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Pin Pull Characteristics of Pin Lead with Variation of Mechanical Properties of Pin Lead in PGA (Pin Grid Array) Package  

Cho, Seung-Hyun (Dept. of Mechanical engineering, Dongyang Mirae University)
Choi, Jin-Won (ACI Division, Samsung Electro-Mechanics Co., LTD)
Park, Gyun-Myoung (Integrated Smart Mold Technologyl Center, Korea Institute of Industrial Technology)
Publication Information
Journal of the Microelectronics and Packaging Society / v.17, no.1, 2010 , pp. 9-17 More about this Journal
Abstract
In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.
Keywords
Pin pull strength; PGA (Pin Grid Array); Reliability; total strain energy density; FEM;
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Times Cited By KSCI : 1  (Citation Analysis)
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