• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.9-17
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• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.6
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• pp.131-138
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• 2004

The objective of this paper is to decide optimal location of a pin-hole to minimize stress concentration around the hole in a rotating disc. The focus of this investigation is to evaluate the effect of pin-hole on stress distribution around the hole using optimum design technique and finite element analysis. Design variables are the radial and the angular location of pin-hole from center of the hole and objective function is the maximum stress around hole in a rotating disc. Using first order method of optimization technique, we found that the maximum equivalent stress around the hole with optimized pin-hole could be reduced by 15.1% compared to that without pin-hole.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.5
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• pp.2272-2278
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• 2011

It is essential to various evaluate about statistic character of the signal and additional noise for optimization of the optical communication system. We expressed various error probability with the m which was bandwidth and a bit numerical function and carried out performance evaluation of a PIN receiver. This research analyzed the receiving sensitivity of the PIN receiver and verified reception sensitivity through computer simulation in the optical communication system. As a result, the receiving sensitivity for PIN receiver are $9.2{\times}10^4$ photon/bit for given error probability.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.7
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• pp.703-714
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• 2010

This paper describes the design optimization of a rotating rectangular channel with staggered arrays of pin-fins by Kriging metamodeling technique. Two non-dimensional variables, the ratio of the height to the diameter of the pin-fins and the ratio of the spacing between the pin-fins to the diameter of the pin-fins are chosen as the design variables. The objective function that is a linear combination of heat transfer and friction loss related terms with a weighting factor is selected for the optimization. To construct the Kriging model, objective function values at 20 training points generated by Latin hypercube sampling are evaluated by a three-dimensional Reynolds-averaged Navier-Stokes (RANS) analysis method with the SST turbulence model. The Kriging model predicts the objective function value that agrees well with the value calculated by the RANS analysis at the optimum point. The objective function is reduced by 11% by the optimization of the channel.

• Journal of Industrial Technology
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• v.29 no.B
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• pp.3-7
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• 2009

A cylindrical pin fin with inside fluid is optimized based on fixed fin volume by using the one dimensional analytic method. Heat loss from the fin and the pin fin radius for fixed fin volume is presented as a function of the fin length. Temperature variation of the fin with the variation of ambient and inside fluid convection characteristic numbers and fin base thickness is listed. The maximum heat loss at the practical fin length and corresponding optimum fin length and radius are presented as a function of fin base thickness, inside convection characteristic number, fin volume and ambient convection characteristic number. One of the results shows that the optimum pin fin shape becomes relatively fatter as the fin volume increases.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.574-578
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• 2003

The objective of this paper is to decide optimal location of pin-hole to minimize stress concenstation around hole in rotating disc. The focus of this investigation is to evaluate the effect of pin-hole for stress distribution around hole using optimum design technic and finite element analysis. Design variables are radial and angular location of pin-hole from center of hole, objective function is maximum stress around hole in rotating disc. We use first order method of optimization technic.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 1991.04a
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• pp.117-121
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• 1991

• Journal of Industrial Technology
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• v.28 no.B
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• pp.3-7
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• 2008

A cylindrical pin fin with variable fin base thickness is optimized based on fixed outer radius by using the one dimensional analytic method. Heat loss from the pin fin with fixed outer radius is presented as a function of the fin length. The ratio of in length for optimum heat loss to that for the maximum heat loss is listed. The maximum heat loss and effectiveness and the fin length for the optimum heat loss are presented as a function of fin base thickness and outer radius. One of the results presents the maximum effectiveness decreases rapidly first and then decreases slowly as the fin outer radius increases.

• Proceedings of the Safety Management and Science Conference
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• 2008.04a
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• pp.417-428
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• 2008

Designers have to consider voice of customer, process capability, manufacturing standards & condition, manufacturing method, characteristics of products to decide tolerances. Especially, in case of position of hole and pin, designers have to consider process capability to decide tolerances. The traditional position tolerances used in a drawing are theoretical values which are allocated to position under the worst case assembling condition that both hole and pin are the maximum material condition(MMC). However, When the process capability is high, more exact product size can be produced under stable manufacturing condition. larger clearance of hole and pin can be allocated. In this point of view, manufacturer could increase the yield by allocating larger position tolerance than theoretical position tolerance of hole and pin considering process capability.

• Journal of the Korea Safety Management & Science
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• v.11 no.1
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• pp.75-85
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• 2009

Designers have to consider voice of customer, process capability, manufacturing standards & condition, manufacturing method and characteristics of products to decide tolerances. Especially, in case of position of hole and pin, designers have to consider process capability to decide tolerances. The traditional position tolerances used in a drawing are theoretical values which are allocated to position under the worst case assembling condition that both hole and pin are the maximum material condition(MMC). However, when the process capability is high, more exact product size can be produced under stable manufacturing condition. Larger clearance of hole and pin can be allocated. In this point of view, manufacturer could increase the yield by allocating larger position tolerance than theoretical position tolerance of hole and pin considering process capability.