Fig. 1. Process flow for chip first FO-WLP.
Fig. 2. Model structure.
Fig. 3. Finite element model (quarter model).
Fig. 4. Normalized maximum warpage (maximum deformation).
Fig. 5. maximum von Mises stress.
Fig. 6. Stress contour for one of simulations in case 4.
Fig. 7. Relationship among Young’s Modulus, von Mises stress and the distance from the wafer center.
Table 1. Material properties used in finite element analysis
Table 2. Material properties of silicon
Table 3. Summary of simulation results of warpage
Table 4. Summary of simulation results of von Mises stress
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