• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.187-196
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• 2005

MEMS devices such as a vibratory gyroscope often suffer from a lower yield rate due to fabrication errors and the external stress. In the decoupled vibratory gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, fabricated with SOI (Silicon-On-Insulator) wafer and packaged using the anodic bonding, has a large wafer bowing caused by thermal expansion mismatch as well as non-uniform surfaces of the structures caused by the notching effect. These effects result in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) technology. It uses a silicon wafer and two glass wafers to minimize the wafer bowing and a metallic membrane to avoid the notching. In the packaged SiOG gyroscope, the notching effect is eliminated and the warpage of the wafer is greatly reduced. Consequently the frequency difference is more uniformly distributed and its variation is greatly improved. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Archives of design research
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• v.14 no.2
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• pp.117-126
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• 2001

Dietary life is said to be consummated even to a phase of art from phase of survival, recognition, selection and preference. Dietary life, from a sheer earing, is now transforming itself into a joy, and therefore, function of foodstuff packaging demand diversification rather than a simple packaging. Recently, socio-economic environment is showing conspicuous changes in that there are increasing number of working couples nuclear family, old-age population, social activity and improvement of living standards. Such a change in the living environment has much impact on our dietary life. Particularly, an age when cake and cookies of western origin were all but strange is gradually phasing out, while it is deemed to be improper to overlook the fact that bread and cakes are solidifying their position as part of foodstuff meanies for on dietary life. Of cakes and cookies, cakes have come to enjoy a position whereby they are regarded as part of an imperative for family banquets, various get-together and birthday celebration, etc., with a significant improvement that caters to our taste vis-a-vis an stage of introduction of cakes. At the time when reined foreign bakeries, one after another , are contemplating to make an inroad into Korea, and when the distribution market is to be opened fully in July of 1993, Korea bakeries that have been building up their position within the domestic market are expected to face a considerable number of difficulties. Accordingly, under such circumstances of the time text we are in it is attempted in this study to map out measures that may contribute to the strengthening of the products of business enterprises and improvement of corporate image that may appeal to feeling and emotions of consumers packaging that could attain objectives, and package design planning that, as an important factor for playing its own share in the restoration of humanism that is being alienated, may appeal to consumer sensitivity, rather than packaging that is being utilized merely as tool designed for marketing

• Journal of the Microelectronics and Packaging Society
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• v.26 no.1
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• pp.29-33
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• 2019

With shrinking form factor and improving performance of electronic packages, high input/output (I/O) density is considered as an important factor. Fan out wafer-level packaging (FO-WLP) has been paid great attention as an alternative. However, FO-WLP is vulnerable to warpage during its manufacturing process. Minimizing warpage is essential for controlling production yield, and in turn, package reliability. While many studies investigated the effect of process and design parameters on warpage using finite element analysis, they did not take uncertainty into consideration. As parameters, including material properties, chip positions, have uncertainty from the point of manufacturing view, the uncertainty should be considered to reduce the gap between the results from the field and the finite element analysis. This paper focuses on the effect of uncertainty of Young's modulus of chip on fan-out wafer level packaging warpage using finite element analysis. It is assumed that Young's modulus of each chip follows the normal distribution. Simulation results show that the uncertainty of Young's modulus affects the maximum von Mises stress. As a result, it is necessary to control the uncertainty of Young's modulus of silicon chip since the maximum von Mises stress is a parameter related to the package reliability.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.30 no.1
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• pp.63-72
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• 2024

Poly (butylene adipate-co-terephthalate) (PBAT) is one of the representative biodegradable polymers with high ductility and processability to replace petroleum-based polymers. Many investigations have been conducted to broaden the applications of PBAT in a variety of industries, including the food packaging, agricultural mulching film, and logistics and distribution fields. Foaming process is widely known technique to generate the cell structure within the polymer matrix, offering the insulation and light weight properties. However, there was no commercially feasible foam product based on biodegradable polymers, especially PBAT, and maintaining a proper melt viscosity of the polymer would be a key parameter for the foaming process. In this study, chemical foaming agent and cross-linking agent were introduced to PBAT, and a compression molding process was applied to prepare a foam sheet. The correlation between cell morphological structures and mechanical and physical properties was evaluated. It was found that PBAT with foam structures effectively reduced the density and thermal conductivity, allowing them to be suitable for applications such as insulation and lightweight packaging or cushion materials.

• Asian-Australasian Journal of Animal Sciences
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• v.26 no.1
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• pp.134-142
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• 2013

The effect of modified atmosphere packaging (MAP; 30% $CO_2$+70% $N_2$ or 100% $N_2$) and an additive mixture (500 ppm rosemary extract, 3,000 ppm sodium acetate and 1,500 ppm calcium lactate) on the quality of pre-cooked hamburger patties during storage at $5^{\circ}C$ for 14 d was evaluated. The addition of the additive mixture reduced aerobic and anaerobic bacteria counts in both 30% $CO_2$-MAP (30% $CO_2$+70% $N_2$) and 100% $N_2$-MAP (p<0.05). The 30% $CO_2$-MAP was more effective to suppress the microbial growth than 100% $N_2$-MAP, moreover the 30% $CO_2$-MAP combined with additive mixture resulted in the lowest bacterial counts. The hamburger patties with additive mixture showed lower CIE $L^*$ and CIE $a^*$, and higher CIE $b^*$ than those with no additive mixture. The 30% $CO_2$-MAP tended to decrease the TBARS during storage regardless of the addition of additives. The use of 30% $CO_2$-MAP in combination with additives mixture was effective for maintaining the quality and extending the shelf-life of pre-cooked hamburger patties.

• Journal of Biosystems Engineering
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• v.40 no.4
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• pp.409-416
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• 2015

Purpose: This study evaluates a new banana bulk packaging method under the real transport conditions of Sri Lanka. Methods: A field evaluation of optimized 8-mm thick Styrofoam sheets used as the cushioning material was applied. A trial transport was conducted from Thambuttegama to Colombo using a medium-sized open truck, with banana leaves as the control material. Data were recorded at the farmer, transporter, retailer, and consumer stages of the supply chain. Mechanical damage, physiological loss in weight, fruit firmness, total soluble solids, ripeness index, visual quality ratings, and the physical damage index of the bananas were measured at each stage. A cost-benefit analysis was also conducted for both packaging methods. Results: The 8-mm styrofoam sheets significantly reduced (p < 0.05) the mechanical damage from 26.3% to 12.9% compared to the conventional method for long-distance transport, and the physiological loss in weight showed a decrease of 2.88%. The loss of firmness of the fruits followed a simmilar pattern for both methods until reaching the retailer, but at the consumer was significantly higher (p < 0.05) for the control. However, the physical damage index at the retail stage for the control showed symptoms of physical injury, whereas the bananas transported using the cushioning materials exhibited only minor symptoms. Further, the visual quality of the fruits after transport from the farmer to the consumer was preserved, which is one of the main factors affecting consumer preference and retail price. The proposed method increases the profit margin by 51.2% for Embul bananas owing to the reduced postharvest losses. Conclusion: The 8-mm thick Styrofoam sheets reduced the physical damage to the bananas, with the quality parameters maintained at the prefered level. Moreover, profits may be increased.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Composites Research
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• v.15 no.1
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• pp.32-40
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• 2002

This study developed fabrication process of $SiC_p/Al$ metal matrix composites as electronic packaging materials by squeeze casting method. The $SiC_p$ preform were fabricated in newly designed preform mold using about 0.8 % of inorganic binder(SiO$_2$) and 5 vol.% of $Al_2O_3$fiber. To infiltrate the molten metal into the preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication conditions, heat transfer analysis were preformed using finite element method and thus analyzed the temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites, impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in this study have 0.2~0.3 J impact toughness, $8~10 ppm/^{\circ}C$ thermal expansion coefficient and $2.9~3.0g/cm^3$density which is appropriate properties for electronic packaging application.

• Food Science and Biotechnology
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• v.15 no.1
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• pp.5-12
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• 2006

Degradation performance of environmentally friendly plastics that can be disintegrated by combination of sunlight, microbes in soil, and heat produced in landfills was evaluated for use in industries. Two multi-degradable master batches (MCC-101 and MCC-102 were manufactured, separately mixed with polyethylene using film molding machine to produce 0.025 mm thick films, and exposed to sunlight, microbes, and heat. Low- and high-density polyethylene (LDPE and HDPE) films containing MCC-101 and MCC-102 became unfunctional by increasing severe cleavage at the surface and showed high reduction in elongation after 40 days of exposure to ultraviolet light. LDPE and HDPE films showed significant physical degradation after 100 and 120 days, respectively, of incubation at $68{\pm}2^{\circ}C$. SEM images of films cultured in mixed mold spore suspension at $30^{\circ}C$ and 85% humidity for 30 days revealed accelerated biodegradation on film surfaces by the action of microbes. LDPE films containing MCC-l01 showed absorption of carbonyls, photo-sensitive sites, at $1710\;cm${-1}$ when exposed to light for 40 days, whereas those not exposed to ultraviolet light showed no absorption at the same frequency. MCC-101-based LDPE films showed much lower $M_w$ distribution after exposure to UV than its counterpart, due to agents accelerating photo-degradation contained in MCC-101.

• Journal of Bio-Environment Control
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• v.24 no.2
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• pp.79-84
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• 2015

This study was carried out in order to develop an economical and convenient way to improve storability of sweet persimmon 'Fuyu'. Natural porous materials (bamboo active carbon, chaff charcoal, and Ge-lite) pouching bags were enveloped in the conventional LDPE (low density polyethylene) package during room temperature and low temperature storage. The changes of soluble solids content, flesh firmness, flavor, decay, and softening of sweet persimmon were investigated in the 1- or 2-week intervals. The LDPE packaging with bamboo active carbon treatment was confirmed to maintain longer storability and higher quality than the LDPE packaging only. This method is expected to be applied to both of conventional and organic farming as an economical and convenient way to improve storability on long term storage and during distribution.