• 전자공학회논문지
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• 제50권1호
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• pp.131-136
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• 2013

칩 적층기술의 발달로 TSV(Through Silicon Via) 기반 3D IC가 개발되었다. 3D IC의 높은 신뢰성과 수율을 얻기 위해서는 pre-bond 와 post-bond 수준에서 다양한 TSV 테스트가 필수적이다. 본 논문에서는 pre-bond 다이의 TSV 연결부에서 발생하는 미세한 고장과 post-bond 적층된 3D IC의 TSV 연결선에서 발생하는 다양한 고장을 테스트할 수 있는 설계기술을 소개한다. IEEE 1500 표준 기반의 래퍼셀을 보완하여 TSV 기반 3D IC pre-bond 및 post-bond의 at speed test를 통하여 known-good-die와 무결점의 3D IC를 제작하고자 한다.

• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.69-73
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• 2008

본 연구에서는 리드-온-칩 패키징 기술을 이용한 반도체 제품에서 디바이스의 패드의 위치가 온도변화로 인한 신뢰성 문제에 대단히 중요하다는 것을 보여준다. 컴퓨터를 이용한 이론적 계산 및 실험을 통해 패시베이션 파손으로 대변되는 신뢰성 문제가 디바이스의 코너 부위에 위치한 패턴에서 가장 심하게 발생할 수 있다는 것을 보여준다. 따라서, 패시베시션 파손 등으로 인한 디바이스의 신뢰성 저하를 예방하기 위해서는 취약한 패드 부위는 다바이스의 테두리 부위보다는 중앙부위에 위치하도록 설계하는 것이 바람직하다는 것을 본 연구에서는 지적하고 있다.

• 한국기계가공학회지
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• 제6권3호
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• pp.58-64
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• 2007

The clamping force of a jaw pad is determined by the displacements of main part when two lockers are locked, after the clamping angle of a locker was set up in the wedge type rail clamp for a container crane. In this time, if the resistance of wedge frame generates due to several factors, the clamping angle of a locker to display the initial clamping force will be changed because of the reduction of displacement of extension bar. This resistance is determined by the eccentric distance between the roller and the wedge, and by the gap between the wedge frame and outer frame. In this study we measured the tensile force of both extension bar through the performance test of the prototype rail clamp in order to evaluate the effect of the resistance of wedge frame on the clamping force of the wedge type rail clamp.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2007년도 추계학술대회 논문집
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• pp.1223-1228
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• 2007

Since KHSL 2nd phase was adapted as a main track design, the interests of concrete slab track system have been gradually increased in the division of rail track engineering and many engineering companies have been trying to adapt a concrete slab track system at this moment. Advantages of this system proved in advanced country, japan and Germany etc. are excellent maintenance, track stability and increasing of buckling resistance This developed turnout is same with the KHSR 1st phase's design and applications rules, components and signaling system since it observes KTX specification. Comparing it with the former turnout, High-elasticity pad, lubrication-free roller slide plate and Rheda2000 PC sleeper are only different. The purpose of this study is the development of high speed turnout on concrete slab track and its application on site. Now these studies are going to show the verification and confidence about the interface between ballast-track and concrete slab track by finding and solving the possible problems when it is installed on site and to make these turnouts applied perfectly and completely on concrete slab track. Its first trial construction in korea had been successfully completed at Sangju-station on July 20th ,2007 thanks to KORAIL and KR. Hereunder Sampyo E&C trys to introduce all of turnout technologies on concrete slab track system with Rheda 2000 sleeper

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2006년 창립20주년기념 정기학술대회 및 국제워크샵
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• pp.294-297
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• 2006

The rail clamp is the device to prevent the crane slips along a rail from the wind blast as well as to locate a container crane in the set position during an operating mode. In this study we conduct the research for determining the proper position of supporter to prevent the overload applied to the rail clamp with respect to the wedge angle in the wedge type rail clamp. The friction force between the jaw pad and the rail to prevent that the crane slips along a rail, when the wind blows, is generated fly the rail-directional wind load. Accordingly the proper position of the supporter to prevent the overload is determined fly analyzing the forces applied to the rail clamp in the wedge working stage. In order to analyze the effect of the wedge angle on the position of supporter, 5-kinds of wedge angles, such as 2, 4, 6, 8, $10^{\circ}$, were adapted as the design parameter, and the wind speed of 40m/s was adapted as the design wind speed criteria.

• JSTS:Journal of Semiconductor Technology and Science
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• 제9권2호
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• pp.85-90
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• 2009

This paper presents a single supply PLC SoC ASIC with a built-in analog Front-end circuit. To achieve the low power consumption along with low cost, this PLC SoC employs fully CMOS Analog Front End (AFE) and several LDO regulators (LDOs) to provide the internal power for Logic Core, DAC and Input/output Pad driver. The receiver part of the AFE consists of Pre-amplifier, Gain Amplifier and 1 bit Comparator. The transmitter part of the AFE consists of 10 bit Digital Analog Converter and Line Driver. This SoC is implemented with 0.18 ${\mu}m$ 1 Poly 5 Metal CMOS Process. The single supply voltage is 3.3 V and the internal powers are provided using LDOs. The total power consumption is below 30 mA at stand-by mode to meet the Eco-Design requirement. The die size is 3.2 $\times$ 2.8 $mm^{2}$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.129-132
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• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• 대한가정학회지
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• 제44권2호
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• pp.127-135
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• 2006

This paper suggests guidelines for virtual clothes modeling and draping software suitable for clothes designers. We first analyze Maya Cloth, which is widely used in game and animation fields, and which has been adopted by Pad System as a 3D cloth draping system. We then discuss what functions and procedures would improve Maya Cloth to assist designers in being able to create the clothes they have conceptualized. While Maya Cloth has many good functions and features forvirtual cloth modeling and draping, it treats input 2D patterns as approximat and it creates 3D clothes by considering other factors such as the 3D body model. As a result, it is hard for clothes designers to control the shape of the 3D clothes by changing 2D patterns. Furthermore, Maya Cloth does not handle seamlines satisfactorily. We suggest that the following new features should be added to Maya Cloth : respecting the input 2D patterns, handling seamlines, and controlling the shape of the clothes in 3D space.

• 복식
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• 제22권
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• pp.345-356
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• 1994

The Shirts Blouse was produced through the process of shirts Blouse pattern making by utilizing CAD System developed by PAD Sys-tem Techologies Co. Ltd that is suitable to educational use or industrial use. The purpose of this study was to provide the basic data for the development of efficient and various design patterns by applying this pro-cess to the actual business of apparel making. The results were as follows: 1. The applicable range of CAD system 1) The repeated work can be avoided by thansforming and developing the basic pattern stored and the storage and remodification were easy. 2) The deletion duplication movement and copy of all points and lines in the pattern can be made freely and measurement of all lengths and angles the attachment of two patterns were possible. 3) The grading Library of the basic pattern was applied as it was and the time was curtailed by adding only several grading points with the change of design. 2. The problem in the use of the CAD System 1) Through the input of basic pattern by the digitizer the minute size difference was generated as each point on the curve came to be designated. 3) In grading the line of neck girth there was inconveniences to go to the plan view in order find out deviation.