• 제목/요약/키워드: package method

검색결과 1,412건 처리시간 0.022초

Glass Remote Phosphor 구조를 갖는 백색 LED 패키지의 형광체 함량과 열처리 온도 최적화 (Optimization of Phosphor Contents and Heat-treatment Temperature in White LED Package with Glass Remote Phosphor Structure)

  • 정희석;홍석기;염정덕
    • 조명전기설비학회논문지
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    • 제30권3호
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    • pp.30-38
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    • 2016
  • In this research, a 6W white LED package with a Glass Remote Phosphor was developed to improve the life of an LED package. The Glass Remote Phosphor was fabricated by the Phosphor in Glass (PiG) method, wherein phosphor YAG:Ce was mixed with glass frit and then heat treated. A paste with 75wt.% of a phosphor substance and 25wt.% glass frit was coated on a glass substrate two times using the screen-printing technique and heat-treated at $800^{\circ}C$ ; this structure gave a luminous efficacy of 136.1lm/W, color rendering index of 74Ra, and color temperature of 5,342K, thus satisfying the requirements as a light source for lighting. Moreover, an IES LM-80 accelerated life test was conducted on the same LED package for 6,000h in order to estimate the L70 lifetime based on IES TM-21. The results showed guaranteed lifetimes of 213,000h at $55^{\circ}C$, 245,000h at $85^{\circ}C$, and 209,000h at $95^{\circ}C$.

IC 패키지 마킹검사를 위한 적응적 다단계 이진화와 정합단위의 동적 선택 (An Adaptive Multi-Level Thresholding and Dynamic Matching Unit Selection for IC Package Marking Inspection)

  • 김민기
    • 정보처리학회논문지B
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    • 제9B권2호
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    • pp.245-254
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    • 2002
  • 머신비전을 이용한 IC 패키지 마킹검사 시스템은 입력영상으로부터 검사할 요소들의 위치를 식별하고, 추출된 요소들을 학습된 표준 패턴과 비교하여 마킹의 불량 여부를 판단한다. 본 논문에서는 검사 대상 IC 패키지의 위치 판별, 마킹문자 추출, 핀원딤플 검출과 같은 일련의 작업들에 적합한 적응적 다단계 이진화 방법과 마킹문자의 국소적인 오류검출은 물론 잡영에 강건한 정합단위의 동적 선택 방법을 제안한다. 제안하는 이진화 방법은 이진화 대상 영역과 명도 값의 범위를 제한하여 Otsu의 이진화 알고리즘을 적용함으로써 특정 응용에 적응적인 이진화가 가능하다. 정합단위의 동적 선택 방법은 문자추출 및 배치분석에 대한 결과에 따라 정합단위를 선택한다. 그러므로 문자추출 및 배치분석 과정에서 발생하는 예기치 못한 부적절한 상황에서도 가능한 범위내에서 최소의 정합단위를 선택할 수 있다. 제안된 방법을 구현하여 8종의 IC 패키지, 총 280개의 영상에 대하여 실험한 결과, IC 패키지와 핀원딤플의 검출율은 100%였으며, 마킹상태에 대한 판정은 98.8%의 정확도를 나타내어 제안된 방법이 효과적임을 확인할 수 있었다.

Influence of Self-Construal on Choice of Overseas Travel Product Type

  • KIM, Young-Doo
    • 산경연구논집
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    • 제11권1호
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    • pp.29-38
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    • 2020
  • Purpose: Understanding which product types of overseas travel (free independent travel vs. package travel) consumers will choose is one of the key issues of marketing and consumer behavior in travel agency management. Prior studies on overseas travel type preferences mainly focused on comparing regional differences (e.g., Asian vs. Westerner, or Korean vs. Australian, or Korean vs. Japanese, or American, French, Italian vs. Japanese) influencing the choice of overseas travel type. Another researchers focused on comparing cultural differences (e.g., individualism vs. collectivism, or individualistic culture vs. collectivistic culture), subcultural difference (e.g., acculturation; Koreans living in Republic of Korea vs. Koreans living in Australia), travel lifestyle, and socio-demographics (e.g., age, gender, income level, education level, marital status, occupation etc.). However, there are few studies that identify individual psychological differences (i.e., individual psychological differences within the same culture) influencing the choice of overseas travel type. Self-construal is a psychological factors that greatly influences choice behavior. The purpose of this study was to examine the role of self-construal as an antecedent variable influencing choice of overseas travel product type. Research design, data and methodology: To achieve the purpose of this study, the questionnaire survey method was used. Self-construal items composed of independent self-construal items and interdependent self-construal items. Product types of overseas travel were free independent travel (FIT) type versus package travel type. In this study, the correlation coefficient between independent self-construal and interdependent self-construal was nonsignificant. It meant that the relationship between independent self-construal and interdependent self-construal was orthogonal. Therefore it was analyzed that independent self-construal and interdependent self-construal separately. Reliability analysis, factor analysis, and logistic regression analysis (controlling gender and age) was used as the data analysis method. Results: According to the results of this study, the stronger independent self-construal, the more preference for the free independent travel type rather than package travel, and the stronger interdependent self-construal, the more preference for the package travel type rather than free independent travel. Conclusions: Self-construal is an antecedent variable influencing the choice of travel type. Travel agencies must consider the consumer's self-construal (independent self-construal vs. interdependent self-construal) before planning and designing overseas travel products.

수직형 Feed-through 갖는 RF-MEMS 소자의 웨이퍼 레벨 패키징 (Wafer Level Packaging of RF-MEMS Devices with Vertical Feed-through)

  • 박윤권;이덕중;박흥우;김훈;이윤희;김철주;주병권
    • 한국전기전자재료학회논문지
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    • 제15권10호
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    • pp.889-895
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    • 2002
  • Wafer level packaging is gain mote momentum as a low cost, high performance solution for RF-MEMS devices. In this work, the flip-chip method was used for the wafer level packaging of RF-MEMS devices on the quartz substrate with low losses. For analyzing the EM (electromagnetic) characteristic of proposed packaging structure, we got the 3D structure simulation using FEM (finite element method). The electric field distribution of CPW and hole feed-through at 3 GHz were concentrated on the hole and the CPW. The reflection loss of the package was totally below 23 dB and the insertion loss that presents the signal transmission characteristic is above 0.06 dB. The 4-inch Pyrex glass was used as a package substrate and it was punched with air-blast with 250${\mu}{\textrm}{m}$ diameter holes. We made the vortical feed-throughs to reduce the electric path length and parasitic parameters. The vias were filled with plating gold. The package substrate was bonded with the silicon substrate with the B-stage epoxy. The loss of the overall package structure was tested with a network analyzer and was within 0.05 dB. This structure can be used for wafer level packaging of not only the RF-MEMS devices but also the MEMS devices.

분산형 컨퍼런스 환경에서의 효율적인 컨퍼런스 이벤트 패키지 처리 방식 (A Method of Efficient Conference Event Package Processing in Distributed Conference Environment)

  • 장춘서;조현규;이기수
    • 한국컴퓨터정보학회논문지
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    • 제13권7호
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    • pp.199-205
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    • 2008
  • 중앙 집중형 컨퍼런스 모델은 컨퍼런스 관리 및 제어가 용이한 장점이 있으나 컨퍼런스 사용자 수가 증가할수록 성능의 저하가 커지므로 확장성에 제약이 있다. 따라서 중앙 집중형 컨퍼런스 모델의 확장성을 개선할 수 있는 새로운 분산형 컨퍼런스 모델들이 최근 제안되고 있다. 이러한 분산형 컨퍼런스 구조에서는 컨퍼런스사용자가정해진 최대값을 넘을 경우 동적으로 새로운 컨퍼런스 서버가 추가되며, 본 논문에서는 이러한 분간형 컨퍼런스 환경에서 주 컨퍼런스 서버가 담당해야 할 컨퍼런스 이벤트 패키지의 처리 방식을 효율화 시킬 수 있는 새로운 방식을 제안하였다. 주 컨퍼런스 서버는 부 컨퍼런스 서버들 및 사용자들과 컨퍼런스 이벤트 패키지를 사용해 정보를 교환하며. 자신이 관리하는 컨퍼런스 정보 데이터베이스에서 컨퍼런스 사용자들에 대한 통지 기능을 분담할 SIP(Session Initiation Protocol) UA(User Agent)들을 선정하여 이들의 목록을 각 컨퍼런스 서버들에게 전송한다. 이를 수신한 각 컨퍼런스 서버들은 선정된 UA들이 컨퍼런스 이벤트 패키지 처리를 분담하도록 하여 컨퍼런스 서버에서의 SIP 신호 처리 부하를 줄일 수 있으며 분산형 컨퍼런스 모델에서의 확장성을 개선시킨다. 제안된 시스템의 성능은 실험을 통하여 분석하였다.

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반도체 패키지용 PCB의 구조 모델링 방법에 따른 패키지의 warpage 수치적 연구 (Numerical Study on Package Warpage as Structure Modeling Method of Materials for a PCB of Semiconductor Package)

  • 조승현;전현찬
    • 마이크로전자및패키징학회지
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    • 제25권4호
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    • pp.59-66
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    • 2018
  • 본 논문에서는 수치해석을 사용하여 반도체용 패키지에 적용된 인쇄회로기판 (PCB(printed circuit board)) 구조를 다층 구조의 소재 특성을 모델링한 것과 단일 구조라고 가정한 모델링을 적용하여 warpage를 해석함으로써 단일 구조 PCB 모델링의 유용성을 분석하였다. 해석에는 3층과 4층 회로층을 갖는 PCB가 사용되었다. 또한 단일 구조 PCB의 재료 특성값을 얻기 위해 실제 제품을 대상으로 측정을 수행하였다. 해석 결과에 의하면 PCB를 다층 구조로 모델링한 경우에 비해 단일 구조로 모델링한 경우에 warpage가 증가하여 PCB 구조의 모델링에 따른 warpage 분석결과가 분명한 유의차가 있었다. 또한, PCB의 회로층이 증가하면 PCB의 기계적 특성인 탄성계수와 관성모멘트가 증가하여 패키지의 warpage가 감소하였다.

조석 모델링에서 adjoint 방법 적용시 적정 가중치 산정 (Estimation of Optimal Weight in Tidal Modeling with the Adjoint Method)

  • 이재학;박경;송용식
    • 한국해양학회지:바다
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    • 제5권3호
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    • pp.177-185
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    • 2000
  • 자료동화기법의 하나인 adjoint 방법은 제약조건으로서 모델의 기본방정식을 만족시키는 동시에 모델 결과와 관측자료 차이의 함수인 비용함수의 크기를 최소화시키는 모델변수를 찾아냄으로서 모델 결과를 향상시키는 기법이다. 본 연구에서는 수평방향 2차원 선형 조석모델과 adjoint 모델로 구성된 adjoint 꾸러미를 수립하고, 이를 임의로 설정한 직사각형 모델영역에 적용하였다. 조석모델로부터의 조위 모델 결과를 관측자료로 삼아 개방경계조건인 조위의 진폭을 역 추정하는 수치실험을 실시하여 자료 가중치에 대한 반응, 모델변수 초기 추정치의 중요성 및 지형 변화에 대한 반응 등을 살펴보았다 특히, adjoint꾸러미 적용시 대부분 경험적으로 설정되어왔던 가중치의 선정방법을 제시하였다.

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다구찌 방법에 의한 PAC 실내기 유로의 최적설계 (Optimum Design of an Indoor Package Air-Conditioner's Flow Path by Taguchi Method)

  • 김장권;오석형
    • 동력기계공학회지
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    • 제18권1호
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    • pp.32-37
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    • 2014
  • In this study, the optimum design process of an indoor package air-conditioner (PAC) was implemented by Taguchi method. The goal of this study is to obtain the best set condition of each control factor composing of an indoor PAC. The number of revolution of a double inlet sirocco fan installed in an indoor PAC was measured by the orthogonal array of $L_{18}(2^3{\times}3^4)$ and analysed by using the-smaller- the-better characteristic among the static characteristic analyses. As a result, the optimum condition of an indoor PAC was found as a set of when the cost of production, assembling and working conditions were considered. Moreover, the number of revolution of a double-inlet sirocco fan used for an optimum condition was reduced about 8.5% more than that of a standard condition for the target flowrate of $18.5m^3/min$.

승용차 디젤 엔진 소음에 대한 음질 평가 기법 연구 (Study on the Sound Quality Evaluation Method for the Vehicle Diesel Engine Noise)

  • 권요섭;김찬묵;김기창;김진택
    • 한국소음진동공학회논문집
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    • 제21권10호
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    • pp.883-889
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    • 2011
  • The brand sound of vehicle diesel engine is recently one of the important advantage strategies in the automotive company. Because various noise components masked under high frequency level can be audible in quieter driving situation. Many researches have been carried out for subjective and objective assessments on vehicle sounds and noises. In particular, the interior sound quality has been one of research fields that can give high quality feature to vehicle products. Vehicle interior noise above 500 Hz is usually controlled by sound package parts. The materials and geometries of sound package parts directly affect on this high frequency noise. This paper describes the sound quality evaluation method for the vehicle diesel engine noise to establish objective criteria for sound quality assessment. Considering the sensitivity of human hearing to impulsive sounds such as diesel noise, the human auditory mechanism was simulated by introducing temporal masking in the time domain. Furthermore, each of the human auditory organs was simulated by computer codes, providing reasonable analytical explanations of typical human hearing responses to diesel noise. This method finally provides the sound quality index of vehicle diesel engine noise that includes high frequency intermittent offensive sounds caused by impacting excitations of combustion and piston slap.

준해석적 비선형 설계민감도를 위한 보정변위하중법 (Consistent Displacement Load Method for Nonlinear Semi-Analytical Design Sensitivity Analysis)

  • 이민욱;유정훈;이태희
    • 대한기계학회논문집A
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    • 제29권9호
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    • pp.1209-1216
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    • 2005
  • Three methods for design sensitivity such as numerical differentiation, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis is exact, it is hard to implement for practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable for most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate because its computational cost depends on the number of design variables and large numerical errors can be included especially in nonlinear design sensitivity analysis. Thus semi-analytical method is more suitable for complicated design problems. Moreover semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure for the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and computational technique is proposed, which evaluates the pseudo-load for design sensitivity analysis easily by using the design variation of corresponding internal nodal forces. Errors in semi-analytical design sensitivity analysis are examined and numerical examples are illustrated to confirm the reduction of numerical error considerably.