• Title/Summary/Keyword: package module

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Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications (전기자동차용 고신뢰성 파워모듈 패키징 기술)

  • Yoon, Jeong-Won;Bang, Jung-Hwan;Ko, Yong-Ho;Yoo, Se-Hoon;Kim, Jun-Ki;Lee, Chang-Woo
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.1-13
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    • 2014
  • The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

Development and Verification of OGSFLAC Simulator for Hydromechanical Coupled Analysis: Single-phase Fluid Flow Analysis (수리-역학적 복합거동 해석을 위한 OGSFLAC 시뮬레이터 개발 및 검증: 단상 유체 거동 해석)

  • Park, Chan-Hee;Kim, Taehyun;Park, Eui-Seob;Jung, Yong-Bok;Bang, Eun-Seok
    • Tunnel and Underground Space
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    • v.29 no.6
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    • pp.468-479
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    • 2019
  • It is essential to comprehend coupled hydro-mechanical behavior to utilize subsurface for the recent demand for underground space usage. In this study, we developed a new simulator for numerical simulation as a tool for researching to consider the various domestic field and subsurface conditions. To develop the new module, we combined OpenGeoSys, one of the scientific software package that handles fluid mechanics (H), thermodynamics (T), and rock and soil mechanics (M) in the subsurface with FLAC3D, one of the commercial software for geotechnical engineering problems reinforced. In this simulator development, we design OpenGeoSys as a master and FLAC3D as a slave via a file-based sequential coupling. We have chosen Terzaghi's consolidation problem related to single-phase fluid flow at a saturated condition as a benchmark model to verify the proposed module. The comparative results between the analytical solution and numerical analysis showed a good agreement.

Development of Compact and Lightweight Broadband Power Amplifier with HMIC Technology (HMIC 기술을 적용한 소형화 경량화 광대역 전력증폭기 개발)

  • Byun, Kisik;Choi, Jin-Young;Park, Jae Woo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.11
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    • pp.695-700
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    • 2018
  • This paper presents the development of compact and lightweight broadband power amplifier module using HMIC (Hybrid Microwave Integrated Circuit) technology that could be high-density integration for many non-packaged microwave components into the small area of a high dielectric constant printed circuit board, such as a ceramic substrate, also using the special design and fabrication schemes for the structure of minimized electromagnetic interference to obtain the homogeneous electrical performance at the wideband frequency. The results confirmed that the small signal gain has a gain flatness of ${\pm}1.5dB$ within the range of 32 to 36 dB. In addition, the output power satisfied more than 30 dBm. The noise figure was measured within 7 dB, and OIP3 (Output Third Order Intercept Point) was more than 39 dBm. The fabricated broadband power amplifier satisfied the target specification required to electrically drive the high power amplifiers of jamming generators for electronic warfare, so the actual applicability to the system was verified. Future studies will be aimed at designing other similar microwave power amplifiers in the future.

Battery Module Bonding Technology for Electric Vehicles (전기자동차 배터리 모듈 접합 기술 리뷰)

  • Junghwan Bang;Shin-Il Kim;Yun-Chan Kim;Dong-Yurl Yu;Dongjin Kim;Tae-Ik Lee;Min-Su Kim;Jiyong Park
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.33-42
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    • 2023
  • Throughout all industries, eco-friendliness is being promoted worldwide with focus on suppressing the environmental impact. With recent international environment policies and regulations supported by government, the electric vehicles demand is expected to increase rapidly. Battery system itself perform an essential role in EVs technology that is arranged in cells, modules, and packs, and each of them are connected mechanically and electrically. A multifaceted approach is necessary for battery pack bonding technologies. In this paper, pros and cons of applicable bonding technologies, such as resistance welding, laser and ultrasonic bonding used in constructing electric vehicle battery packs were compared. Each bonding technique has different advantages and limitations. Therefore, several criteria must be considered when determining which bonding technology is suitable for a battery cell. In particular, the shape and production scale of battery cells are seen as important factors in selecting a bonding method. While dealing with the types and components of battery cells, package bonding technologies and general issues, we will review suitable bonding technologies and suggest future directions.

Development of Compatible Health Level 7 Parser (호환 가능한 HL7 파서의 개발)

  • Park, Hyun Sang;Kim, Hwa Sun;Cho, Hune
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.7
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    • pp.4290-4300
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    • 2014
  • The previous HL7 interface should be developed as a separate package or conversion module for each version to process HL7 messages from different versions. This study designed and developed an HL7 parser compatible among different versions based on the requirements of compatibility defined in HL7 V2.5. According to the structure of the parser, the inheritance concept in object-oriented programming was adopted so that the class object of the HL7 message from the lower version could be inherited to the class object of the upper version. Therefore, every version's HL7 messages could be processed using only the upper class' object regardless of the version. To evaluate the compatibility of the developed parser, 700 data sets about inpatients with rheumatoid arthritis were used. The 700 cases underwent the compatibility test successfully. In the near future, further research on the Inter-compatibility HL7 parser is planned.

Development of P.P.T CanSat System Applying Energy Harvesting System (에너지 하베스팅 시스템을 적용한 자가발전 P.P.T CanSat 시스템 개발)

  • Chae, Bong-Geon;Kim, Su-Hyeon;Kim, Hye-In;Oh, Hyun-Ung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.46 no.4
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    • pp.315-323
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    • 2018
  • CanSat has being attracted considerable attentions for the use as training purposes owing to its advantage that can implement overall system functions of typical commercial satellites within a small package like a beverage can. So-called P.P.T CanSat (Power Plant Trio Can Satellite), proposed in this study, is the name of a CanSat project which have participated in 2015 domestic CanSat competition. Its main objective is to self-power on a LED and a MEMS sensor module by using electrical energy harvested from solar, wind and piezo energy harvesting systems. This study describes the system design results, payload level function tests, flight test results and lessons learned from the flight tests.

Development a Two Step Heater Using Induction Heating Based on o High Frequency Resonant Inverter (고주파 공진형 인버터를 이용한 유도가열형 2단 히터)

  • Shin, Dae-Cheul;Kwon, Hyuk-Min
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.19 no.7
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    • pp.81-86
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    • 2005
  • Proposed induction-heated system is innovative system which applied special high-frequency power circuit technique for thermal converse technique and IH(Induction-Heating) magnetic induction heating generated from induction-heated metallic package that is for distillation unit. In this occurs not burning, so that the working environment can be improved. This electromagnetic induction heating technique is used high frequency inverter. By using high frequency inverter high frequency alternative current (HFAC) in the range of [kHz] can be made with conventional alternative current In this contribution IGBT module is used for high frequency inverter. In this paper are discussed action analysis and characteristics analysis of 1.5[kW]-Class half-bridge resonant inverter system and resonant metallic packaged. In addition, by using this system,t how two step heating superheated steam generator is developed and application of system are also discussed.

Thermal Analysis of the Heat Sink Performance using FEM (유한 요소법을 이용한 히트싱크의 성능평가를 위한 열해석 연구)

  • Lee, Bong-Gu;Lee, Min
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.9
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    • pp.5467-5473
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    • 2014
  • This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

Applying a Forced Censoring Technique with Accelerated Modeling for Improving Estimation of Extremely Small Percentiles of Strengths

  • Chen Weiwei;Leon Ramon V.;Young Timothy M.;Guess Frank M.
    • International Journal of Reliability and Applications
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    • v.7 no.1
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    • pp.27-39
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    • 2006
  • Many real world cases in material failure analysis do not follow perfectly the normal distribution. Forcing of the normality assumption may lead to inaccurate predictions and poor product quality. We examine the failure process of the internal bond (IB or tensile strength) of medium density fiberboard (MDF). We propose a forced censoring technique that closer fits the lower tails of strength distributions and better estimates extremely smaller percentiles, which may be valuable to continuous quality improvement initiatives. Further analyses are performed to build an accelerated common-shaped Weibull model for different product types using the $JMP^{(R)}$ Survival and Reliability platform. In this paper, a forced censoring technique is implemented for the first time as a software module, using $JMP^{(R)}$ Scripting Language (JSL) to expedite data processing, which is crucial for real-time manufacturing settings. Also, we use JSL to automate the task of fitting an accelerated Weibull model and testing model homogeneity in the shape parameter. Finally, a package script is written to readily provide field engineers customized reporting for model visualization, parameter estimation, and percentile forecasting. Our approach may be more accurate for product conformance evaluation, plus help reduce the cost of destructive testing and data management due to reduced frequency of testing. It may also be valuable for preventing field failure and improved product safety even when destructive testing is not reduced by yielding higher precision intervals at the same confidence level.

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Implementation of High-Quality Si Integrated Passive Devices using Thick Oxidation/Cu-BCB Process and Their RF Performance (실리콘 산화후막 공정과 Cu-BCB 공정을 이용한 고성능 수동 집적회로의 구현과 성능 측정)

  • 김동욱;정인호
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.15 no.5
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    • pp.509-516
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    • 2004
  • High-performance Si integrated passive process was developed using thick oxidation process and Cu-BCB process. This passive process leads to low-cost and high-quality RF module with a small form factor. The fabricated spiral inductor with 225 um inner diameter and 2.5 turns showed the inductance of 2.7 nH and the quality factor more than 30 in the frequency region of 1 ㎓ and above. Also WLCSP-type integrated passive devices were fabricated using the high-performance spiral inductors. The fabricated low pass filter had a parallel-resonance circuit inside the spiral inductor to suppress 2nd harmonics and showed about 0.5 ㏈ insertion loss at 2.45 ㎓. And also the high/low-pass balun had the insertion loss less than 0.5 ㏈ and the phase difference of 182 degrees at 2.45 ㎓.