• Proceedings of the Korean Society of Postharvest Science and Technology of Agricultural Products Conference
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• 2003.10a
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• pp.187-187
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• 2003

To examine the effect of packaging method on strawberry, tomato, and plum quality, the rate of weight loss, Hunter a value, decay rate, anthocyanin contents, and microbial (total bacterial counts, mold and yeast, and pseudomonas) changes were determined during storage. Strawberry was packaged with low density polyethylene (LDPE). Tomato and plum were packaged with high density polyethylene film (HDPE). Strawberries, tomatoes, and plums were then stored at 4$^{\circ}C$ and 20$^{\circ}C$, respectively. LDPE package was the most effective on the decrease of decay rate of strawberry and the rate of weight loss for packaged strawberry was lower than that of the non-packaged. HDPE package was the most effective on the rate of weight loss during storage of tomatoes and plums regardless of storage temperature. Hunter a value increased during storage. Anthocyanin contents of plums increased overall with increasing storage time, and plums stored without package were changed more than those with package. Microbial changes of strawberry, tomato, and plum stored at 4$^{\circ}C$ and 20$^{\circ}C$ were monitored during storage. Packaging method did not affect the microbial change, yet temperature did affect the microbial change significantly. These results indicate that storage of these commodities at 4$^{\circ}C$ should be recommended in terms ,of microbial safety as well as quality and shelf-life.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.43-51
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• 2014

In 3-dimensional (3D) integrated package, thermal management is one of the critical issues due to the high heat flux generated by stacked multi-functional chips in miniature packages. In this study, we used numerical simulation method to analyze the thermal behaviors, and investigated the thermal issues of 3D package using TSV (through-silicon-via) technology for mobile application. The 3D integrated package consists of up to 8 TSV memory chips and one logic chip with a interposer which has regularly embedded TSVs. Thermal performances and characteristics of glass and silicon interposers were compared. Thermal characteristics of logic and memory chips are also investigated. The effects of numbers of the stacked chip, size of the interposer and TSV via on the thermal behavior of 3D package were investigated. Numerical analysis of the junction temperature, thermal resistance, and heat flux for 3D TSV package was performed under normal operating and high performance operation conditions, respectively. Based on the simulation results, we proposed an effective integration scheme of the memory and logic chips to minimize the temperature rise of the package. The results will be useful of design optimization and provide a thermal design guideline for reliable and high performance 3D TSV package.

• Korean Journal of Food Science and Technology
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• v.31 no.2
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• pp.441-447
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• 1999

Changes in flavor characteristics of roasted coffee in 6 package models during storage were investigated by GC/MS analysis and sensory evaluation to establish the criteria of the shelf-life of the roasted coffee in three flavor quality-'fresh', 'satisfying' and 'minimally acceptable' levels. In direct headspace method of GC/MS, 47 volatile compounds were analyzed and the light volatile compounds were reduced sharply at initial stage of storage and faster in the package with air. The correlation between % retention of 2,3-butanedione and overall aroma of roasted coffee showed good linear-relation, of which correlation coefficient (R) were from 0.999 to 0.904 depending on package models, indicating that 2,3-butanedione would be an index chemical for evaluating the freshness of roasted coffee. In sensory evaluation of 6 package models during storage, roasted whole beans (RB) and roasted and ground (RG) coffee in air-package were preserved in 'fresh quality' for $0.5{\sim}1$ week, 'satisfying quality' for $2{\sim}3$ weeks and 'minimally acceptable quality' for 12 weeks, while roasted whole beans in valve-package and roasted and ground coffees in vacuum-package, nitrogen-package and oxygen absorbent-package were preserved in 'fresh quality' for $2{\sim}4$ weeks, 'satisfying quality' for $12{\sim}24$ weeks and 'minimally acceptable quality' for 52 weeks. The oxygen absorbent-package was slightly less effective than other three methods.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.4
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• pp.401-409
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• 2009

This paper presents a method of calculating the stress intensity factor (K) and crack propagation direction (${\theta}_0$) at the crack-tip that is associated with delamination in the large scale integration(LSI) package. To establish a reasonable strength evaluation method and life prediction, it is necessary to assess fracture parameters under various fracture conditions. Therefore, we conducted quantitative stress singularity analysis considering thermal stress simulating the changes of crack length (a), (h) and (v) in delamination using the 2-dimensional elastic boundary element method (BEM), and from these results predicted crack propagation direction and path.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.75-81
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• 2015

In this paper, numerical analysis by finite element method and parameter design by the Taguchi method were used to reduce warpage of a two passive components embedded double side substrate for PoP(Package on Package). The effect of thickness of circuit layers (L1, L2) and thickness of solder resist (SR_top, SR_BTM) were analyzed with 4 variations and 3 levels(minimum, average and maximum thickness) to find optimized thickness conditions. Also, paste effect of solder resist on unit area of top surface was analyzed. Finally, experiments was carried out to prove numerical analysis and the Taguchi method. Based on the numerical and experimental results, it was known that circuit layer in ball side of substrate was the most severe determining deviation for reducing warpage. Buried circuit layer in chip side, solder resist and were insignificant effects on warpage relatively. However, warpage decreased as circuit layer in ball side thickness increased but effect of solder resist and circuit layer in chip side thickness were conversely.

• Korean Journal of Adult Nursing
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• v.13 no.3
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• pp.385-396
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• 2001

The purpose of this study is to present an actual example for procedures for developing a PBL package based on philosophical backgrounds derived from Problem-based learning. To perform a systemic study on the operations of an intergrated curricula under multidisciplines, a research team made up of several professors with different academic backgrounds was formed. Among the four situations for the patients with perception-adjustment disorder, especially a procedure for the development of PBL package which can be used in the emergency room situation has been proposed. The little(2000)'s PBL package model has been applied for this study. Tha package includes course objectives, learning objectives, concept map, situation scenario, tutor guide, and evaluation method. It is believed that learning objectives achievement procedures designed as a part of a problem-based learning package development procedures for the nursing of patients with perception-adjustment can be achieved at the same level as the learning objectives for the science of nursing founded by the Korean Nurses Association.

• The Journal of the Korea Contents Association
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• v.13 no.6
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• pp.469-480
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• 2013

This study suggests 12 products regarding the pending question of tourism package price mechanism which is linked directly and indirectly to Jeju Tourism, and shows the following conclusions through inspection in mental accounting principles and framing effect based on prospect theory. First, when presenting the price list of the tourism package, it is needed to present in price bundling. Second, it is proven that it is desirable that information about discount prices open the individual discount information of the basic package and option package to public. Third, it is discovered that experienced tourists in purchasing tourism products are more sensitive to price information (price discount) than inexperienced tourists, so that framing effect conform to Knowledge-assembly theory. The current questions of this study are that 'no discount' information should be presented in bundling, that the method of framing is important in presenting discount product information. It is required not only to grasp the viewpoint of modern people in purchasing tourism products, but also to present ready-to-serve products which can save time, effort, cost to give stability in mental accounting principles.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of KIISE:Software and Applications
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• v.33 no.10
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• pp.836-850
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• 2006

Nowadays, due to the rapidly increasing number of package software products, quality test has been emphasized for package software products. When testing software products, one of the most important factors is to select metrics which form the bases for tests. In this paper, the types of package software are represented as characteristic vectors having probabilistic relationships with metrics. The characteristic vectors could be regarded as indicators of software type. To assign the metrics for each software type, the past test metrics are collected and analyzed. Using Bayesian belief network, the dependency relationship network of the characteristic vectors and metrics is constructed. The dependency relationship network is then used to find the proper metrics for the test of new package software products.

• The KIPS Transactions:PartD
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• v.9D no.4
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• pp.629-638
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• 2002

As the application area of software grows bigger and the importance of software quality increases, software quality evaluation method is also getting a lot of attention. To evaluate the software quality properly, we need an objective and concrete evaluation mechanism. In general, practitioners customize the international standards to their own needs for this purpose. Package software documents plat an important role in software quality evaluation because it provides the information that helps customers use the software effectively and conveniently. h great deal of efforts has been made in terms of international standards for documentation and documentation process. However, those international standards are too abstract to be applied directly to domestic software packages. In this paper, we developed a guidelines and checklists for writing and evaluating package software documents. Our research basically followed ISO 12119, ISO 9127 and some related research results. Also we proved the effectiveness of this research through actual tests with package softwares.