• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.677-683
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• 2003

Generally, heavy electronic products undergo many different types of shocks in transporting from a manufacturer to customers. Cushioning package materials are used to protect electronic products from severe shock environments. Since the mass distributions of heavy electronic products are usually unbalanced and complex, it is very difficult to design a cushioning package with haying high performance by considering only the equivalent stiffness of that. Therefore, when designing the cushioning material for a heavy electronic product, it is necessary to optimize its shape in order to maximize the cushioning performance. In this study, it is focused on designing an optimal shape of cushioning material for a large-sized refrigerator and an efficient design method is suggested by using a dynamic finite element analysis. As the results of this study, the optimal shape of cushioning material, which has high cushioning performance and minimized volume, was obtained from the drop analysis and a optimization process. From free drop tests of a refrigerator, it was identified that the cushioning performance of the optimal package were improved up to 16 % and the volume of it was reduced in a range of 22 %.

• Fashion & Textile Research Journal
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• v.25 no.3
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• pp.333-345
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• 2023

The rising demand for fashion do-it-yourself (DIY) products that cater to individual preferences and which allow for creative expression has highlighted the need for systematic organization within the clothing society. This study addresses this gap by identifying and discussing clothing DIY packages and proposes a systematic package model comprising essential raw materials, commercial patterns, and production instructions. Four key elements have been emphasized to differentiate and enhance the product. Firstly, highly practical commercial patterns have been developed to facilitate easy transformations - from blouses to dresses. Furthermore, the versatility of these patterns has been optimized so as to allow their utilization as outerwear, increasing their efficiency. Secondly, to accommodate diverse body shapes, the package offers six different sizes, providing users with a range of options tailored to their specific measurements. Thirdly, detailed production instructions are provided, supplemented by a Q&A bulletin board. The instructions are available in a printed format, featuring actual photographs on A4 paper, while video production instructions are accessible via a QR code, ensuring comprehensive guidance. Lastly, the basic package comprises clothing patterns, production instructions, fabrics, and labels, providing a complete toolkit for clothing DIY enthusiasts. This study aims to contribute to the development of the hobby sewing field and to establish a practical resource for the clothing DIY package industry.

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 2001.07a
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• pp.167-172
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• 2001

• The monthly packaging world
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• s.149
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• pp.62-65
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• 2005

• The monthly packaging world
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• s.139
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• pp.76-80
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• 2004

• Journal of the Microelectronics and Packaging Society
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• v.1 no.2
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• pp.135-142
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• 1994

• Electrical & Electronic Materials
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• v.16 no.7
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• pp.14-20
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• 2003

• The monthly packaging world
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• s.374
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• pp.59-64
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• 2024

• Journal of Ocean Engineering and Technology
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• v.17 no.2
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• pp.8-13
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• 2003

Soil, ground water, and sea bed are exposed to a continuous accumulation of polluted materials, causing serious environmental damage. It has been reported that such pollution causes a massive mortality of fish stock in rivers due to the resuspension of toxic chemicals, occurring during strong wind conditions. Therefore, it becomes apparent that there is an immediate demand for the restoration treatment of polluted river bed (or sea bed) sediment layers. Pollution levels of major rivers and ports, such as Paldang, Kyungan rivers, and Masan port, are becoming of great public concern, and are posing a serious environmental threat. In particular, the pollution of the Shi-hwa river has become a nation wide issue for the last few years. In spite of such public concern, the pollution levels of such rivers or ports are worsening everyday. In this study, an environmentally sound engineering package is introduced that helps to restore the polluted river bed or sea bed sediments. This engineering package consists of a suction facility, followed by a series of mechanical, chemical, and biological treatment units. The suction facility is designed to minimize secondary pollution that occurs from the resuspension of toxic materials during suction. The sea bed cleaning engineering package is designed to be installed on the top of a floating barge. Such a combination of environmental plant and shipbuilding technology provides a cost-effective solution, minimizing the transportation between suction and treatment facilities.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).