• Korean Journal of Materials Research
• /
• v.25 no.9
• /
• pp.450-454
• /
• 2015

A simulation method to estimate microstructure dependent material properties and their influence on performance for a honeycomb structured SiC heating element has been established. Electrical and thermal conductivities of a porous SiC sample were calculated by solving a current continuity equation. Then, the results were used as input parameters for a finite element analysis package to predict temperature distribution when the heating element was subjected to a DC bias. Based on the simulation results, a direction of material development for better heating efficiency was found. In addition, a modified metal electrode scheme to decelerate corrosion kinetics was proposed, by which the durability of the water heating system was greatly improved.

• Korean Journal of Metals and Materials
• /
• v.48 no.11
• /
• pp.1028-1034
• /
• 2010

In the development of 3D package, through silicon via (TSV) formation technology by using deep reactive ion etching (DRIE) is one of the key processes. We performed the Bosch process, which consists of sequentially alternating the etch and passivation steps using $SF_6$ with $O_2$ and $C_4F_8$ plasma, respectively. We investigated the effect of changing variables on vias: the gas flow time, the ratio of $O_2$ gas, source and bias power, and process time. Each parameter plays a critical role in obtaining a specified via profile. Analysis of via profiles shows that the gas flow time is the most critical process parameter. A high source power accelerated more etchant species fluorine ions toward the silicon wafer and improved their directionality. With $O_2$ gas addition, there is an optimized condition to form the desired vertical interconnection. Overall, the etching rate decreased when the process time was longer.

• Preventive Nutrition and Food Science
• /
• v.14 no.4
• /
• pp.349-353
• /
• 2009

The effects of packaging materials on preserving the functional component of pine bud beverage stored under UV (ultraviolet) light exposure conditions were studied. The order of UV light blocking properties of the selected packages was: opaque can> opaque PET (polyethylene terepthalate) with green lamination=transparent PET with 10% PEN (polyethylene naphthalate) blending> transparent PET, and did not depend on film thickness in specified range. At 20${^{\circ}C}$, the order of preserving degree of original color and endobornyl acetate, which is quality index of pine bud beverage, was the same as above. Exposure to UV light can cause of deterioration of functional food components, but green color lamination and blending of PEN materials with transparent PET help to preserve the UV sensitive pine bud beverage components. However, the treated PET bottles have poorer preservation capabilities than the opaque cans. Transparent PET with PEN blending, in particular, will be very useful packaging material for colorful functional beverage preservation by helping to protect the ingredients while attracting consumer attention.

• Journal of Welding and Joining
• /
• v.13 no.2
• /
• pp.82-95
• /
• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1999.05a
• /
• pp.9-19
• /
• 1999

A clad material is a different type of the typical composites which is composed of two or more materials joined at their interface surface. The advantage of clad material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneouly. This paper is concerned with the direct and indirect extrusion process of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copper-clad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and moan stress for some sheath thicknesses, die exit diameters and die temperatures.

• Journal of Environmental Health Sciences
• /
• v.8 no.1
• /
• pp.25-30
• /
• 1982

The incidence of hospital infection has been seriously increased in the general hospital in recent years. This study was performed on hospital air and materials in a General Hospital in Seoul from June to December in 1980. The results were as follows: 1. Air sampling was done in multiple strategic areas by exposing standard petridishes for 5 minutes. There was a significant difference of airborne microbe between places. ($F._{99}$ = 3.2, p < 0.01). 2. The mean colony count was 8.6$\pm$6.2 colonies / plate / 5 minutes. 3. Gram stains of colony in air sampling were Gram (+) cocci 66.5%. Gram (+) rod 18.4%, Gram (-) cocci 1.3%, Gram (-) rod 8.7% Fungus 4.5%. 4. For the evaluation of sterilization of steam sterilizer and ethylene oxide gas sterilizer, biological monitoring were done by commercial spore strip. Positive culture was obtained in 2 out of 41 tests on 3 steam sterilizers, and in 3 out of 13 tests on ethylene oxide gas sterilizer. 5. Product sampling and culture were done for 2 kinds of disinfectants and 30 sets of various operation package or dressing materials. Positive culture was obtained in one disinfectants.

• Proceedings of the IEEK Conference
• /
• 2006.06a
• /
• pp.597-598
• /
• 2006

This paper describes a development of a new $1.4{\times}1.1$ and $2.0{\times}1.4mm$ RF SAW filters made by PCB substrate instead of HTCC package, and this technology can reduce the cost of materials down to 40%. We have investigated the multi-layered PCB substrate structures and raw materials to find out the optimal flip-bonding condition between the $LiTaO_3$ wafer and PCB substrates. Also the optimal materials and processing conditions of epoxy laminating film were found out through the experiments which can reduce the bending moment caused by the difference of the thermal expansion between the PCB substrate and laminating film. The new PCB SAW filter shows good electrical and reliability performances with respect to the present SAW filters.

• Korean Journal of Optics and Photonics
• /
• v.18 no.4
• /
• pp.264-269
• /
• 2007

Today's research has been focused on changing the light source from filament to LED for luminarie illumination to overcome the shortcoming of a filament. The purpose of this research is to make an appropriate high power LED package structure for luminarie. We simulated radiation patterns of the various structures by the ray tracing simulator (Light Tools), and also analyzed the radiation patterns using an LED test system (OL770). As we increased an inner reflector angle, the radiation pattern split into two peaks and the angle between two peaks became larger. In addition, when we increased an outer reflector angle, the angle between side peaks gradually decreased, while it increased again when the angle reach $50^{\circ}$. These results could be understood from the ray tracing of the light reflected from two reflectors. We made the high power LED package for luminarie on the condition of the optimized structure which was made by ray tracing simulation results, and we measured the radiation patterns by using an LED test system, and these results were well matched to the simulation results.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.81-88
• /
• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Journal of the Korean Ceramic Society
• /
• v.44 no.3 s.298
• /
• pp.157-161
• /
• 2007

Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.