Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 1 Issue 2
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- Pages.135-142
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- 1994
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
A New Manufacturing Route of W-Cu Heat Sink Materials for the Hermetric Microelectronic Package
Hermetic 마이크로 전자 패키지용 W-Cu 방열재료의 새로운 제조방안
Abstract
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