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Experiments on the Heat Transfer and Pressure Drop Characteristics of a Channel with Pin-Fin Array  

신지영 (동의대학교 기계공학과)
손영석 (동의대학교 기계공학)
김상민 (동의대학교 대학원 기계공학)
이대영 (한국과학기술연구원)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.16, no.7, 2004 , pp. 623-629 More about this Journal
Abstract
Rapid development of electronic technology requires small size, high density packaging and high power of electronic devices, which result in more heat generation by the electronic system. Present cooling technology may not be adequate for the thermal management in the current state-of-the-art electronic equipment. Forced convective heat transfer in a channel filled with pin-fin array is studied experimentally in this paper as an alternative cool-ing scheme for a high heat-dissipating equipment. Various configurations of the pin-fin array are selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. In the low porosity region, interfacial heat transfer and pressure drop seem to show different trend compared to the conventional heat transfer process.
Keywords
Electronic device; Cooling technology; Pin-fin array; Porosity;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
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[ Cho,H.H.;Goldstein,R.J. ] / Transactions of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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[ VanFossen,G.J. ] / ASME J. of Heat Transfer
9 /
[ Kraus,A.D.;Bar-Cohen, A. ] / Thermal Analysis and Control of Electronic Equipment
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[ Koh,J.C.Y.;Stevens,R.L. ] / ASME J. Heat Transfer   DOI
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[ Kim,S.J.;Kim,D.;Lee,D.Y. ] / Int. J. of Heat and Mass Transfer   DOI   ScienceOn