• Journal of Information Processing Systems
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• v.6 no.4
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• pp.609-620
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• 2010

In order to provide a tailored education for learners within the ubiquitous environment, it is critical to undertake an analysis of the learning activities of learners. For this purpose, SCORM (Sharable Contents Object Reference Model), IMS LD (Instructional Management System Learning Design) and other standards provide learning design support functions, such as, progress checks. However, in order to apply these types of standards, contents packaging is required, and due to the complicated standard dimensions, the facilitation level is lower than the work volume when developing the contents and this requires additional work when revision becomes necessary. In addition, since the learning results are managed by the server there is the problem of the OS being unable to save data when the network is cut off. In this study, a system is realized to manage the actions of learners through the event interception of a web-browser by using event hooking. Through this technique, all HTMLbased contents can be facilitated again without additional work and saving and analysis of learning results are available to improve the problems following the application of standards. Furthermore, the ubiquitous learning environment can be supported by tracking down learning results when the network is cut off.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Journal of Information Technology Applications and Management
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• v.20 no.3_spc
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• pp.231-257
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• 2013

The recent rise in the unstructured data generated by social media has resulted in an increasing need to collect, store, search, analyze, and visualize it. These data cannot be managed effectively by using traditional data analysis methodologies because of their vast volume and unstructured nature. Therefore, many attempts are being made to analyze these unstructured data (e.g., text files and log files) by using commercial and noncommercial analytical tools. Especially, the attempt to discover meaningful knowledge by using text mining is being made in business and other areas such as politics, economics, and cultural studies. For instance, several studies have examined pending national issues by analyzing large volumes of texts on various social issues. However, it is difficult to create satisfactory information services that can identify R&D documents on specific national issues from among the various R&D resources. In other words, although users specify some words related to pending national issues as search keywords, they usually fail to retrieve the R&D information they are looking for. This is usually because of the discrepancy between the terms defining pending national issues and the corresponding terms used in R&D documents. We need a mediating logic to overcome this discrep 'ancy so that we can identify and package appropriate R&D information on specific pending national issues. In this paper, we use association analysis and social network analysis to devise a mediator for bridging the gap between the keywords defining pending national issues and those used in R&D documents. Further, we propose a methodology for packaging R&D information services for pending national issues by using the devised mediator. Finally, in order to evaluate the practical applicability of the proposed methodology, we apply it to the NTIS(National Science & Technology Information Service) system, and summarize the results in the case study section.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.19-25
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• 2002

Glass composed of $Li_2$O.MgO. $MgF_2$.$SiO_2$.$B_2O_3$ for the fabrication of green sheet was prepared by melting process, and glass ceramics was prepared by the process of nucleation and grystal growth for the glass of $Li_2$O.MgO. $MgF_2$.$SiO_2$.$B_2O_3$ system with Lithium fluorhectorite and Lithium boron fluorphlogopite crystal phase. Powderization of the glass ceramics was carried out by water swelling. The average particle size at this point was 2.574 $\mu\textrm{m}$. Slurry was prepared for green sheet using high viscous sol fabricated by water swelling, which shows cleavage phenomenon in prepared glass ceramics. The optimum ratio of powder to water for the tape casting was 18:100, and its viscosity was 11,000~14,000 cps.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.21-27
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• 2000

To develop the underfill materials which are required for the new process of semi-conductor industry, the properties of epoxy/anhydride/cobalt(II) catalyst system with two types of fused silica(1 $\mu\textrm{m}$, 8 $\mu\textrm{m}$) are studied as a function of filler fraction. According to the curing profile, the optimum catalyst amount was 1.0 wt% for full curing at the conditions of $160^{\circ}C$/l5 min., and we could conclude that the viscosity has superior effect on the real flaw through the relationship between surface tension and viscosity data. The underfills which were filled with 1 $\mu\textrm{m}$ fused silica did not show good flowability, but they should be useful by improving the viscosity for a future process which has small gaps. The underfills which were filled with 8 $\mu\textrm{m}$ fused silica showed good flowability when the filler contents were 55~60 vol%. The model which was referred by Matthew can predict the real flow length only when the underfill has high viscosity and low surface tension.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.37-42
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• 2000

The comparative study of texture of Al/Ti thin films deposited on low-dielectric polymer and $SiO_2$substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and $SiO_2$by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and $SiO_2$substrates was characterized by cross-sectional transmission electron microscopy (TEM). Both the $\theta$-2$\theta$ method and rocking curve measurement suggest that Al/Ti thin films deposited on $SiO_2$have stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM revealed that grains of Ti films on $SiO_2$substrates had grown perpendicular to the substrate, while the grains of Ti alms on SiLK substrates were formed randomly. The lower degree of (111) texture of Al thin films on low-k polymer was due to Ti underlayer.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.57-65
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• 2015

Electronic packages consist of various materials, and as temperature changes, warpage occurs because of the difference in coefficient of thermal expansion. Shadow $moir{\acute{e}}$ is non-contact, whole field measurement technique for out-of-plane displacement. However, the technique has low sensitivity above $50{\mu}m/fringe$, it is not adequate for the warpage measurement in some circumstance. In this paper, by applying phase shifting process to the traditional shadow $moir{\acute{e}}$, measurement system having enhanced sensitivity of $12.5{\mu}m/fringe$ is constructed. Considering Talbot effect, the measurement is carried out in the half Talbot area. Shadow fringe pattern having four times enhanced sensitivity is obtained by the image process with four shadow fringes. The measurement technique is applied to the fibered package substrate and coreless package substrate for measuring warpages at room temperature and at about $100^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.