Proceedings of the IEEK Conference (대한전자공학회:학술대회논문집)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A Study on Measurement of Semiconductor Package in RF Regime

RF대역에서의 반도체 package 특성 측정에 관한 연구

  • 박현일 (고려대학교 전자공학과 Nano-Electronics Lab.) ;
  • 김기혁 (고려대학교 전자공학과 Nano-Electronics Lab.) ;
  • 황성우 (고려대학교 전자공학과 Nano-Electronics Lab.)
  • Published : 2000.11.01
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Abstract

The electrical characteristics of MQFP packages have been measured in RF regime. The s-parameter of the lead frame has been measured using the test fixture on which the do-capped package was mounted. A simple lumped equivalent circuit modeling of the lead frame and the test fixture can provide reasonable model parameters up to the frequency of 200 MHz.

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