• 한국신뢰성학회지:신뢰성응용연구
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• 제10권2호
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• pp.137-148
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• 2010

This study deals with the accelerated life test of high power phosphor converted white Light Emitting Diodes (High power LEDs). Samples were aged at $110^{\circ}C$/85% RH and $130^{\circ}C$/85% RH up to 900 hours under non-biased condition. The stress induced a luminous flux decay on LEDs in all the conditions. Aged devices exhibited modification of package silicon color from white to yellowish brown. The instability of the package contributes to the overall degradation of optical lens and structural degradations such as generating bubbles. The degradation mechanisms of lumen decay and reduction of spectrum intensity were ascribed to hygro-mechanical stress which results in package instabilities.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.21-23
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• 2006

The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.108-111
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• 2000

The electrical characteristics of MQFP packages have been measured in RF regime. The s-parameter of the lead frame has been measured using the test fixture on which the do-capped package was mounted. A simple lumped equivalent circuit modeling of the lead frame and the test fixture can provide reasonable model parameters up to the frequency of 200 MHz.

• 한국정보과학회논문지:소프트웨어및응용
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• 제33권10호
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• pp.836-850
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• 2006

오늘날 급속한 패키지 소프트웨어 제품의 증가 추세에 따라서, 소프트웨어 제품에 대한 품질 시험 요구 또한 증가하였다. 소프트웨어 제품 시험 시 중요한 요소는 무엇을 시험할지 기준이 되는 메트릭의 선정이다. 본 연구에서는 패키지 소프트웨어 종류를 특성 벡터들로 표현하여 메트릭들과의 연관 관계를 확률로서 세밀하게 표현한다. 특성 벡터란 소프트웨어의 형식 분류 지시자라고 할 수 있으며 특정한 패키지 소프트웨어가 다른 것들과 어떻게 구별되는지 나타낼 수 있다. 분류된 각각의 소프트웨어 형식별로 메트릭을 선정하기 위해서 과거 시험 데이타를 분석하여 활용한다. 베이지언망이 과거 데이타 분석에 이용되며 특성 벡터와 메트릭 간의 의존 관계 네트워크를 구축한다. 구축된 베이지언망은 새로운 패키지 소프트웨어 시험 작업에 적절한 메트릭을 찾아내는데 활용된다.

• 한국건축친환경설비학회 논문집
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• 제12권6호
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• pp.543-556
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• 2018

Zero energy building was attended for energy consumption minimization by the energy saving technology about building heating and cooling energy consumption and the renewable energy production facility. So the government has supported the zero energy building supply for decreasing green gas emissions. The study about inventory of zero energy building has many proceeding. That inventory need the information of material and equipment. So information of material and equipment about zero energy building must be included for the zero energy building realization. Actually the database of zero energy building inventory construction through the inventory established studies has difficult because the database need many information. In this study, author proposed the test methods and performance reference for upload at inventory. It was constructed to material - module - package. Also the author analyzed the construction of the technical package for zero energy building. The author separated performance category to the energy performance for energy analysis and other performance for confirmed the durability, stability and etc. This performance category proposed the table. The test methods of material and equipment in the passive package and active package proposed to the international standard and korea standard basically korea standard. Also the performance reference was proposed to korea legal standard and various standard by this study results. And the authors proposed the table of performance value, test methods, performance reference. By result of this study, the test methods and performance reference will be used the basic data for inventory of zero energy building.

• 대한산업공학회지
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• 제41권3호
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• pp.267-274
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• 2015

In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

• 한국군사과학기술학회지
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• 제14권3호
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• pp.388-396
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• 2011

Mission Equipment Package(MEP) system is a collection of avionic components that are integrated to perform the mission of the Korean Utility Helicopter(KUH). MEP system development is classified mission-critical embedded system but KUH MEP system developed including flight-critical data implementation. It is important to establish the good development and verification process for the successful system development. This paper describe the development and verification process in each phase for the KUH MEP system. MEP system design is verified through the qualification test, system failure test and compatibility test in System Integration Laboratory(SIL).

• 한국자동차공학회논문집
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• 제22권3호
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• pp.157-165
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• 2014

To develop a compact vehicle for women, the most important areas are 'behavioral characteristics, life style and driving posture'. Static AM95%ile manikin is used for package guideline. Since women's characteristics and sitting position are different from men, however, the guideline cannot satisfy women drivers. Therefore, the goal of this study is to make the database with dynamic women's driving posture and behavioral characteristics at compact vehicle. Research process will be made as follows. Firstly, through the online/offline survey and statistic analysis, lifestyle and behavioral characteristics (discomfort elements) of women are extracted. Secondly, the author performs scenario test to acquire the discomfort value of driving situation and life style. 3D models of women's manikin and driving posture were created by CATIA HUMAN. The 3D models are used for the purpose of analyzing women's driving posture. Finally, with the ANOVA result and comparison between real driving posture and package guidelines, the author is able to suggest the main issue for women drivers.

• 한국병원경영학회지
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• 제6권3호
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• pp.90-108
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• 2001

This research examines the compensation package maximizing the utilities of internal customers by applying the market segmentation theory. Data were collected from four Korean hospitals in Seoul, Pusan and Kyunggi-do. The research is designed to seek the compensation package maximizing the utility of doctors and nurses by applying the market segmentation theory. The compensation package for doctors and nurses was classified into 5 attributes which are level of salary, payment method, education, promotion, reward method. The test results were as follows. First, the relative importance of each attribute in the compensation package is different. The level of salary is the most important, reward method is the next. Second, the utility of doctors increases by 8.7%, when they are segmented on the basis. of their preference for compensation attributes while that of nurses increases by 39.8%. The results of this study imply that the utility of doctors and nurses increases with differentiated compensation package for internal customer segmented by their preference.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2001년도 정기학술대회
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• pp.239-244
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• 2001

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.