• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.4
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• pp.433-445
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• 2015

Objectives: The major objectives of this study are to review the issues surrounding trade secret claims in the Chemicals Control Act and Amendment on Occupational Safety and Health Act(1917-227) and to propose a way of improving the reliability of chemical information in MSDSs, labels and National Chemical Survey results. Materials: To review the issues on trade secret claims, we made an analysis frame which was divided into three steps: Value and Problem Recognition; New Regulation Design; and Enforcement and Amendment. We then compared Korean issues with issues from the United States' Hazard Communication Standard and Emergency Planning & Community Right-to-Know Act, Canada's Workplace Hazardous Materials Information System and Hazardous Materials Information Review Act and the European Union's Regulation on Classification, Labelling and Packaging of substances and Mixtures. Results: The stage of right-to-know development in Korea has passed the Value and Problem Recognition phase, so efforts are needed to elaborately design new regulation. Conclusions: We recommend two ways to improve right-to-know in Korea. First, strict examination of the quality of documents for trade secret claims is very important. Second, trade secrets should be limited to less-hazardous substances.

• Journal of Environmental Science International
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• v.17 no.1
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• pp.129-133
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• 2008

This study is an endeavor to evaluate the safety of medicines from heavy metals, prescribed on the basis of herbal medicinal system and oriental medical prescription which are circulated much recently. For that, three globular types, four extract granular types and four liquid types of herbal medicine were bought to compare and analyze the content of heavy metals, such as As, Pb, Cd and Hg, which are harmful to human body. The concentration of Pb was found to be 0.552 ppm in Sachiltang, 2.552 ppm in Anjungjogiwhan and 1.735 ppm in Cheongsangbohwawhan in case of pill type herbal medicine, and liquid type herbal medicine, Maekmundongtang was 0.002 ppm, Galgeuntang was 0.003 ppm, Sangwhatang was 0.004 ppm, 20jeon Daebotang was 0.0185 ppm. And the concentration of Pb was found to be 0.322 ppm in Banhasasimtang, 0.47 ppm in Eungjosan, 0.29 ppm in Yukmijihwangtang, 0.64 ppm in Socheongryongtang in case of granular type. It was found that the liquid types herbal medicines were relatively safer than three pill types of, four granular types of and four liquid types herbal medicines were tested for concentration of heavy metals. It is considered that is required in the stage of raw material treatment, manufacturing and packaging because those herbal medicines are directly taken in and absorbed into human body through the final treatment process.

• Korean Journal of Food Science and Technology
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• v.36 no.4
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• pp.558-562
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• 2004

Conditions for rapid quantification of isoflavones were studied. Rapid and clear separation of isoflavones (genistin and daidzin) was obtained using solvent system of chloroform : methanol : water : acetic acid (60 : 30 : 10 : 0.5, v/v/v/v). Quantification of each isoflavone separated by TLC was conducted by densitometry analysis. Genistin and daidzin were quantified in $0.15-1.80\;{\mu}g/{\mu}L$ range with 99% confidence. Concentrations of isoflavones in soybeans and kudzu roots originated from Korea were determined, and validity of TLC method for quantification of isoflavones was confirmed by comparison with HPLC analysis.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.138-138
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• 2003

Low temperature co-fired ceramic (LTCC) technology offers significant benefits over the other established packaging technologies for high density, high microwave frequency, and fast signal application. Most conventional electroceraramics do not meet the basic requirements in respect of sinterability for LTCC technology. Attention is, therefore, focused on the role of glasses because of the capability they supply with lower sintering temperatures. In this study, commercial ceramic (MBRT-90) in the system BaO-N $d_2$ $O_3$-Ti $O_2$ (BNT: 40 ~ 80 wt%) and L $a_2$ $O_3$- $B_2$ $O_3$-Ti $O_2$ glass (LBT;60 ~ 20 wt%) were prepared. These glass/ceramic composites were evaluated for sintering behavior, phase evaluation, densities, interface reaction, crystallinity, microstructure and microwave dielectric properties. It was found that the addition LBT glass frits significantly lowered the sintering temperature to below 90$0^{\circ}C$ and as temperature increased (750~90$0^{\circ}C$) densification developed dynamically which was meant to be as over 95% of relative density. It is supposed that in the microstructure, the grain size was increased accompanying with the formation of different phases such as LaB $O_3$ and Ti $O_2$ under the condition of increasing sintering temperature. The sintered bodies represented applicable dielectric properties, namely 20 ~ 40 for $\varepsilon_{{\gamma}}$, ~ 10000 GHz for Q* $f_{0}$ and 10~80 ppm/$^{\circ}C$ for $\tau$$_{f}$. The results suggest that the composite is one of feasible candidates for the microwave use in LTCC technology.y.e use in LTCC technology.y.

• Archives of design research
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• v.20
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• pp.41-48
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• 1997

We easily witness that environmental issue is very critical point to affluence upon a restructuring the value system of human being. Therefore it is obvious that this issue affluence upon the field of design as well. The most important feature of environmental issue is 'wholeness' in itself. It means that we have to approach and to solve it as a whole. Also, design is to be done at the same way. The creative professionalism of design could provide a clue to solve the problem, but designer are tend to seek a solution in a just partial way such as recycling and packaging. But those attitude may cause more problems and spread it futhermore. Therefore this study is analysis some recognitive turning factors in order to solve the problems as a whole, and to suggest a appropriate methods according to such a view point. Even internal retrospect in design itself or external demand from the other, If we look away this issue, the real purpose of design, contributing for society, should be diluted by ourselves.

• The Journal of the Korea Contents Association
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• v.8 no.1
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• pp.203-211
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• 2008

Due to the advent of presumer and digital production of moving picture, a lot of UCC has been generated by editing the previous moving pictures in various way. It causes a lot of problems on copyright, duplication, and content. In reorganizing the contents, it is necessary to increase productivity and reusability by managing production pipeline systematically through the standardization of moving picture content. For this purpose, we try to develop the moving picture content management system that can manage all kinds of information on the production pipeline, based on SCORM of e-learning by considering production, publication and re-editing. Using the meta-data of content object, user and producer can easily search and reuse the contents. Hence, they can choose the contents object according to their preference and reproduce their own creative UCC by reorganizing and packaging the selected objects. The management of copyright by the unit of scene would solve the problem of copyright. The sequencing technique of SCORM as an interactive storytelling method makes it possible to produce individual contents by user's preference.

• Korean Chemical Engineering Research
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• v.48 no.1
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• pp.93-97
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• 2010

In this study, we have measured the thermo-physical properties of pure organic phase change materials (PCMs) and their mixtures which have the melting points from 0 to $15^{\circ}C$ by using a modified T-history method. These organic PCMs can be used as coolant materials for packaging and shipping of vaccines. Through measuring the thermophysical properties of pure paraffins, we were able to know that we could improve the reliability of measurement if we considered the melting point of each material and subsequently decided an optimum coolant temperature for each system. The modified T-history method showed a potential usefulness for reliably measuring thermo-physical properties of organic mixtures with avoiding possible inaccuracy of measurement due to using a small amount of sample at DSC measurement.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.3.1-3.1
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• 2011

Over the past decade, the major efforts for lowering the cost of electronics has been devoted to increasing the packaging efficiency of the integrated circuits (ICs), which is defined by the ratio of all devices on system-level board compared to the area of the board, and to working on a larger but cheaper substrates. Especially, in flexible electronics, the latter has been the favorable way along with using novel nanomaterials that have excellent mechanical flexibility and electrical properties as active channel materials and conductive films. Here, the tool for achieving large area patterning is by printing methods. Although diverse printing methods have been investigated to produce highly-aligned structures of the nanomaterials with desired patterns, many require laborious processes that need to be further optimized for practical applications, showing a clear limit to the design of the nanomaterial patterns in a large scale assembly. Here, we demonstrate the alignment of highly ordered and dense silicon (Si) NW arrays to anisotropically etched micro-engraved structures using a simple evaporation process. During evaporation, entropic attraction combined with the internal flow of the NW solution induced the alignment of NWs at the corners of pre-defined structures. The assembly characteristics of the NWs were highly dependent on the polarity of the NW solutions. After complete evaporation, the aligned NW arrays were subsequently transferred onto a flexible substrate with 95% selectivity using a direct gravure printing technique. As proof-of-concept, flexible back-gated NW field effect transistors (FETs) were fabricated. The fabricated FETs had an effective hole mobility of 0.17 $cm2/V{\cdot}s$ and an on/off ratio of ${\sim}1.4{\times}104$. These results demonstrate that our NW gravure printing technique is a simple and effective method that can be used to fabricate high-performance flexible electronics based on inorganic materials.

• Journal of Welding and Joining
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• v.24 no.2
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.