• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.12
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• pp.549-554
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• 2006

In this paper we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity between electrode and ferroelectric film. $Pb_{1.1}(Zr_{0.52}Ti_{0.48})O_3$ (shortly PZT) ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of PZT films. Removal rate, WIWNU% and surface roughness have been found to depend on slurry abrasive types and their hardness, especially, surface roughness and planarity were strongly depends on its pH value. A maximum in the removal rate is observed in the silica slurry, in contrast with the minimum removal rate occurs at ceria slurry. We found that the surface roughness of PZT films can be significantly reduced using the CMP technique.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1731-1732
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• 2006

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.05a
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• pp.399-400
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• 2023

Current building structural standards require the shear strength and rigidity in the design of vertical construction joints in a slurry wall. This paper proposes a shear key resistance method for shear connection of vertical construction joints, and compares its structural performance with the currently prevalent method of shear friction rebar. The study found the structural performance of the shear key resistance method was significantly better than that of the shear friction rebar method.

• Journal of Animal Environmental Science
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• v.12 no.3
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• pp.161-168
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• 2006

This paper describes the changes of characteristics of pig slurry according to storing depth. Most of the substances containing pollutants, such as were Management of manure and wastewater from animal confinement facilities is a critical factor for pollution control. With proper treatment processing method in both solid and liquid forms, it can be used as a fertilizer and soil conditioner. In Korea, liquid-manure handling system is very popular because its treatment and application is easy and labor saving. In the storage tank treatment, the period of fermentation process and solids-liquid separation averages six months and the supernatant liquid is being used as a fertilizer. In this study, the changes in chemical characteristics of pig slurry at varying depths of the storage tank were investigated. Results showed that the pH value of the fermented pig slurry was > 7, while the major pollutants such as BOD, SS, N and P were highest in the bottom of the tank. Therefore, the above findings proved that varying depths in the storage tank can influence the concentration of pollutants of the fermented pig slurry.

• Proceedings of the Korean Geotechical Society Conference
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• 2008.03a
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• pp.1100-1105
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• 2008

In most drilled shafts construction sites, it is common, depending on the site condition, to use either water or slurry as fluids for maintaining stability of the holes, however, there are yet no design manuals by hole stability fluids. In this paper, in order to evaluate load transfer characteristics of the drilled shafts by hole stability fluids, two test piles are constructed over the soft ground of the lower Busan Bay based on the Bi-directional Pile Load Test. The test results showed that no ultimate states has found under the condition of applied loads with fresh water and slurry as hole fluids for drilled shafts. Then, the load transfer behavior were estimated with the data measured in fields and the effect of hole stability fluids were compared. All these results are presented in the paper.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.38 no.3 s.116
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• pp.72-78
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• 2006

The extraction properties of the biological waste originated from the Tobacco industry were evaluated. The biological waste have been recycled and transformed into a valuable material, so called a reconstituted tobacco sheet(Recon) by the papermaking process. In this process, The mechanical extraction process, which divides the mixed raw material slurry into the soluble stock and the insoluble stock, could affect not only the quality of final Recon product but also the productivity of whole Recon making process. This study investigated the effects of the extraction process on the slurry properties in detail. In order to quantify the amounts of the solubles which resided in the insoluble fibers, the washing treatment of the stock before and after squeezing process was applied. The amounts of the residual solubles showed little changes according to each stage of the extraction process. The fractionation of the slurry showed the difference in the amount of soluble in the stock depending on the size of the biological waste. After the extraction process, the bigger size fiber portion contained about 19%(by weight) in soluble after pressing but the smaller size fiber portion 9% in soluble. The fractionation ratio of the stocks also was changed by the screw press process, which could demonstrate the physical effects of the mechanical extraction.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1891-1894
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• 1999

We can classify the scratches after CMP process into micro-scratch and macro-scratches according to the scratch size, scratch intensity and defect map, etc. The micro-scratches on wafer after CMP process are discussed in this paper. From many causes, major factor that influences the formation of micro-scratch is known as particle size distribution of slurry.(1) It is indefinite what size or type of particle can cause micro-scratch on wafer surface, but there is possibility caused by large particle over 1um. The best way for controlling these large particle to inflow is to use the slurry filter on POU(Point of user). But the slurry filter(especially, depth-type filter) has sometimes the problem which makes more sever micro-scratches on wafer surface after CMP. We studied that depth-type slurry filter has what kind of week-points and the number of scratch could be reduced by lowering slurry flow rate and by using high spray bar which sprays DIW on polishing pad with high pressure.

• Korean Journal of Materials Research
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• v.25 no.1
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• pp.27-31
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• 2015

This paper proposes a novel way of fabricating aligned porous Sn by freeze-drying of camphene slurry with stannic oxide ($SnO_2$) coated Sn powders. The $SnO_2$ coated Sn powders were prepared by surface oxidation of the initial and ball-milled Sn powders, as well as heat treatment of tin chloride coated Cu powders. Camphene slurries with 10 vol% solid powders were prepared by mixing at $50^{\circ}C$ with a small amount of oligomeric polyester dispersant. Freezing the slurry was done in a Teflon cylinder attached to a copper bottom plate cooled at $-25^{\circ}C$. Improved dispersion stability of camphene slurry and the homogeneous frozen body was achieved using the oxidized Sn powder at $670^{\circ}C$ in air after ball milling. The porous Sn specimen, prepared by freeze-drying of the camphene slurry with oxidized Sn powder from the heat-treated Sn/tin chloride mixture and sintering at $1100^{\circ}C$ for 1 h in a hydrogen atmosphere, showed large pores of about $200{\mu}m$, which were aligned parallel to the camphene growth direction, and small pores in their internal walls. However, $100{\mu}m$ spherical particles were observed in the bottom part of the specimen due to the melting of the Sn powder during sintering of the green compact.

• Korean Chemical Engineering Research
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• v.48 no.2
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• pp.129-139
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• 2010

Coal gasification process, which had developed originally to convert coal from hydrogen and carbon monoxide, has used and developed in many countries because of environmental advantages such as carbon dioxide storage, decrease of pollutants and so on. Generally entrained-flow gasification process using pulverized coal under $75{\mu}m$ is used in Integrated Gas Combined Cycle(IGCC) because of easy scale up and high efficiency of energy conversion. Especially entrained-flow gasifers with coal water slurry have been used in many applications due to its fully developed technologies. In this paper, several technologies for coal-water slurry gasification that involves slurry preparation, burner, gasifier, slag melting and numerical simulation for plant design and operation were investigated. Entrained-flow gasification with coal water slurry can be used for synfuel production, SNG, chemicals as well as IGCC. To develop hybrid gasification process and use different types of coal, it is necessary to develop new technologies that will increase efficiency of the process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.45-48
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• 2003

The polishing mechanism of W-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. Thus, it is important to understand the effect of oxidizer on tungsten passivation layer in order to obtain higher removal rate (RR) and very low non-uniformity (NU%) during W-CMP process. In this paper, we investigated the effects of oxidizer on W-CMP process with three different kinds of oxidizers, such as $H_2O_2$, $Fe(NO_3)_3$, and $KIO_3$. In order to compare the removal rate and non-uniformity of three oxidizers, we used alumina-based slurry of pH 4. According to the CMP tests, three oxidizers showed different removal mechanism on tungsten surface. Also, the microstructures of surface layer by AFM image were greatly influenced by the slurry chemical, composition of oxidizers. The difference in removal rate and roughness of tungsten surface are believed to caused by modification in the mechanical behavior of $Al_2O_3$ abrasive particles in CMP slurry. Our stabilized slurries can be used a guideline and promising method for improved W-CMP process.