• 대한기계학회논문집A
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• 제28권10호
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• pp.1590-1597
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• 2004

Three methods of design sensitivity analysis for structures such as numerical method, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis can provide very exact result, it is difficult to implement into practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable fur most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate in nonlinear design sensitivity analysis because its computational cost depends on the number of design variables and large numerical errors can be included. Thus the semi-analytical method is more suitable for complicated design problems. Moreover, semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure fur the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and the computational technique is proposed for evaluating the partial differentiation of internal nodal force, so called pseudo-load. Numerical examples coupled with commercial finite element package are shown to verify usefulness of proposed semi-analytical sensitivity analysis procedure and computational technique for pseudo-load.

• 한국식품저장유통학회지
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• 제2권2호
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• pp.285-291
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• 1995

This study was performed to investigate the optimum moisture content and the best packaging method of dried persimmons for long term storage at room temperature. The package material to be used were 0.05mm polyethylene film, Wrap film, 0.08mm LDPE film exchanged nitrogen gas, and non package for untreated control. Before the storage, the initial moisture contents of dried persimmons were treated with 40%, 35% and 30%, respectively; 40% as traditional dryness, 35% as extending dry period one more week, and 30% as for two more weeks. The best package method was 0.08mm LDPE film exchanged nitrogen gas, and the optimum moisture control was 35%

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.239-242
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• 2003

Optical module package is a hermetic metal-ceramic package for carrying optical IC. In case of LD(laser diode) module, window is used for both the path of optical signal and hermetic sealing of package. So, window has the metallization pattern on the surface for brazing process with package wall. In this study, several method were investigated for metallization. Thin film, thick film and mixed method were used for fabrication of metallization pattern. After brazing process, hermeticity and adhesion strength were tested for characterization of metallization pattern.

• 한국포장학회지
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• 제13권3_4호
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• pp.113-120
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• 2007

The method to characterize the fresh produce respiration was presented with possible application of modified atmosphere package design. Particularly the respiration model based on enzyme kinetics was introduced as function of oxygen and carbon dioxide concentrations. The method to estimate the equilibrated package atmosphere for any package conditions was presented by incorporation of $O_2$ and $CO_2$ permeabilities of the packaging film. Temperature dependences for fresh produce respiration and gas permeation were given by Arrhenius equation and then used to analyze the effect of temperature on the package atmosphere. An example analysis was presented for better understanding of the concept.

• 한국정밀공학회지
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• 제17권12호
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.841-842
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• 2012

• 정보처리학회논문지D
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• 제10D권5호
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• pp.821-828
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• 2003

패키지 소프트웨어는 그 특성상 동일한 유형에 속하는 다수의 제품 중에서 구매자가 적합하다고 판단되는 제품을 식별한 수 있어야 한다. 패키지 소프트웨어 제품에 대한 구매자의 선택 능력은 객관적인 품질 시험 절차와 방법을 통해 정해진 기준에 부합되는가를 판단할 수 있는 체계를 갖추고 있는가에 달려 있다. 이러한 체계를 구축하기 위해 패키지 소프트웨어에 적용할 수 있는 표준으로서 와 이 있다. 본 연구에서는 이러한 표준을 기반으로 패키지 소프트웨어에 대한 품질시험 프로세스를 구축하고 시험 메트릭과 적용 방법을 개발함으로써 구매자가 효과적으로 자신의 요구에 맞는 패키지 소프트웨어론 선택할 수 있는 체계를 구축하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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• pp.133-136
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• 2001

A new package design method to reduce resonance effect due to an IC package is represented. Frequency-variant circuit model of the power/ground plane was developed to accurately reflect the resonance. The circuit model is benchmarked with a full wave simulation, thereby verifying its accuracy. Then it was shown that the proposed technique can efficiently reduce the resonance due to the IC package.