Reliability Evaluation of Semiconductor using Ultrasonic

초음파를 이용한 반도체의 신뢰성 평가

  • 장효성 (한양대학교 대학원 정밀기계공학과) ;
  • 하욥 (한양대학교 대학원 정밀기계공학과) ;
  • 장경영 (한양대학교 기계공학부) ;
  • 김정규 (한양대학교 기계공학부)
  • Published : 2001.06.01

Abstract

Today, Ultrasonic is used as an important non-destructive test tool of semiconductor reliability evaluation and failure analysis. The semiconductor packaging trend goes to develop thin package, this trend makes difficult to inspect to defect in semiconductor package. One of the important problem in all semiconductor is moisture absorption in the atmosphere. This moisture causes crack or delamination to package when the semiconductor package is soldered on PCB. Reliability evaluation of semiconductor's object is investigating the effect of this moisture. For that reason, this study is investigating the effect of this moisture and reliability evaluation of semiconductor after preconditioning test and scanning acoustic microscope.

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