• Journal of the Korean Wood Science and Technology
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• v.36 no.4
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• pp.58-65
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• 2008

Most connections for the glulam structural members consisted of connector and fastener. The mechanical behaviour of the connection can be occurred by the dowel bearing resistance and wood shear by the fastener. This study aims at the examination of the shear properties for the small specimen with lamination components and for the full-sized pin connection and the moment resisting property for the double shear full-sized pin connection using structural column and beam members. Small specimens including glue line shows greater density and shear strength by the lamination effect than other specimens. It is needed that estimations of double shear property and moment resistance for the pin connections should be adjusted in some degree. For the better and safe estimation of moment resistance strength for the column-beam pin connection, however, the shear strength of small specimens should be deducted by 10%.

• Journal of the Korean Society of Propulsion Engineers
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• v.23 no.4
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• pp.28-34
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• 2019

In this study, pin-fin arrays, which are widely used for cooling turbine blades, were studied. The vortex generator in pin-fin arrays is located in front of the circular tube. The cross-section of the vortex generator is NACA-9410. The purpose of this study is to analyze heat transfer performance and flow characteristics of pin-fin arrays. The position of vortex generator is changed with the vertical flow direction on the bottom wall. Pin-fin arrays were calculated with 6000, 10000 and 15000 Reynolds number. The commercial program ANSYS v18.0 CFX and the turbulence model $k-{\omega}$ SST were used. As a result, the heat transfer performance increased up to 5.8% and pressure loss increased less than 1%.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of Korean Society of Steel Construction
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• v.10 no.4 s.37
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• pp.769-777
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• 1998

That main purpose of this paper is to clarify the effects of geometrically initial imperfection on the buckling characteristics of the pin-jointed single-layer lattice domes with triangular network. Additionally, this study is to get the data that is to formulate the general buckling-strength equation taking geometrically initial imperfection into consideration. Analysis is undertaken by using the frame analysis method which is based on the finite element method dealing with geometrically nonlinear problem.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.19 no.5
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.7
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• pp.623-629
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• 2004

Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.1
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• pp.373-379
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• 2020

This study performed stress and fatigue life analysis of the damping hinge of a built-in side-by-side refrigerator that occurs when the door is opened to the maximum angle. An analysis of the initial design showed that stress concentration occurred at the corner between the cylinder and upper disk of the bracket pin, and the maximum stress exceeded the yield strength. The maximum stress location and the calculated fatigue life were consistent with the door opening-and-closing endurance test results for a prototype. Three cases of design improvement for the bracket pin were derived with the aim of reducing the stress concentration that appeared in the initial design. An analysis of the cases showed that inserting a fillet between the disk and the cylinder of the bracket pin reduced the stress and increased the fatigue life. Moreover, changing the disk into two steps was more favorable. In conclusion, the best design improvement was the case that the disk was changed to two steps and the fillet with a large radius was inserted. In that case, the stress was the smallest and the fatigue life was infinite.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• Tribology and Lubricants
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• v.24 no.6
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• pp.315-319
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• 2008

This paper presents the interface bonding characteristics between a phosphor bronze and a steel plate for pin-bush bearings. The pin-bush bearing is an important component in which is used to reduce a friction loss and a wear against the piston pin. The pin-bush bearing is manufactured by hot-pressing a phosphor bronze and a back metal of a steel plate. This paper investigated the bonding interface characteristics in which is manufactured by melting a copper based bronze and a steel plate. The hardness from the inner surface of a bronze to the outer one of steel has been measured using a Vickers hardness tester. The experimental results show that the hardness of a bronze is superior to that of the conventional bronze and the transient hardness of pin-bush bearings is gradually increasing to the hardness of the steel back metal. This means that the bonding interface zone of pin-bush bearings may be fabricated by defusing a bronze to the steel plate due to a density difference between two materials.

• Journal of Korean Society of Steel Construction
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• v.16 no.5 s.72
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• pp.705-712
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• 2004

To investigate the mechanical behavior of pin cups created from steel pipes embedded in concrete, test blocks were made and load tests were conducted. The pin was inserted in the pin cup at various depths and was loaded in a lateral direction at a constant displacement speed. A formula, which took into consideration the deformation and failure shapes of the pin cups, observed during and after the tests, was used to estimate its mechanical behavior. The test values were determined to be relevant to the formula and were distributed within a reasonably narrow range. The mean and the 95% survival probability value of maximum resistance were determined by factoring the formula at 1.01 and 0.92, respectively.