization is carried out with weighting to eliminate chromatic aberration, spherical aberration and distortion. The designed lens system consists of two lenses consisting of Si and Ge. Each lens has an aspherical surface on one side. And this optical system has the resolution of the characteristics that the MTF value is 0.40 at the line width of 29lp/mm and the MTF value is 0.25 at the line width of 20lp/mm. This optical system is considered to have the capability to be applied to the thermal imaging camera for MWIR using the $206{\times}156$ array infrared detector of $25{\mu}m$ pixels and the $320{\times}240$ array infrared detector of $17{\mu}m$ pixels.

Improved recognition of 3D objects using nonlinear correlator based on direct pixel mapping in curving-effective integral imaging (커브형 집적 영상에서 DPM 기반의 비선형 상관기를 이용한 3D 물체 인식 향상)

  • Lee, Joon-Jae;Shin, Donghak;Lee, Byung-Gook
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.1
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    • pp.190-196
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    • 2013
  • Curved integral imaging is a simple method to display 3D images in space using lens array and provides wide viewing angle. In this paper, we propose a nonlinear 3D correlator based on the direct pixel-mapping (DPM) method in order to improve the recognition performance of 3D target object in curving-effective integral imaging. With this scheme, the elemental image array (EIA) originally picked up from a partially occluded 3-D target object can be converted into a resolution enhanced new EIA by using DPM method. Then, through nonlinear cross-correlations between the reconstructed reference and the target plane images, the improved pattern recognition can be performed from the correlation outputs. To show the feasibility of the proposed method, some preliminary experiments are carried out and results are presented by comparing the conventional method.

Edge-Directed Color Interpolation on Disjointed Color Filter Array (분리된 컬러 필터 배열을 이용한 에지 방향 컬러 보간 방법)

  • Oh, Hyun-Mook;Yoo, Du-Sic;Kang, Moon-Gi
    • Journal of the Institute of Electronics Engineers of Korea SP
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    • v.47 no.1
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    • pp.53-61
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    • 2010
  • In this paper, we present a color interpolation algorithm that uses novel edge direction estimator and region classifier. The proposed edge direction estimator accurately determines the edge direction based on the correlation between the images obtained by the channel separated and down-sampled Bayer color filter array(CFA) pattern. The correlation is defined based on the similarity between the edge direction in the local region of the image and the shifting direction of the images. Also, the region of an image is defined as the flat, the edge, and the pattern-edge regions, where the edges are appeared repeatedly. When all the pixels in the image are classified into the three different regions, each pixel is interpolated horizontally or vertically according to the estimated direction. Experimental results show that the proposed algorithm outperforms the conventional edge-directed methods on objective and subjective criteria.

Fabrication and Characterization of Array Type of Single Photon Counting Digital X-ray Detector (Array Type의 Single Photon Counting Digital X-ray Detector의 제작 및 특성 평가)

  • Seo, Jung-Ho;Lim, Hyun-Woo;Park, Jin-Goo;Huh, Young;Jeon, Sung-Chea;Kim, Bong-Hui
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.32-32
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    • 2008
  • X-ray detector는 의료용, 산업용 등 다양한 분야에서 사용되어지고 있으며 기존의 Analog X-ray 방식의 환경오염, 저장공간 부족, 실시간 분석의 어려움 등의 문제점들을 해결하기 위하여 Digital X-ray로의 전환과 연구가 활발하며 이에 따른 관심도 높아지고 있는 살점이다. Digital X-ray detector는 p-영역과 n-영역 사이에 아무런 불순물을 도핑하지 않은 진성반도체(intrinsic semiconductor) 층을 접합시킨 이종접합 PIN 구조의 photodiode 이다. 이 소자는 역바이어스를 가해주면 p영역과 n영역 사이에서 캐리어 (carrier)가 존재하지 않는 공핍 영역이 발생하게 된다. 이런 공핍 영역에서 광흡수가 일어나면, 전자-정공 쌍이 발생한다. 그리고, 발생한 전자-정공 쌍에 전압이 역방향으로 인가되는 경우, 전자는 양의 전극으로 이동하고, 정공은 음의 전극으로 이동한다. 이와 같이, 발생한 캐리어들을 검출하여 전기적인 신호로 변환 시킨다. 고해상도의 Digital X-ray detector를 만들기 위해서는 누설전류에 의한 noise 감소와 소자의 높은 안정성과 내구성을 위한 높은 breakdown voltage를 가져야 한다. 본 연구에서는 Digital X-ray detector의 leakage current 감소와 breakdown voltage를 높이기 위하여 guradring과 gettering technology를 사용하여 전기적 특성을 분석하였다. 기판으로는 $10k\Omega{\cdot}cm$ resistivity를 갖으며, n-type <111>인 1mm 두께의 4인치 Si wafer를 사용하였다. 그리고 pixel pitch는 $100{\mu}m$이며 active area는 $80{\mu}m{\times}80{\mu}m$$32\times32$ array를 형성하여 X-ray를 조사하여 소자의 특성을 평가 하였다.

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Pixel-Structured Scintillator with Polymeric Microstructures for X-Ray Image Sensors

  • Jung, Im-Deok;Cho, Min-Kook;Bae, Kong-Myeong;Lee, Sang-Min;Jung, Phill-Gu;Kim, Ho-Kyung;Kim, Sung-Sik;Ko, Jong-Soo
    • ETRI Journal
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    • v.30 no.5
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    • pp.747-749
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    • 2008
  • We introduce a pixel-structured scintillator realized on a flexible polymeric substrate and demonstrate its feasibility as an X-ray converter when it is coupled to photosensitive elements. The sample was prepared by filling $Gd_2O_2S:Tb$ scintillation material into a square-pore-shape cavity array fabricated with polyethylene. For comparison, a sample with the conventional continuous geometry was also prepared. Although the pixelated geometry showed X-ray sensitivity of about 58% compared with the conventional geometry, the resolving power was improved by about 70% above a spatial frequency of 3 $mm^{-1}$. The spatial frequency at 10% of the modulation-transfer function was about 6 $mm^{-1}$.

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A Stereo Matching Algorithm with Projective Distortion of Variable Windows (가변 윈도우의 투영왜곡을 고려한 스테레오 정합 알고리듬)

  • Kim, Gyeong-Beom;Jeong, Seong-Jong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.3
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    • pp.461-469
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    • 2001
  • Existing area-based stereo algorithms rely heavily on rectangular windows for computing correspondence. While the algorithms with the rectangular windows are efficient, they generate relatively large matching errors due to variations of disparity profiles near depth discontinuities and doesnt take into account local deformations of the windows due to projective distortion. In this paper, in order to deal with these problems, a new correlation function with 4 directional line masks, based on robust estimator, is proposed for the selection of potential matching points. These points is selected to consider depth discontinuities and reduce effects on outliers. The proposed matching method finds an arbitrarily-shaped variable window around a pixel in the 3d array which is constructed with the selected matching points. In addition, the method take into account the local deformation of the variable window with a constant disparity, and perform the estimation of sub-pixel disparities. Experiments with various synthetic images show that the proposed technique significantly reduces matching errors both in the vicinity of depth discontinuities and in continuously smooth areas, and also does not be affected drastically due to outlier and noise.

A SPICE-based 3-dimensional circuit model for Light-Emitting Diode (SPICE 기반의 발광 다이오드 3차원 회로 모델)

  • Eom, Hae-Yong;Yu, Soon-Jae;Seo, Jong-Wook
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.44 no.2
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    • pp.7-12
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    • 2007
  • A SPICE-based 3-dimensional circuit model of LED(Light-Emitting Diode) was developed for the design optimization and analysis of high-brightness LEDs. An LED is represented as an array of pixel LEDs with small preassigned areas, and each of the pixel LEDs is composed of circuit networks representing the thin-film layers(n-metal, n- and p-type semiconductor layers, and p-metal), ohmic contacts, and pn-junctions. Each of the thin-film layers and contact resistances is modeled by a resistance network, and the pn-junction is modeled by a conventional pn-junction diode. It has been found that the simulation results using the model and the corresponding parameters precisely fit the measured LED characteristics.

CMOS Image Sensor with Dual-Sensitivity Photodiodes and Switching Circuitfor Wide Dynamic Range Operation

  • Lee, Jimin;Choi, Byoung-Soo;Bae, Myunghan;Kim, Sang-Hwan;Oh, Chang-Woo;Shin, Jang-Kyoo
    • Journal of Sensor Science and Technology
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    • v.26 no.4
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    • pp.223-227
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    • 2017
  • Conventional CMOS image sensors (CISs) have a trade-off relationship between dynamic range and sensitivity. In addition, their sensitivity is determined by the photodiode capacitance. In this paper, CISs that consist of dual-sensitivity photodiodes in a unit pixel are proposed for achieving wide dynamic ranges. In the proposed CIS, signal charges are generated in the dual photodiodes during integration, and these generated signal charges are accumulated in the floating-diffusion node. The signal charges generated in the high-sensitivity photodiodes are transferred to the input of the comparator through an additional source follower, and the signal voltages converted by the source follower are compared with a reference voltage in the comparator. The output voltage of the comparator determines which photodiode is selected. Therefore, the proposed CIS composed of dual-sensitivity photodiodes extends the dynamic range according to the intensity of light. A $94{\times}150$ pixel array image sensor was designed using a conventional $0.18{\mu}m$ CMOS process and its performance was simulated.

MIRIS 환경시험 준비현황 및 시스템 최적화

  • Mun, Bong-Gon;Park, Yeong-Sik;Lee, Dae-Hui;Cha, Sang-Mok;Park, Seong-Jun;Lee, Chang-Hui;Nam, Uk-Won;Jeong, Ung-Seop;Pyo, Jeong-Hyeon;Lee, Deok-Haeng;Lee, Seung-U;Park, Jong-O;Matsumoto, Toshio;Han, Won-Yong
    • The Bulletin of The Korean Astronomical Society
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    • v.36 no.1
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    • pp.64.2-64.2
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    • 2011
  • MIRIS (Multi-purpose InfraRed Imaging System), 다목적 적외선 영상시스템은 한국천문연구원에서 개발하고 있는 과학위성 3호의 주 탑재체이다. MIRIS 우주관측카메라는 한국에서 최초로 발사되는 천문우주관측용 적외선 우주망원경이다. 그 유효 구경은 80mm 이고, 탑재되는 검출기는 Teledyne사의 PICNIC $256{\times}256$ Array 이며, 이 검출기를 적용한 관측 화각(FoV)은 $3.67 deg{\times}3.67 deg$, Pixel Scale은 51.6 arcsec/pixel 이다. MIRIS는 현재 비행모델의 납품을 앞두고 우주환경 시험을 준비 및 진행하고 있으며, 시스템의 최적화 작업을 함께 수행하고 있다. 최근에 과학기술위성 3호의 발사체가 러시아 Dnepr로 결정되면서 시험 조건이 변경된 시험 항목에 대해서 EQM의 Sine진동, 충격 시험이 Qualification level로 진행되었다. 그리고 MIRIS 비행모델의 열진공 환경 시험 및 진동시험에 대한 준비 현황을 보고한다. MIRIS 비행 모델의 환경시험은 실제 위성이 겪는 acceptance level로 진행되며, 모든 시험을 통과하면 최종 납품이 이뤄질 예정이다. 또한 시스템의 최적화를 위해 수행했던 조립의 수정 항목들도 함께 보고한다.

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