• Proceedings of the KIEE Conference
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• 2005.10a
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• pp.109-112
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• 2005

The main purpose of this study is to prepare an outline for developing of the module-type text-book system on the customize curriculum management and Contents Systems that achieve self-study systems to make the students adopt themselves into new study atmosphere and maximize the result of study on Osan college in Electric-Electronic field. Questionnaire posed to analyze the demand of teaching materials to the students, and professors and also to find characteristics of students in Osan college. The SPSSWIN/PC+ statistics package was used to assay the collected answers. And simple frequency with percentage, average, and standard deviation were calculated to check the entire trend and actual state of teaching. Therefore, the improvement of the existing teaching materials was demanded while the fundamental ability to study of general students is declining. Consequently, it is necessary to introduce new teaching materials which are simple, easy, and organized to offer the students study desire and interest.

• Journal of Information Display
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• v.2 no.4
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• pp.34-38
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• 2001

We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Fashion & Textile Research Journal
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• v.11 no.2
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• pp.262-270
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• 2009

The objectives of this study were to investigate university students' knowledge and expectation of functional materials for apparel and to examine how the knowledge and expectations affect their behavioral intention. For this purpose, a questionnaire survey was conducted. 500 questionnaires were distributed to the students and 409 questionnaires were used for data analysis. The data were analyzed by frequency, factor analysis, reliability analysis, regression analysis and ANOVA, using SPSS 12.0 package. As the results, it showed that the knowledge related to functional materials for apparel was medium level. Brand knowledge among the objective knowledge of functional materials for apparel revealed to have a lower level than the knowledge of clothing materials, product, use and wash & care. The level of self-evaluation knowledge among subjective knowledge appeared to be lower than the one of experience related knowledge. As the correlation coefficient of objective knowledge and subjective knowledge was low, it was thought that both of them must be considered in studying on consumer knowledge. It showed that the university students' expectation of functional materials for apparel was composed of physiological and physical aspects, social and psychological aspects, and practical and aesthetic aspects. The expectation was revealed to be generally high. However, the level of expectation to the practical and aesthetic aspects was lower than those of other aspects. University students' knowledge and expectation were found to have influence on their behavioral intention. In other words, it showed that the higher university students' knowledge level and expectation level were, the bigger behavioral intention was.

• Journal of Korea Foundry Society
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• v.20 no.4
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• pp.254-259
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• 2000

Metal matrix composites(MMCs) reinforced with hard particles have many potential application in aerospace structures, auto parts, semiconductor package, heat resistant panels, wear resistant materials and so on. In this work, the effect of SiC partioel sizes(50 and 100 ${\mu}m$) and additional elements such as Si, Cu and Ti on the microstructure and the wear property of $Al-5Mg-X(Si,Cu,Ti)/SiC_p$ composites produced by pressureless infiltration method have been investigated using optical microscopy, scanning eletron microcopy(SEM) with EDS(energy dispersive spectrometry), hardness test, X-ray diffractometer(XRD) and wear test. In present study, the sound $Al-5Mg-X(Si,Cu,Ti)/SiC_p$(50 and 100 ${\mu}m$) composites were fabricated by pressureless infiltration method. The $Al-5Mg-0.3Si-O.1Cu-O.1Ti/SiC_p$ composite with $50 {\mu}m$ size of SiC particle has higher hardness and better wear property than any other composite with $100{\mu}m$ size of SiC particle produced by pressureless infiltration method. The hardness and wear property of $Al-5Mg/SiC_p$(50 and 100 ${\mu}m$) composites were enhanced by the addition of Si, Cu and Ti in Al-5%Mg matrix alloy.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.36-36
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• 2007

본 논문에서는 SoP-L(System on Package-Laminates) 기술을 이용하여 이종의 유전율을 가진 유기물 적층 기반의 수동소자를 이용한 GSM/DCS 대역 분리용 diplexer를 설계, 제작하였고 그 특성을 고찰하였다. SoP-L 기술은 LTCC기술과 같은 타 SoP 기술과 비교해서 이종의 물질을 접합하는데 용이하고 공정비용이 저렴하다. 이러한 장점을 이용하여 캐때시터는 유전율 40의 고유전율 재료를 사이에 두고 구성하였고, 인덕터 부문에는 유전율 4률 적용, 정방혈 스파이럴 구조로 두 개 층으로 구성하여 소형화를 이룰 수 있었다. 제작 시에 구리와 유기물을 적층, patterning 하였고, 수직 via hole 을 형성하고 구리의 무전해, 전해 도금 과정을 거쳐 각 소자를 연결하였다. 이러한 과정을 거쳐 제작된 diplexer의 GSM 저역 통과 필터는 0.52 dB이하의 삽입손실과 20 dB 이상의 반사손실을 가지고 DCS 통과 대역 부근에 notch 가 존재하도록 설계함으로써 DCS 통과 대역에서 17 dB 이상의 저지특성을 나타내었다. DCS 고역 통과 필터는 1.2 dB 이하의 삽입손실과 16 dB 이상의 반사손실을 가지며 GSM 통과 대역 부근에 notch를 가지도록 설계하여 GSM 통과대역에서 32 dB 이상의 저지특성을 나타내었다.

• Transactions of the KSME C: Technology and Education
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• v.3 no.4
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• pp.265-271
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• 2015

The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.4
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• pp.152-159
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• 2014

Urea solution as a reductant of SCR has been widely used to reduce NOx emissions from diesel engine. But it has lots of problems which are freezing at low temperature due to liquid state, deposition of solid formation in the exhaust, dosing device, and complex package such as mixers for uniform concentration of ammonia. In order to overcome these obstacle, ammonium carbonate which is one of solid ammonium materials to produce ammonia gas directly by sublimation process is considered. Simple reactor with visible widow was designed to predict equilibrium temperature and pressure of ammonium carbonate. To simulate real operation conditions under automobile environment, several cycles of heating and cooling condition were settled, two different re-solidification materials were extracted from the reactor and visible window. Analytical study is performed to characterize these unknown materials by XRD(X-Ray Diffraction), FT-IR(Fourier Transform Infrared Spectroscopy), and EA(Elemental Analyzer). From analytical results, re-solidification materials from heating and cooling cycles are very similar to original material of ammonium carbonate.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.2
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• pp.115-122
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• 2012

Sound packages and damping materials have been widely applied on the floor to decrease the interior noise of a vehicle. Based on the previous researches on the low-noise vehicles, weight optimization through minimization of damping material usage is required while decreasing mid and high frequency range noise by application of sound packages. This paper describes the analysis process of robust design of vehicle body structure before applying damping materials and focuses on the analysis and test process of the location optimization at the stage of damping material application. A vibration experiment for the analysis of floor panel velocity with respect to the excitation of suspension attachment parts at the underfloor of a vehicle is performed. And through the improvement correlation between FEA and TEST, a design guide to optimize damping materials application in the early design stage is proposed. A research on vibration damping steel sheets and liquid acoustic spray on deadener(LASD) is performed to minimize manufacturing time and to minimize the space for pre-existing asphalt damping materials. As results of this study, panel stiffness is achieved through curved surface panel and bead optimization. And test baseline of optimum design is suggested through damping material optimization. And finally, through re-establishing the analysis process for vibration reduction of vehicle floors and lightweight design of damping materials, it is possible to design damping materials efficiently in the preceding stage of design.