• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.11-18
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• 2016

Today, wearable technology products are used in a wide range of consumer, healthcare, bio-medical, and industrial applications. The market for wearable technology products is expected to increase dramatically over the next several years. In addition, concerns for safety, performance and reliability of wearable products keep increasing and will be essential for widespread acceptance in the marketplace. Wearable smart devices, which are generally in contact with the human body and skin, are exposed to the risk of the electric shock, burn, and explosion. Therefore, the standardization of wearable devices in terms of human safety and reliability should be very important. Furthermore, the development of test method and test certification of the wearable products will be one of the key technology for mass production. Such standardization and certification will help consumers to choose the safest and best quality wearable devices and allow manufacturers to prove the safety and quality of their products, thereby helping them to gain a competitive technology. This paper discusses the current status of the wearable smart devices as well as the standardization and test certification applicable to wearable technology products.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.43-45
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• 2001

For photosensitive and micro-structuring in $Li_2O-A1_2O_3-SiO_2$glasses by laser treatment, Nd:YAG laser in 355 nm and 1064 nm wavelength was irradiated to the glass to investigate fracture characterization and optical changes. The fractured glass surfaces irradiated by 1064 nm laser was observed by Scanning Electron Microscope(SEM) and optical microscope, and optical changes caused by 355 nm later was identified from absorption spectra. In this study, it could be expected that the laser treatment technology will be utilized for 3-dimensional micro-structure, internal waveguide, optical memory by optical absorption changes in glass matrix.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.114-117
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• 2003

본 연구에서는 계산을 통해 나온 Sn-Ag-Cu 삼원계 공정점(Sn-3.7Ag-0.9Cu)을 바탕으로 그 근처의 응고경로가 다른 6가지 조성(Sn-4.6Ag-0.4Cu, Sn-4.9Ag-1.0Cu, Sn-3.9Ag-1.3Cu, Sn-2.2Ag-1.2Cu, Sn-2Ag-0.7Cu, Sn-2.7Ag-0.3Cu)에 대한 솔더합금의 미세조직을 관찰하였다. 응고경로는 $L\;\rightarrow\;L+Primary\;\rightarrow\;L+Primary+Secondary\;\rightarrow\;Ternary\;Eutectic+Primary+Secondary$로 되며 6가지 경우를 예상할 수 있다 솔더합금의 미세조직은 느린 냉각으로 인하여 빠른 냉각, 보통 냉각에 비해 상대적으로 커다란 $\beta-Sn$ dendrite를 보였고 $Ag_3Sn,\;Cu_6Sn_5$과는 다르게 $\beta-Sn$는 약 $30^{\circ}C$의 과냉(DSC분석)이 존재하게 되어 Sn-4.6Ag-0.4Cu의 경우에는 $Ag_3Sn$상이, Sn-2.2Ag-1.2Cu의 경우에는 $Cu_6Sn_5$가 과대성장을 하였다. 솔더의 기계적 특성을 살펴보고자 Cu 기판위에서 각 조성의 솔더볼을 솔더링한 후 다양한 냉각 속도를 적용하여 reflow 솔더링을 하고 솔더/기판 접합에 대한 전단 강도 시험을 실시했다. 냉각 속도가 빠를수록 $\beta-Sn$의 dendrite가 미세해져서 높은 전단 강도를 보였고 6가지 조성의 솔더볼중 공정조직 분율이 낮은 Sn-2Ag-0.7Cu 조성의 경우에서 낮은 전단 강도가 나타났다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.103-108
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• 2000

The texture of Al/Ti thin films deposited on low-dielectric polymer substrates has been investigated. Fifty-nm-thick Ti films and 500-nm-thick Al-1%Si-0.5%Cu (wt%) films were deposited sequentially onto low-k polymers and SiO$_2$ by using a DC magnetron sputtering system. The texture of Al thin film was determined using X-ray diffraction (XRD) theta-2theta ($\theta$-2$\theta$) and rocking curve and the microstructure of Al/Ti films on low-k polymer and SiO$_2$ substrates was characterized by Transmission electron microscopy (TEM). hall thin films deposited on SiO$_2$ had stronger texture than those deposited on low-k polymer. The texture of Al thin films strongly depended on that of Ti films. Cross-sectional TEM resealed that Brains of Ti films on SiO$_2$ substrates had grown perpendicular to the substrate, while the grains of Ti films on SiLK substrates were farmed randomly. The lower degree of 111 texture of Al thin films on low-k polymer was due to Ti underlayer.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.63-66
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• 2014

In this study, we investigated the effects of Cu TSV on the thermal management of 3D stacked IC. Combination of backside point-heating and IR microscopic measurement of the front-side temperature showed evolution of hot spots in thin Si wafers, implying 3D stacked IC is vulnerable to thermal interference between stacked layers. Cu TSV was found to be an effective heat path, resulting in larger high temperature area in TSV wafer than bare Si wafer, and could be used as an efficient thermal via in the thermal management of 3D stacked IC.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.552-554
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• 1995

In long-haul high speed optical communications, the distance between a transmitter and a receiver depends on the amount of light coupled to a single mode optical fiber from the laser diode(LD) as well as the LD characteristic itself. And the transmitter module must have long lifetime. high reliability, and even simple structure. Such points have induced laser welding technique to be a first choice in opto-electronic module packaging because it can provide strong weld joint in a short time with very small coupling loss. In this paper, packaging considerations and characteristics for high speed LD modules are discussed. They include optical path design factors for larger aligning tolerance, and novel laser welding processes for component assembly. For low coupling loss after laser welding processes, the optical path for optimum coupling of a single mode optical fiber into the LD chip was designed with the GRIN lens system providing sufficiently large aligning tolerance both in the radial and axial directions. The measured sensitivity of the LD module was better than -33.7dBm(back to back) at a BER of $10^{-10}$ with a 2.5Gbps NRZ $2^{23}-1$ PRBS.

• The Journal of Korean Society of Virology
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• v.29 no.1
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• pp.33-38
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• 1999

Retroviral vector provide a highly efficient method for gene transfer into eukaryotic cells. This vector system can be divided into two components; the retroviral vector itself and the retroviral packaging cell line. The key improvement in the design of these two components are, focused on two aspects; the reduction of helper virus production and high titer-virus. We used PA317 for retrovirus packaging cell line, for its high producibility of viral titer. To test the ability of the vectors to generate high titer-virus, we have chosen four different retroviral vectors; LN, LNSX, LNCX and LXSN. To test easily the viral titer, we have made recombinant construction with CD4 and CD8, checked their viral titer and stained their surface expression. LXSN which contain SV40 early promoter in front of neo gene showed best results in viral transient transfection assay, dot blot assay and surface expression. In addition, recombinant containing CD8 generally showed much higher viral titration and surface expression than CD4.

• Journal of Biosystems Engineering
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• v.30 no.6 s.113
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• pp.347-353
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• 2005

Paper angle, environment friendly packaging material, has been mainly used as an edge protector, But, in the future, paper angle will be applied to package design of heavy product such as strength reinforcement or unit load system (ULS). Therefore. understanding of buckling behavior fur angle itself, compression strength and quality standard are required. The objectives of this study were to characterize the buckling behavior by theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, as applied load level was bigger and/or the length of angle was longer, incresing rate of buckling of asymmetric paper angle was higher than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia significantly increased as the extent of asymmetric angle increased, and buckling orientation of angle was open- direction near the small web. Incresing rate of maximum compression strength (MCS) for thickness of angle decreased as the web size increased in symmetric angle. MCS of asymmetric angle of 43${\times}$57 and 33${\times}$67 decreased $15{\~}18\%$ and $65{\~}78\%$, and change of buckling increased $12{\~}13\%$ and $62{\~}66\%$, respectively.