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Fabrication Process and Impact Characteristic Analysis of Metal Matrix Composite for Electronic Packaging Application  

정성욱 (포항공과대학교 기계공학과 대학원)
정창규 (포항공과대학교 기계공학과 대학원)
남현욱 (포항공과대학교 기계공학과 대학원)
한경섭 (포항공과대학교 기계공학과)
Publication Information
Composites Research / v.15, no.1, 2002 , pp. 32-40 More about this Journal
Abstract
This study developed fabrication process of $SiC_p/Al$ metal matrix composites as electronic packaging materials by squeeze casting method. The $SiC_p$ preform were fabricated in newly designed preform mold using about 0.8 % of inorganic binder(SiO$_2$) and 5 vol.% of $Al_2O_3$fiber. To infiltrate the molten metal into the preform, fabrication condition such as the temperature and the pressure were selected. Applying the fabrication conditions, heat transfer analysis were preformed using finite element method and thus analyzed the temperature distribution and cooling characteristic during the squeeze casting. For the fabricated composites, impact toughness and thermal expansion coefficient were measured. The metal matrix composites developed in this study have 0.2~0.3 J impact toughness, $8~10 ppm/^{\circ}C$ thermal expansion coefficient and $2.9~3.0g/cm^3$density which is appropriate properties for electronic packaging application.
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Times Cited By KSCI : 2  (Citation Analysis)
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