• 한국전자파학회논문지
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• 제13권6호
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• pp.528-537
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• 2002

본 논문에서는 능동소자를 포함하는 마이크로파 회로의 주파수 특성을 해석하기 위하여 확장된 유한차분 시간영역법 (FDTD) 을 이용했다. R, L, C와 같은 집중소자가 전송선로에 삽입된 FDTD 집중소자 모델링을 통해 하이브리드 회로 해석에 대한 기초 연구를 수행하였고, 네트워크 모델링을 이용하여 기생 커패시턴스와 인덕턴스의 값을 추출함으로써 보다 정확한 기생, 방사, 결합까지 고려하는 FDTD만의 고유한 주파수 응답을 확인할 수 있었다. 또한 FDTD를 이용하여 모델링된 다이오드를 사용한 평형 혼합기를 설계하여 상용 회로 시뮬레이터보다 정확하고 실제적인 회로의 주파수 응답을 획득하였다.

• 한국공작기계학회논문집
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• 제17권2호
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.51-57
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• 2013

The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

• 한국전자파학회논문지
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• 제27권10호
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• pp.877-882
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• 2016

본 논문에서는 LC 공진회로를 이용한 2 단자 능동 인덕터를 제안한다. 제안된 회로는 기존 자이레이터 구조의 1 단자 능동 인덕터들을 캐스코드 형태로 결합하였으며, 두 자이레이터 사이에 LC 공진회로를 추가시켰다. LC 공진회로는 능동 인덕터를 구성하는 트랜지스터의 기생 성분들을 상쇄시킴으로써 넓은 대역에서 높은 Q-지수를 제공한다. 제안된 회로는 삼성전자 65 nm 공정을 이용하여 시뮬레이션과 제작을 수행하였으며, 1~6 GHz 대역에서 2 nH의 일정한 인덕턴스와 40 이상의 높은 Q-지수를 가진다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.405-408
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• 2000

We designed and fabricated VCO using inductive reactance variation at 2GHz. A varactor diode is one of the main devices in VCO, which varies capacitance depending on reverse voltage. In this paper, a varactor diode is not used as a variable capacitive reactance device but as an inductive device. The circuit design and simulation have been carried out using HP-MDS. The fabricated VCO is measured using the HP 8532B spectrum analyzer and the HP 4352B VCO/PLL analyzer. The experimental result shows the phase noise -110dBc/Hz at a 100kHz offset frequency, the control voltage sensitivity of 23MHz/V and a -3.5dBm output power with a D.C. current consumption of 5.9mA. The simulation and measurements show exact agreement except with regard to the oscillation frequency. The measured oscillation frequency is lower than the simulation result because there is some parasitic inductance in the PCB layout.

• Journal of Power Electronics
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• 제14권3호
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• pp.413-420
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• 2014

The conventional Phase-Shift Full-Bridge (PSFB) converter has a serious voltage spike because of the ringing between the leakage inductance of the transformer and the parasitic output capacitance of the secondary side rectifier switches. To overcome this problem, an asynchronous active clamp technique employing an auxiliary DC/DC converter has been proposed. However, an exact analyses for designing the auxiliary DC/DC converter has not been presented. Therefore, the amount of power that is supposed to be handled in the auxiliary DC/DC converter is calculated through a precise mode analyses in this paper. In addition, this paper proposes a lossy snubber circuit with hysteresis characteristics to reduce the burden that the auxiliary DC/DC converter should take during the starting interval. This technique results in optimizing the size of the magnetic component of the auxiliary DC/DC converter. The operational principles and the theoretical analyses are validated through experiments with a 48V-to-30V/15A prototype.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2017년도 전력전자학술대회
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• pp.231-232
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• 2017

This paper describes the design and implementation of a 2.5kW (500V, 5A) simmer circuit that maintains the ionization of xenon gas inside the lamp. The design is based on a LCC resonant converter in continuous conduction mode (CCM) with above resonant frequency to take advantage of high power density from using parasitic elements such as the leakage inductance in a power transformer. In addition, since the converter has current source output characteristics, it is suitable for maintaining ionization of the lamp having the negative resistance load characteristic. To verify this converter design, PSpice modeling was performed. Finally, the developed simmer circuit is verified by a resistive load of rated performance and the Ionization maintenance operation of the xenon flash lamp.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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• pp.384-387
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• 2009

There is an increasing demand for efficient high power/weight auxiliary power supplies for use on high speed traction application. Many new conversion techniques have been proposed to reduce the voltage and current stress of switching components, and the switching losses in the traditional pulse width modulation (PWM) converter. Especially, the phase shift full bridge zero voltage switching PWM techniques are thought must desirable for many applications because this topology permits all switching devices to operate under zero voltage switching(ZVS) by using circuit parasitic components such as leakage inductance of high frequency transformer and power device junction capacitance. The proposed topology is found to have higher efficiency than conventional soft-switching converter. Also it is easily applicable to phase shift full bridge converter by applying an energy recovery snubber consisted of fast recovery diodes and capacitors.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2017년도 추계학술대회
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• pp.238-240
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• 2017

동축 선로를 이용한 발룬은 쉬운 제작, 높은 동작 전력, 안정적인 동작으로 초고주파 회로에서 자주 이용된다. 하지만, 동축 선로 발룬은 동축 선로와 기판에 존재하는 마이크로스트립 선로와의 연결할 때에 발생하는 기생 리액턴스 성분과 동축 선로 자체가 가지는 인덕턴스와 케패시턴스 성분에 의해 정확한 발룬 동작 특성을 예상하기 어렵다. 본 논문에서는 역위상 특성을 가지는 동축 선로 발룬 두 출력 단자에서의 위상 특성을 측정하였다. 이를 바탕으로 보다 개선된 동축 선로 발룬 제작 가능성에 대해 살펴보려 한다.

• ETRI Journal
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• 제46권2호
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• pp.323-332
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• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.