• Journal of Bio-Environment Control
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• v.21 no.3
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• pp.261-266
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• 2012

This study was carried out in order to investigate the effect of MA packaging material on quality and shelf life of ferulae mushroom (Pleurotus ferulae) at 1, 8, and $24^{\circ}C$ storage temperatures. We found that the fresh weight loss was less than 1.5% in all temperatures (1, 8, and $24^{\circ}C$) and non-perforated breathable films (1,300 cc, 3,000 cc, 5,000 cc, 7,000 cc, 10,000 cc, 15,000 cc, 20,000 cc, and $40,000cc/m^2{\cdot}day{\cdot}atm$ oxygen transmission rate) treatments. The proper MA packaging material of ferulae mushroom was 1,300 cc and 3,000 cc films at $1^{\circ}C$ storage. Because 1,300 cc and 3,000 cc films showed proper level, 15% carbon dioxide and 5% oxygen concentration for MA storage, although the shelf life was higher in 1,300 cc (42 days) than 3,000 cc (38 days), and the ethylene concentration as well as off-order showed lower in 3,000 cc than 1,300 cc film. The 3,000 cc film was the most suitable for ferulae mushroom storage at $8^{\circ}C$, because atmosphere composition in package was not statistically significantly different among the film treatments. In addition, 3,000 cc film showed the second low ethylene concentration and the longest shelf-life of 19 days. The ferulae mushroom stored at $25^{\circ}C$ showed a vigorous respiration and resulted in an extreme CA condition in package at $5^{th}$ day after storage, and showed the highest visual quality in 1,300 cc film. As the shelf life of ferulae mushroom at $1^{\circ}C$ and $8^{\circ}C$ storage were 8 times and 4 times longer than at $25^{\circ}C$ storage respectively, so the ferulae mushroom should be stored and distributed in cold chain system.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.688-697
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• 2014

In this study, electrode bonding technology needed for high density of rechargeable battery is studied, which is recently researched for electric vehicle, the small leisure vessel. For the alternative overcoming the limit of stacking amount able to be stacked by conventional ultrasonic welding, the low temperature bonding method, eligible for minimum of degeneration of chemical activator on the electrode surface which is generated by thermal effect as well as the increase of conductivity and tension strength caused by electrode bonding using filler metal, not using conventional direct heating on the electrode material method, is studied. Specifically to say, recently used more generally the ultrasonic welding and spot welding method are not usable for satisfying stable electric conductivity and bonding strength when much electrode is stacking bonded. If the electrical power is unreasonably increased for the welding, due to the effect of welding temperature, deformation of electrode and activating material degeneration are caused, and after the last packaging, decline of electrical output and generating heat cause to reduce stability of battery. Therefore, in this study, induction heating system bonding method using high frequency heating and differentiated electrode method using filler metal pre-treatment of hot dipping are introduced.

• Journal of the Korean Society of Food Science and Nutrition
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• v.43 no.7
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• pp.1095-1103
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• 2014

A packaging and distribution system for transferring individual live squids at low temperature was developed and compared to a conventional bulk container system. Ten live squids in individual packages were stored in a large container at low temperature ($0{\sim}10^{\circ}C$). Live squids in individual packages at $6^{\circ}C$ showed a survival rate of 84% up to 72 hours, after which the survival rate decreased. However, the survival rate remained at 60% up to 120 hours. Further, the squids survived up to a maximum of 7 days. Optimum temperature was $5^{\circ}C$, and the survival rate of the packages was 70% when stored at $5^{\circ}C$ for 96 hours. A distribution test was carried out using a refrigerator truck at $5^{\circ}C$, and the results showed a 100% survival rate up to 16 hours and over 90% survival rate after 20 hours. A rectangular container was the most favorable when loading the container into the refrigerator truck. In testing the required volume of supplied seawater, 100% survival rate was observed over 15 hours with 20 L of sea water or more. Therefore, a single squid needed 2 L of seawater. After refrigerator truck transportation, optimum temperature for fish tank storage was $5^{\circ}C$, at which the survival rate was over 90% up to 72 hours. Using a refrigerator truck at $5^{\circ}C$, live squids survived up to 7 days, maintaining marketability.

• Journal of the Korea Society of Computer and Information
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• v.9 no.3
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• pp.115-120
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• 2004

As a part of working on development of the learning management system, a adaptive learning management system which is able to provide individual learner with different learning contents or paths customized to learner's learning behaviors by expanding SCORM was proposed in this dissertation. In terms of instructional technology interrelated with technology of CBI and ITS, new learning environments and learner preferences were analyzed. A related laboratory system was implemented by packaging a process on how to expand the meta data for contents and a process on how to utilize the web-based learning contents dynamically. In order to evaluate the usability of the implemented system, a sample content was provided to some selected learners and their learning achievement resulted from the new learning environment was analysed. A result of the experiment indicated that the adaptive learning management system proposed in this dissertation could provide every learner with the different content tailored to their individual learning preference and behavior. and it worked also to promote the learning performance of every learner.

• The KIPS Transactions:PartC
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• v.11C no.3
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• pp.327-336
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• 2004

There is a need for content providers and operators to control the usage of downloaded digital contents. Digital Rights Management(DRM) is the means to control the usage of the digital contents once it has been downloaded. Therefore, appropriate security mechanism is required. The mobile DRM system Is same as the general DRM system. We use encryption technology to package digital contents. In case of Mobile DRM system, secure distribution and secure keeping of packaging encryption key is important. In this paper, we design and implement DRM system on the Mobile Environments following on OMA(Open Mobile Alliance) DRM Model. We considered being a secure DRM system to contain appropriate security solution.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.6
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• pp.2624-2630
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• 2013

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead flame to provide enough strength for the next process. During the process, inspection processes are very important to detect exact locations of dispensed epoxy dots and to determine bonding status of dies whether they are lies at exact positions with sufficient bonding strength. In this study, a useful machine vision based inspection system is proposed for the LED die bonder. In the proposed system, 2 cameras are used for epoxy dot position detection and 2 cameras are sued for die attaching status determination. New vision processing algorithm is proposed, and its efficiency is verified through required field experiments. Measured position error is less than $X:-29{\mu}m$, $Y:-32{\mu}m$ and rotation error:$3^{\circ}$ using proposed vision algorithm. It is concluded that the proposed machine vision based inspection system can be successfully implemented on the developed die bonding system.

• Proceedings of the KSR Conference
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• 2011.10a
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• pp.3278-3288
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• 2011

Bulk freight is transported by a freight car, ship and tank lorry without packaging in a state of particles or powders. In korea, the main bulk freight include oil, grain, coal, cement, iron ore and these are occupied nearly 30% of the volume of gross domestic freight transportation. Therefore it is in important to transport efficient bulk freight transport system for the improvement of national distribution competitive as raw material for industry. Generally environment-friendly transfer modes such as railway and sea transport play an important role in bulk freight transport due to the mass transfer characteristics of bulk freight. This study is carried out for examining the problem of oil, grain, coal, cement, ore transportation through analyzing distribution flow of items and understanding characters of transfer modes.

• Journal of the Korea Safety Management & Science
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• v.15 no.4
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• pp.233-243
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• 2013

As companies were concerned with developing green logistics and environment, most logistics concerned functions like packaging, loading, storage, transportation and IT studies are active in study. Even if active in research studies, companies still recognized that logistics cost increases as green concepts are applied. For the efficient execution of green logistics management, it is absolutely necessary but difficult to build an optimal logistics system where each function is smoothly interacted through the proper integration and the link of various logistics functions and partners. This study aims to development of green logistics through integration of supply chain functions and partners. With this aim of study, case studies with analysis of embodiment, planning and operations for supply chain of companies are carried out.

• Proceedings of the IEEK Conference
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• 2000.11a
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• pp.279-282
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• 2000

As digital systems continue to use components with faster edge rates and clock speeds, transmission of the digital information in these systems approaches the microwave realm. At these speeds digital signal fidelity becomes both a critical success factor and design challenge. The noise sources in digital systems include the noise in power supply, ground and packaging media due to simultaneous switching of drivers, signal reflections and distortions on single and multiple transmission lines. This paper presents theory, case studies and design considerations of gigabit interconnection for network and communication systems. The case studies show HSPICE and Ampredictor simulations of alternate approaches. Various subjects including skin effect and dielectric losses, interconnect simulations and crosstalks of connector, affected signal discontinuity, are addressed.