• 한국표면공학회지
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• 제37권2호
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• pp.110-118
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• 2004

The corrosion of pure titanium (CP- Ti Grade 2) and titanium alloy (Ti6Al4V ELI) were studied under various conditions of simulated body fluids. The static immersion test and the electrochemical test were performed in accordance with ISO 10271 : 2001. For the electrochemical test, the open circuit potential was monitored as a function of time, and the cyclic polarization curve was recorded. The corrosion resistance was evaluated from the values of corrosion potential, passivation current density, breakdown potential, and the shape of hysteresis etc. The effects of alloy type, surface condition, temperature, oxygen, and constituents in the fluids such as acid, chloride were estimated. Both specimens had extremely low dissolution rate in the static immersion test. They showed strong passivation characteristics in the electrochemical test. They maintained negligible current density throughout the wide anodic potential range. The passive layer was not broken up to 2.0 V (vs. SCE). The hysteresis and the shift of passivation potential toward the anodic direction was observed during the reversed scan. The passivation process appeared to be accelerated by oxygen in air or that dissolved in the fluids. The passivation also proceeded without oxygen by the reaction of constituents in the fluids. Acid or chloride in the fluids, specially later weakened the passive layer, and then induced higher passivation current density and less shift of passivation potential in the reversed scan. CP-Ti Grade 2 was more reactive than Ti6Al4V ELI in the fluids containing acid or chloride, but thicker layer produced on its surface provided higher corrosion resistance.

• Corrosion Science and Technology
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• 제7권1호
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• pp.45-49
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• 2008

The cyclic polarisation technique was applied to determine the corrosion, primary-passivation, transpassive, and protection potential of AISI 316L stainless steels immersed in 3550-ppm NaCl solution containing sulfate in the content up to 3000 ppm. The solutions were kept constant at $27^{\circ}C$ and saturated by laboratory air. The solution pH was varied from 3 to 11. Each type of potentials was plotted in function of pH and linked as lines to determine the different zones in the constructed potential-pH diagram. The predominant regimes of the immunity, general corrosion, perfect passivation, imperfect passivation, and pitting corrosion were determined based on those lines of potentials. Comparing to the potential-pH diagram of specimens immersed in the aerated and deaerated 3550-ppm NaCl solutions, the addition of 3000-ppm $Na_2SO_4$ to these solutions increased the overall, perfect and imperfect, passivation regime by shifting the transpassive-potential line to the noble direction. However, it also widened the imperfect passivation area. The addition of $Na_2SO_4$ did not significantly affect the corrosion potential. It was found that the dissolved oxygen tends to negatively shift the transpassive-potential and protection-potential lines at all studied pH. The considerable effect of dissolved oxygen on corrosion and primary-passivation potentials could not be observed.

• 전기전자학회논문지
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• 제23권3호
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• pp.1033-1037
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• 2019

GaN-based sensors have been widely investigated thanks to its potential in detecting the presence of hydrogen. In this study, we fabricated hydrogen gas sensors with AlGaN/GaN heterojunction and investigated how the sensing performance to be affected by SiN surface passivation. The gas sensor employed a high electron mobility transistors (HEMTs) with 30 nm platinum catalyst as a gate to detect the hydrogen presence. SiN layer was deposited by inductively-coupled chemical vapor deposition as post-passivation. The sensors with SiN passivation exhibited hydrogen sensing characteristics with various gas flow rates and concentrations of hydrogen in inert background gas at $200^{\circ}C$ similar to the ones without passivation. Aside from quick response time for both sensors, there are differences in sensitivity and recovery time because of the existence of the passivation layer. The results also confirmed the dependence of sensing performance on gas flow rate and gas concentration.

• 대한화학회지
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• 제18권6호
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• pp.391-399
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• 1974

금속 코발트의 부식과 부동화현상들을 전기화학적 실험방법들을 써서 연구하였다. Tafel slope, Flade potential의 pH의존도, 부식속도의 반응역학적 데이타등으로 부터 코발트와 붕산염완충용액 사이 계면에서 일어나는 부식과 부동화 과정들의 메카니즘을 도출하였다. 금속표면에 흡착된 히드록실기가 표면산화와 부동화막의 형성에 참여하는 것으로 나타났다. 표면막의 성장속도에 관한 데이타로 보아 부동화피막은 "전기장에 의한-이온-이동" 과정에 의하여 성장하는 것으로 보인다. 측정된 표면막의 두께는 약 10${\AA}$에서 20${\AA}$에 이르렀다.

• 대한금속재료학회지
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• 제47권10호
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• pp.644-651
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• 2009

The passivation (or deactivation) of a metal surface during oxide film formation has been quantitatively explored for a ferritic stainless steel by using dynamic electrochemical impedance spectroscopy (DEIS). For this purpose, the electrochemical impedance spectra were carefully examined as a function of applied potential in the active nose region of the potentiodynamic polarization curve, to separate the charge transfer resistance and oxide film resistance. From the discrepancy in the potential dependence between the experimental charge transfer resistance and the semi-empirically expected one, the degree of passivation could be quantitatively estimated. The sensitivity of passivation of the steel surface to anodic potential, which might be the measure of the quality of the oxide film formed under unit driving force or over-potential, decreased by 31% when 3.5 wt% NaCl was added to a 5 wt% $H_2SO_4$ solution.

• 전기화학회지
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• 제10권1호
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• pp.14-19
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• 2007

Cu-RDE를 이용하여 borate 완충용액에서 Cu의 부식과 부동화 과정의 반응구조를 연구하였다. 혼합 전위(mixed potential) 이론을 도입하여 대류확산의 조건(convective diffusion)에서 회전속도의 증가에 따라 부식전위가 양의 방향으로 증가하는 모형을 발견하였다. 산화에 의한 생성물은 중간물질 $Cu(OH)_{ads}$를 거쳐, 부식, 부동화의 시작, 중간, 마지막 등의 영역에서 각각 ${Cu(OH)_2}^-,\;Cu_2O,\;Cu(OH)_2,\;CuO$인 것으로 제안하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.126-129
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point, the passivation potential (PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1369-1371
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• 2001

This paper describes on thinning SDB SOI substrates by SDB technology and Electro-chemical etch-stop. The surface of the fabricated SDB SOI substrates is more uniform than that grinding or polishing by mechanical method, and this process is possible to accurate SOI thickness control. During Electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential (OCP) point and the passivation potential (PP) poin and determinated to anodic passivation potential. The surface roughness and selectively controlled thickness of the fabricated SOI substrates were analyzed by using AFM and SEM, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 영호남학술대회 논문집
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• pp.301-306
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method, and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop, leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point, the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM, respectively.

• 한국전기전자재료학회논문지
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• 제13권5호
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• pp.431-436
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• 2000

This paper describes on the fabrication of a SOI substrate by SDB technology and electrochemical etch-stop. The surface of the thinned SDB SOI substrate is more uniform than that of grinding or polishing by mechanical method and this process was found to be a very accurate method for SOI thickness control. During electrochemical etch-stop leakage current versus voltage curves were measured for analysis of the open current potential(OCP) point the passivation potential(PP) point and anodic passivation potential. The surface roughness and the controlled thickness selectivity of the fabricated a SDB SOI substrate were evaluated by using AFM and SEM respectively.