• Korean Journal of Organic Agriculture
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• v.22 no.4
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• pp.611-628
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• 2014

This study probed into some characteristics of the urban household such as household income, number of the household, age distribution of the family members, their characteristics of shopping behavior such as the shopping place, types of the packaging and the characteristics of the time series, using consumer panel data of the Rural Development Administration (RDA). It further examined how the above factors affect fruit purchasing prices and then estimates the degree of the influence by each factor. The study looked at the purchase of apples, pears, tangerines, and oranges - the most favorite fruits in Korea. The results of this study can be utilized as the basic information for marketing strategies and/or for the establishment of future policy plans related to fruits consumption.

• Food Science of Animal Resources
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• v.21 no.1
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• pp.18-23
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• 2001

A total of 100 adults were surveyed on types of favorable meat products. They tended to show much of unsatisfactory on the market products. Those unsatisfactory were mostly conceptual such as instant products, unreliable raw materials, sanitation conditions, list of unfavorable ingredients, mix of harmful additives, and etc. The results indicated that the consumers purchased the products of ham, cheese, chicken, sausages, and canned products mostly at medium-large marts(56%), department stores(22%), retail stores(19%) and others(3%). They were also concerned with the distribution date, prices, shape of packaging, and etc. The types of products and frequencies of purchasing various products were varied by time. For the purchase of products, mixed items were more favored rather than the single items.

• Food Science and Industry
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• v.54 no.3
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• pp.171-183
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• 2021

Tofu has been consumed as source of protein in Asia for hundreds of years and it was first known in US and Europe by Asian immigrants during 1900s. Lately it is being spotlighted for excellent plant-based protein that has nutritional value. Tofu has long been the most widely used ingredients in Asia and it has been developed into various forms such as tofu, yuba, fried tofu, tofu sheet, fermented tofu and more according to food culture. With development of equipment, coagulant, packaging and pasteurization, now we can have advanced flavor, productivity and distribution of tofu. Tofu has been brought to customer's attention, people who prefer more health oriented, sustainable and eco-friendly food during COVID-19 pandemic season. Furthermore, this global trend is expected to be continued. In response to the trend we need more study on new texture of tofu, substitution of meat, dairy, and various commercialization of HMR in future.

• Korean Journal of Organic Agriculture
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• v.29 no.3
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• pp.301-315
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• 2021

This study investigated the effect of the level of ethics in food manufacturing of agricultural products processing companies on food safety and product trust. In general, a company's food manufacturing ethics is complex, includes social responsibility, and has a potential impact on stakeholders. The main implications summarized based on the analysis results are the expansion of the HACCP application of the agricultural product processing system, the production of safe agri-food that fulfills social responsibilities with an ethical awareness, including entrepreneurial awareness, from raw materials to processing, packaging, and distribution from a long-term perspective. It was found that it was necessary to secure product trust and to provide education, consulting and management on ethical awareness.

• Korean journal of communication and information
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• v.51
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• pp.65-86
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• 2010

This paper reviews the problems and opportunities of Japanese newspaper industry. In the focus are particularly issues related to causes of the crisis and reacting strategies overcoming the crisis. To answer the questions, we conducted in-depth interviews with top-level managers of major newspaper companies in Japan. Secondary data were gathered to complement the interview. Top managers mainly perceived the causes of the crisis as young readers' alienation from newspaper due to the change of media environment and structural factors such as increasing production/distribution costs and diminishing appeals for advertisers. They are implementing several strategies to overcome this crisis - developing newspaper content for young readers; packaging customized on-off line advertisement; extending news distribution via online and mobile platforms; diversifying business into diverse sectors such as real-estate; enhancing brand equity of newspaper; and collaborating with rival newspaper companies in operating news site and joint printing/distribution. Lessons from the case of Japanese newspaper industry may be useful starting points for the Korean newspaper companies agonizing for diminishing circulation and advertising revenues.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.11-18
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• 2016

This study focused on examining the possibility for recycling of Fe-Si electric sheet. We manufactured Fe-6.5Si mother alloy using by Fe-Si electric sheet scrap for transformer core materials. And then, soft magnetic alloy powder which diameter and shape were $45{\sim}150{\mu}m$ and sphere type was prepared by gas atomization process. As we compared to commercial Fe-6.5Si powder, its diameter distribution and microstructure of recycled powder was a similar. To investigate the possibility of reusing the soft magnetic composite sheet for electronics, recycled powder was treated to have a high aspect ratio (AR), and we finally obtained the 65~66 AR and $2.3{\mu}m$ thickness powder. To release the residual stress of powder, heat treatment was conducted under $300{\sim}400^{\circ}C$, $N_2$ gas. And then, soft magnetic sheet was made by tape casting process using by those powders. After the density and permeability of tape was measured, and we confirmed that the recycled Fe-Si electric sheet scrap was possible to reuse the soft magnetic materials of electronics.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.59-65
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• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.6
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• pp.708-714
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• 2016

In today's semiconductor industry, manufacturing technology is being developed for the purpose of processing large amounts of data and improving the speed of data processing. The packaging process in semiconductor manufacturing is utilized for the purpose of protecting the chips from the external environment and supplying electric power between the terminals. Nowadays, the WLP (Wafer-Level Packaging) process is mainly used in semiconductor manufacturing because of its high productivity. All of the silicon dies on the wafer are subjected to a high pressure and temperature during the molding process, so that die shift and warpage inevitably occur. This phenomenon deteriorates the positioning accuracy in the subsequent re-distribution layer (RDL) process. In this study, in order to minimize the die shift, a vision inspection system is developed to collect the die shift measurement data.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Korean Journal of Food Science and Technology
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• v.19 no.3
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• pp.206-211
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• 1987

In an attempt to improve the quality stability of dried layer (Porphyra yezoensis Ueda), during longterm storage and distribution, a 6 months storage trial at different temperature and packaging condition was conducted. Dried layer samples were prepared by conventional procedure with different washing condition and $5^{\circ}C$ and $30^{\circ}C$ were employed as storage temperature. The moisture sorption isotherm was drawn at $5^{\circ}C$ and $25^{\circ}C$ and BET equation was prepared from the moisture sorption isotherm. The monolayer moisture contents of dried layer were 7.4% at $5^{\circ}C$ and 6.4% at $25^{\circ}C$, respectively. It was also found that the changes in comprehensive quality of dried layer during storage was much less at low temperature and the degree of washing before drying process as far as its moisture contents are lower than monolayer moisture contents. With regard to the packing methods, vaccum packing was superior to air containing packaging for the maintainance of quality during storage.