• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.19-26
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• 2004

High performance packages must provide excellent transmission characteristics. In face-up ceramic packages, however, parasitic characteristics of bondwires are not negligible at millimeter-wave frequencies. Consequently, the electrical performance of ceramic packages is degraded. In をis paper, we propose a new millimeter-wave ceramic package feed-through having Embedded Metal Sheets (EMS). The package that contains double-bondwire interconnections is analyzed by the FEM (Finite Element Method) and measured from 20 to 50GHz. As a result, the proposed package having Embedded Metal Sheets (EMS) achieved 0.85dB, 0.4dB insertion loss improvement on the conventional and the double bondwires buried in epoxy ( $\varepsilon_{{\gamma}}$/ = 4) ceramic package respectively to 47GHz. This improved ceramic package will be useful for MMICs modules and small ceramic packages developments.amic packages developments.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.61-66
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• 2004

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

• Asia pacific journal of information systems
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• v.10 no.3
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• pp.121-143
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• 2000

The enterprise resource planning(ERP) system becomes more popular as a vehicle of realizing an integrated information system, because this system not only facilitates the reengineering of processes in a firm but also provides the function of generating consolidated financial statements. However, ERP vendors have unsuccessfully provided methodologies on the customization of ERP packages although one of the important issues during the implementation of an ERP package is how to customize it. The purpose of this paper is to build a strategy on the successful customization of ERP packages. The result from the analysis of interviews with 25 consultants and experts in the ERP field recommends 14 customization strategies of an ERP package in the four areas of a firm: management, technology, organization, and environment. The analysis of the feedback from the consultants and experts generates the ranking of the 14 customization strategies.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Journal of KSNVE
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• v.7 no.4
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• pp.571-578
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• 1997

Recently, many general-purpose packages for fluid-structure interaction problems have been announced. However, they have a lot of limitations to model structures in the fluid-structure interaction problems reasonably. Utilizing general-purpose packages such as MSC/NASTRAN and SYSNOISE, in this paper, a method to slove the radiation scattering problems with some accuracy in the fluid-structure interaction problems was developed. Using a simple model, the results from the presented method here are compared with those from SYSNOISE. The result shows quite a good agreement between the two methods. The problems, which could not be solved by SYSNOISE, were tried to solve with the presented method and results were presented. It was proved that this method could be safely used to solve fluid-structure interaction problems.

• Culinary science and hospitality research
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• v.9 no.3
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• pp.182-196
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• 2003

This study is about color-image of chilled noodle packages. The improvement of living standard has lead the development of food industry, which has changed consumer's way of thinking toward food products and made clear the preference for food which was obscure before. In the past, the the right of choice for the products were not given to consumers in the market. But today, the market initiatives have been transferred to consumers. They are allowed to purchase their favorite products as the markets provide them with diversified products. Consequently, the importance of package design has increased. Color-image of chilled noodle packages stimulates consumers to purchase the products by offering necessary information which is very important as it is supposed to provide consumers with a good impression about the products.

• Structural Engineering and Mechanics
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• v.52 no.4
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• pp.739-753
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• 2014

There have been many packages that can be employed to analyze plane frames. However, because most structural analysis packages suffer from closeness of system, it is very difficult to integrate it with an optimization package. To overcome the difficulty, we proposed a possible alternative, DAMDO, which integrate Design, Analysis, Modeling, Definition, and Optimization phases into an integrative environment. The DAMDO methodology employs neural networks to integrate structural analysis package and optimization package so as not to need directly to integrate these two packages. The key problem of the DAMDO approach is how to generate a set of reasonable random designs in the first phase. According to the characteristics of optimized plane frames, we proposed the ratio variable approach to generate them. The empirical results show that the ratio variable approach can greatly improve the accuracy of the neural networks, and the plane frame optimization problems can be solved by the DAMDO methodology.

• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• Journal for History of Mathematics
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• v.11 no.1
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• pp.52-57
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• 1998

Since cluster analysis encompasses many diverse techniques for discovering structure within complex bodies of data, it has been employed as an effective tool in scientific inquiry. Recent works on cluster analysis softwares carried out by SAS, SPSS, S-PLUS and BMDP are briefly summarized and investigated in this paper. The inferred statistical package for windows executing a nay for data analysis in modern statistical techniques has several merits superior to other packages. Especially, S-PLUS can be designed and tried out much faster than other statistical packages. S-PLUS provides a graphic which is interactive, informative, flexible ways of looking at data. Also, if a statistical computation time is long and programs are complex, these can be shorten by providing interfaces to the UNIX systems (or C, Fortran).

• The Korean Journal of Applied Statistics
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• v.7 no.2
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• pp.279-288
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• 1994

Most of the statistical packages being used in Korea, such as SAS or SPSS, are imported from foreign countries. Since these package are written in English, it is not easy for Korean to learn the statistical packages. Also, most of the users except statistician use these expensive packages only to draw pictures and to make tables. We introduce a Korean statistical package which can be used easily for general public.