• Title/Summary/Keyword: packaging system

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A Study on Adaptability of Returnable Transport Packagings in the Parcel Delivery Service by e-commerce (전자상거래기반 택배물류서비스에서의 재사용 순환물류포장 적용성 연구)

  • Oh, Jae Young;Lim, Mijin;Kim, Kee Back;Kim, Su Hyun;Suh, Sang Uk;Lee, Ga Eun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.26 no.2
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    • pp.99-103
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    • 2020
  • The volume of parcel delivery is steadily increasing with the rapid growth of the global online e-commerce market. However, a large amount of packaging materials used for these parcel delivery is finally causing environmental problems as waste. In this study, we have taken a pilot test on the returnable parcel delivery packaging & service, which is one of various ways to reduce the generation of the distribution packaging waste raised by e-commerce-based parcel delivery. For the purpose of this project, we made 300 boxes of returnable & foldable delivery packaging(415 mm × 280 mm × 160 mm) and have cooperated with e-commerce company(CJ ENM) & logistics company(LogisAll). Consequently, about 50% of the delivered packages was returned because of the lack of consumer's understanding on the returnable packaging system. We finally have suggested the policy strategy to get over problems derived from the experiment, like the retrieval rate and cost of the returnable packaging, economic efficiency and so on.

A Study on the International Standard for CCM Related RFID Packaging Technology (CCM(Cold Chain Management)과 연계된 RFID 패키징 국제 기술 표준의 분석)

  • Yoon, Seong-Young;Cha, Kyong-Ho;Park, Su-Il;Kim, Jai-Neung
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.15 no.2
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    • pp.67-73
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    • 2009
  • The introduction of radio frequency identification (RFID) technology into cold chain system will be essentials for the better quality preservation of chilled products in the near future. The object of this study is to analyze the trends of international standardization activity for cold chain system and RFID packaging. The standardization of RFID technology is related to SC31 of ISO/IEC JTC1. The established standard from EPCglobal includes the air interface of UHF substitute actors, the control of EPC tag data and the event collected from RFID readers, the directory services and information storage of ONS and EPCIS, and securities. Also, EPC standards include the sensor functions of the cold chain. In Korea, the RFID packaging related techniques and their engineering standard are less studied as compared with Europe or North America. For effective application of RFID in the cold chain and packaging, scientific and systematic researches on RFID, including technical standards for domestic RFID frequency, will be key elements for preoccupation of these application techniques.

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Master Packaging System of Fresh Produce (신선 농산물의 마스터 포장 시스템)

  • Lee, Dong Sun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.20 no.1
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    • pp.1-6
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    • 2014
  • Properly designed plastic packages of fresh produce can preserve the quality by maintaining the optimal modified atmosphere (MA) at optimal low temperature conditions, but cannot do so at temperature abuse conditions in retail stage due to occurrence of injurious package atmosphere coming from imbalance between respiration and package gas permeation. Master packaging system consisting of a double-layered secondary package wrapping several individual (primary) packages has been proposed and applied recently to the commodities of sweet persimmon, king oyster mushroom, chestnut and strawberry. The master (secondary) pack is designed to be stored and distributed under chilled temperature, and then dismantled when moved to the retail display from the presale chilled storage. The master packaging system taking into consideration temperature dependence of produce respiration and package gas transfer was looked into with examination of its design variables to maintain the beneficial MA. Mathematical model was provided to help the design of master packaging system creating the desired MA. Its benefits of quality preservation and its limitations in practices of fresh produce marketing were discussed. Further research direction to extend the applicability of the produce master packaging system was presented.

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Shelf-life Extension of Fresh and Processed Meat Products by Various Packaging Applications

  • Lee, Keun Taik
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.24 no.2
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    • pp.57-64
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    • 2018
  • This article delves into the current status of various packaging technologies, which are currently being applied or are under development for the shelf-life extension and quality improvement of fresh and processed meat products. Traditional packaging methods include vacuum packaging, modified atmosphere packaging, and air-permeable packaging. Recently, innovative packaging methods have been introduced that utilize technologies such as barrier-films, active packaging, nanotechnology, microperforated films, far-infrared radiations, and plasma treatment. All of these packaging methods have their own merits and drawbacks in terms of shelf-life and quality maintenance. A right choice of packaging system for fresh and processed meat products must be made in accordance with the conditions of the raw material, storage, and distribution in the market and household, and while considering the environmental sustainability and consumer's expectations.

System-on-Package (SOP) Vision, Status and Challenges

  • Tummala, Rao R.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.3-7
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    • 2000
  • In summary, a fundamentally new paradigm called System-on-Package could potentially become a complementary alternative to System-on-Chip, thus providing a balanced set of system-level functions between the semiconductor IC and single component package beyond the year 2007. The concurrent engineering and optimization of IC and package could overcome the fundamental IC issues presented above.

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Application of Master Packaging System to Fresh Shiitake Mushroom Supply Chain on Semi-commercial Scale (생표고버섯에 대한 마스터 포장 시스템의 현장 적용)

  • An, Duck Soon;Lee, Ji Hye;Lee, Hye Lim;Lee, Dong Sun
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.20 no.3
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    • pp.71-76
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    • 2014
  • Master packaging system is a technology combining primary and secondary packaging to preserve the fresh produce in the supply chain. Master packaging system with tailor-designed gas transfer and $CO_2$ absorber of $Ca(OH)_2$ was applied to fresh shiitake mushroom in its supply from farm to retail store. The temperature, humidity and package atmosphere were monitored through the distribution and/or storage until the packages were opened to measure the mushroom quality. Conventional perforated individual packages without secondary master pack were prepared and travelled the same path for comparison purpose. While high temperature history was observed in some initial period of actual practice of the mushroom transportation and storage unexpectedly, the package atmosphere around the produce in the master packaging system was maintained at modified atmosphere consisting of $O_2$ concentration of 0.4 to 4.2% and $CO_2$ concentration of 0.7 to 1.7%, which is known to be beneficial for the mushroom preservation. While curing the mushrooms with precooled drying was effective for quality preservation, positive effect of master packaging system could be apparent for the uncured mushroom. Harmonized combination of curing treatment, master packaging system and temperature management was suggested for the best quality preservation of the fresh shiitake mushroom.

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The Automatic Packaging System for 6mm Ball Injection Molding Product (6mm Ball 사출 성형품 자동 패키징 시스템)

  • Heo Y.M.;Shin G.H.;Yoon G.S.;Jang S.H.;Jung W.C.;Kim G.H.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.573-574
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    • 2006
  • In this study, the automatic packaging system for small injection molding product is developed. In most of injection molding company, many problems such as manpower problem, productivity decline and inferiority rate increase are occurred since processes after injection molding are executed by hands. The automatic system which is developed is for packaging small injection molding products as 6mm ball. Finally, many problems of injection molding process are resolved and the productivity will increase by applying developed system to field and this technique lays the groundwork for developing similar automatic system.

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Multi-Chip Packaging for Mobile Telephony

  • Bauer, Charles E.
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.2
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    • pp.49-52
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    • 2001
  • This paper presents product level considerations for multichip packaging as a cost effective alternative to single chip packaging in the design and manufacture of mobile telephony products. Important aspects include component functionality and complexity, acquisition and logistics costs, product modularity and integration. Multichip packaging offers unique solutions and significant system level cost savings in many applications including RF modules, digital matrix functions and product options such as security, data storage, voice recognition, etc.

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