• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.1
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• pp.137-141
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• 2008

Biochip, which implements bioanalytical process on a tiny surface, is one of candidates for medical diagnosis, drug screening, and molecular sensing. In general, a type of biochip based on microfluidics is composed of microcomponents including microchannel, pump, and valve, which require complicated processes. In this study, gray-scale photolithography(GSPL) was applied to fabricate a biochip with multiple layers. A mould for casting PDMS(polydimethylsiloxane) channel, was fabricated using GSPL. A gray-photomask was prepared by printing gray patterns on a high-quality glossy paper followed by photoreducing by 10:1 onto the photo-film. The formation of multiple layers was studied according to the change of gray level of pattern and the developing time. A biochip composed of a weir(multiple layer structure) and a reaction chamber in a single microchannel was fabricated in a glass plate. Finally, we investigated the application of biochip to antigen-antibody reaction by packing the microbead coated with antibody.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.9-10
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• 2006

The patterning for the active layer of organic semiconductors is important to attain completely organic-based OTFTs(Organic Thin Film Transistors). We studied on possibility of the application of the conventional photolithography technique to pattern the organic active layer poly(3-hexylthiophene)(P3HT). Patterned P3HT-based OTFTs with Bottom Contact(BC) configuration were fabricated using the conventional photolithography. We achieved field-effect mobilities in the saturation regime ${\sim}1.2{\times}10^{-3}cm^2/V{\cdot}s$, $I_{on/off}$ ratios ${\sim}10^5$ in the subtractive method, ${\sim}8{\times}10^{-4}cm^2/V{\cdot}s$, $I_{on/off}$ ratios ${\sim}10^3$ in the additive one.

• Journal of the Korea Society for Simulation
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• v.14 no.4
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• pp.55-68
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• 2005

The advancement in semiconductor technology is leading toward smaller critical dimension designs and larger wafer manufactures. Due to such phenomena, semiconductor industry is in need of an accurate control of the process. Photolithography is one of the key processes where the pattern of each layer is formed. In this process, precise superposition of the current layer to the previous layer is critical. Therefore overlay parameters of the semiconductor photolithography process is targeted for this research. The complex relationship among the input parameters and the output metrologies is difficult to understand and harder yet to model. Because of the superiority in modeling multi-nonlinear relationships, neural networks is used for the simulator modeling. For training the neural networks, conjugate gradient method is employed. An experiment is performed to evaluate the performance among the proposed neural network simulator, stepwise regression model, and the currently practiced prediction model from the test site.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.575-579
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• 2016

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.615-616
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• 2013

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.619-620
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• 2008

• 한국초전도학회:학술대회논문집
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• 2008.08a
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• pp.83-83
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• 2008

• Safety and Health at Work
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• v.2 no.3
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• pp.210-217
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• 2011

Objectives: The purpose of this study was to measure the concentration of volatile organic compound (VOC)s originated from the chemicals used and/or derived from the original parental chemicals in the photolithography processes of semiconductor manufacturing factories. Methods: A total of four photolithography processes in 4 Fabs at three different semiconductor manufacturing factories in Korea were selected for this study. This study investigated the types of chemicals used and generated during the photolithography process of each Fab, and the concentration levels of VOCs for each Fab. Results: A variety of organic compounds such as ketone, alcohol, and acetate compounds as well as aromatic compounds were used as solvents and developing agents in the processes. Also, the generation of by-products, such as toluene and phenol, was identified through a thermal decomposition experiment performed on a photoresist. The VOC concentration levels in the processes were lower than 5% of the threshold limit value (TLV)s. However, the air contaminated with chemical substances generated during the processes was re-circulated through the ventilation system, thereby affecting the airborne VOC concentrations in the photolithography processes. Conclusion: Tens of organic compounds were being used in the photolithography processes, though the types of chemical used varied with the factory. Also, by-products, such as aromatic compounds, could be generated during photoresist patterning by exposure to light. Although the airborne VOC concentrations resulting from the processes were lower than 5% of the TLVs, employees still could be exposed directly or indirectly to various types of VOCs.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.482-486
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies, such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper presents that the recent development and our research goals in FIB nano machining technology are given. The emphasis will be on direct milling, or chemical vapor deposition techniques (CVD), and this can distinguish the FIB technology from the contemporary photolithography process and provide a vital alternative to it. After an introduction to the technology and its FIB principles, the recent developments in using milling or deposition techniques for making various high-quality devices and high-precision components at the micro/nano meter scale are examined and discussed. Finally, conclusions are presented to summarize the recent work and to suggest the areas for improving the FIB milling technology and for studying our future research.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.1 s.190
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• pp.71-78
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• 2007

Abrasive jet machining (AJM) has been traditionally used for removing rusts or paints. Nowadays, this is promising technology for micro bulk machining where brittle substrate materials are used. In order to get accurate details, masks such as metal, polymer or elastomer is inevitable. Among them, photo polymer which is sensitive to the light has been attractive for it's high accuracy using photolithography. In this research, SU-8 as a photo polymer is used since it is adequate for making thick mask. So, this paper describes how to make AJM masks using SU-8 with a photolithography process, and investigates the characteristics of SU-8 masks during AJM process. Also, an example of fabrication using AJM was shown.